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1. 发明申请

US20100015507A1 POROUS TITANIUM HAVING LOW CONTACT RESISTANCE 有权
标题翻译：具有低接触电阻的多孔钛
公开(公告)号：US20100015507A1
公开(公告)日：2010-01-21
申请号：US12518509
申请日：2007-12-13
申请人： Kenji Orito , Toshiharu Hayashi , Masahiro Wada , Reiko Izumi , Koji Hoshino
发明人： Kenji Orito , Toshiharu Hayashi , Masahiro Wada , Reiko Izumi , Koji Hoshino
IPC分类号： H01M4/02
CPC分类号： H01M4/8807 , C23C24/087 , C23C28/042 , C23C28/048 , H01M4/8817 , H01M4/90 , H01M8/0232 , H01M8/0241 , H01M8/0245 , H01M2008/1095 , Y10S977/762 , Y10S977/81 , Y10S977/811 , Y10T428/12479 , Y10T428/12806 , Y10T428/12889
摘要： Porous titanium having a low contact resistance includes porous titanium body, Au, and a Ti oxide layer (3). Porous titanium includes continuous holes (1) opening on a surface and being connected to inner holes and a skeleton (2). Au adheres to at least an outer skeletal surface (4) of the porous titanium via diffusion bonding to form a network structure. The Ti oxide layer (3) is formed in a clearance between adjacent Au codes (5) of the Au network sticking. The width of an Au code (5) of the Au network is 0.3 to 10 μm at least at one position; and the thickness of the Ti oxide layer (3), which is formed in the clearance between adjacent Au codes (5) of the Au network is 30 to 150 nm.
摘要翻译：具有低接触电阻的多孔钛包括多孔钛体，Au和Ti氧化物层（3）。多孔钛包括在表面上开口并连接到内孔的连续孔（1）和骨架（2）。 Au通过扩散接合附着于多孔钛的至少外骨骼表面（4）以形成网络结构。 Ti氧化物层（3）形成在Au网络粘附的相邻Au代码（5）之间的间隙中。 Au网络的Au码（5）的宽度至少在一个位置为0.3〜10um; 并且在Au网络的相邻Au代码（5）之间的间隙中形成的Ti氧化物层（3）的厚度为30〜150nm。

2. 发明授权

US07794853B2 Porous titanium having low contact resistance 有权
标题翻译：具有低接触电阻的多孔钛
公开(公告)号：US07794853B2
公开(公告)日：2010-09-14
申请号：US12518509
申请日：2007-12-13
申请人： Kenji Orito , Toshiharu Hayashi , Masahiro Wada , Reiko Izumi , Koji Hoshino
发明人： Kenji Orito , Toshiharu Hayashi , Masahiro Wada , Reiko Izumi , Koji Hoshino
IPC分类号： B32B15/01 , B32B15/02 , B32B15/04 , B32B18/00
CPC分类号： H01M4/8807 , C23C24/087 , C23C28/042 , C23C28/048 , H01M4/8817 , H01M4/90 , H01M8/0232 , H01M8/0241 , H01M8/0245 , H01M2008/1095 , Y10S977/762 , Y10S977/81 , Y10S977/811 , Y10T428/12479 , Y10T428/12806 , Y10T428/12889
摘要： Porous titanium having a low contact resistance includes porous titanium body, Au, and Ti oxide layer (3). Porous titanium includes continuous holes (1) opening on a surface and being connected to inner holes and a skeleton (2). Au adheres to at least an outer skeletal surface (4) of the porous titanium via diffusion bonding to form a network structure. The Ti oxide layer (3) is formed in a clearance between adjacent Au cords (5) of the Au network sticking. The width of an Au cord (5) of the Au network is 0.3 to 10 μm at least at one position; and the thickness of the Ti oxide layer (3), which is formed in the clearance between adjacent Au cords (5) of the Au network is 30 to 150 nm.
摘要翻译：具有低接触电阻的多孔钛包括多孔钛体，Au和Ti氧化物层（3）。多孔钛包括在表面上开口并连接到内孔的连续孔（1）和骨架（2）。 Au通过扩散接合附着于多孔钛的至少外骨骼表面（4）以形成网络结构。 Ti氧化物层（3）形成在Au网络粘附的相邻Au电线（5）之间的间隙中。 Au网络的Au线（5）的宽度至少在一个位置为0.3至10μm; 并且在Au网络的相邻Au线（5）之间的间隙中形成的Ti氧化物层（3）的厚度为30〜150nm。

3. 发明授权

US06423422B1 High strength spongy sintered metal composite sheet and production method thereof 有权
公开(公告)号：US06423422B1
公开(公告)日：2002-07-23
申请号：US09288286
申请日：1999-04-08
申请人： Masahiro Wada , Yoshitaka Mayuzumi , Koji Hoshino , Saburou Wakita
发明人： Masahiro Wada , Yoshitaka Mayuzumi , Koji Hoshino , Saburou Wakita
IPC分类号： B32B324
摘要： A high strength spongy sintered metal composite sheet comprising a porous spongy sintered metal layer having continuous holes, and a high strength sintered, dense metal reinforcing layer having a porosity smaller than the porosity of the spongy sintered metal layer, laminated thereon, wherein the sintered, dense metal reinforcing layer has a thickness of 0.5-30% thickness with respect to the entire high strength spongy sintered metal composite sheet.

4. 发明授权

US09272922B2 Inorganic iodide, production method thereof, and production system thereof 有权
标题翻译：无机碘化物及其制造方法及其制造方法
公开(公告)号：US09272922B2
公开(公告)日：2016-03-01
申请号：US12864746
申请日：2009-01-29
申请人： Satoshi Kanbe , Kazumi Hosono , Masahiro Wada
发明人： Satoshi Kanbe , Kazumi Hosono , Masahiro Wada
IPC分类号： C01B9/06 , C01D3/12 , C01C1/16 , C01F11/20 , B01J23/42
CPC分类号： C01D3/12 , B01J23/42 , C01B9/06 , C01C1/168 , C01F11/20 , C01P2006/80
摘要： According to a method for producing an inorganic iodide in accordance with the present invention, it is possible to efficiently produce a highly pure inorganic iodide by reacting a hydrogen iodide gas with an inorganic base compound by bringing the hydrogen iodide gas into contact with the inorganic base compound. As such, it is possible to provide a simple and efficient method for producing an inorganic iodide.
摘要翻译：根据本发明的无机碘化物的制造方法，通过使碘化氢气体与无机碱接触，可以通过使碘化氢气体与无机碱性化合物反应而高效地制造高纯度的无机碘化物复合。因此，可以提供一种用于生产无机碘化物的简单有效的方法。

5. 发明授权

US08653205B2 Resin composition for encapsulating semiconductor and semiconductor device 失效
标题翻译：用于封装半导体和半导体器件的树脂组合物
公开(公告)号：US08653205B2
公开(公告)日：2014-02-18
申请号：US13255571
申请日：2010-03-02
申请人： Masahiro Wada
发明人： Masahiro Wada
IPC分类号： C08K3/36 , C08L63/00 , C08L63/02 , H01L23/29
CPC分类号： H01L23/3128 , C08G59/621 , C08L63/00 , H01L21/565 , H01L23/295 , H01L23/3107 , H01L23/49513 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/1301 , H01L2924/14 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/20753
摘要： Disclosed is a resin composition for encapsulating a semiconductor containing an epoxy resin (A), a curing agent (B), and an inorganic filler (C), wherein the epoxy resin (A) includes an epoxy resin (A1) having a predetermined structure, and the curing agent (B) includes a phenol resin (B1) having a predetermined structure, wherein the content of a c=1 component included in the total amount of the phenol resin (B1) is not less than 40% in terms of area percentage and the content of a C≧4 component is not more than 20% in terms of area percentage, as measured by the area method of gel permeation chromatography. Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.
摘要翻译：公开了一种用于封装含有环氧树脂（A），固化剂（B）和无机填料（C）的半导体的树脂组合物，其中环氧树脂（A）包括具有预定结构的环氧树脂（A1），固化剂（B）含有具有规定结构的酚醛树脂（B1），其中包含在酚醛树脂（B1）总量中的ac = 1成分的含量以面积计不小于40％百分数，C> = 4组分的含量以面积百分比计不超过20％，如通过凝胶渗透色谱法的面积法测量的。还公开了通过将半导体元件与用于封装半导体的树脂组合物的固化物封装而获得的半导体器件。

6. 发明授权

US08629556B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08629556B2
公开(公告)日：2014-01-14
申请号：US11885404
申请日：2007-04-20
申请人： Mitsuo Sugino , Takeshi Hosomi , Masahiro Wada , Masataka Arai
发明人： Mitsuo Sugino , Takeshi Hosomi , Masahiro Wada , Masataka Arai
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/563 , H01L21/6835 , H01L23/293 , H01L24/16 , H01L2221/68345 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/30105 , H01L2924/00 , H01L2224/0401
摘要： The semiconductor device 1 includes a substrate 3, a semiconductor chip 4 mounted on the substrate 3, the substrate 3, a bump 5 connecting the substrate 3 and the semiconductor chip 4, and an underfill 6 filling in around the bump 5. In the case of a bump 5 composed of a high-melting-point solder having a melting point of 230° C. or more, the underfill 6 is composed of a resin material having an elastic modulus in the range of 30 MPa to 3000 MPa. In the case of a bump 5 composed of a lead-free solder, the underfill 6 is composed of a resin material having an elastic modulus in the range of 150 MPa to 800 MPa. An insulating layer 311 of buildup layers 31 of the substrate 3 has a linear expansion coefficient of 35 ppm/° C. or less in the in-plane direction of the substrate at temperatures in the range of 25° C. to the glass transition temperature.
摘要翻译：半导体器件1包括基板3，安装在基板3上的半导体芯片4，基板3，连接基板3和半导体芯片4的凸块5以及填充在凸块5周围的底部填充6。由熔点为230℃以上的高熔点焊料构成的凸块5由底部填充材料6构成，其弹性模量为30MPa〜3000MPa的范围。在由无铅焊料构成的突起5的情况下，底部填充物6由弹性模量在150MPa〜800MPa的范围内的树脂材料构成。基板3的堆积层31的绝缘层311在25℃的温度范围内的基板的面内方向的线膨胀系数为35ppm /℃以下，玻璃化转变温度。

7. 发明授权

US08502399B2 Resin composition for encapsulating semiconductor and semiconductor device 失效
标题翻译：用于封装半导体和半导体器件的树脂组合物
公开(公告)号：US08502399B2
公开(公告)日：2013-08-06
申请号：US13376553
申请日：2010-06-16
申请人： Masahiro Wada
发明人： Masahiro Wada
IPC分类号： H01L23/29
CPC分类号： H01L23/295 , C08G59/245 , C08G59/3218 , C08G59/621 , C08G2261/3424 , C08K3/013 , C08L63/00 , C08L65/00 , C09J163/00 , H01L23/3107 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48245 , H01L2224/48247 , H01L2224/73265 , H01L2924/01012 , H01L2924/01019 , H01L2924/10253 , H01L2924/1301 , H01L2924/14 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , C08L2666/22 , H01L2924/00012 , H01L2924/00 , H01L2924/20752 , H01L2924/00014
摘要： Disclosed is a resin composition for encapsulating a semiconductor containing a curing agent, an epoxy resin (B) and an inorganic filler (C), wherein the curing agent is a phenol resin (A) having a predetermined structure. Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.
摘要翻译：公开了一种用于封装含有固化剂，环氧树脂（B）和无机填料（C）的半导体的树脂组合物，其中固化剂是具有预定结构的酚醛树脂（A）。还公开了通过将半导体元件与用于封装半导体的树脂组合物的固化物封装而获得的半导体器件。

8. 发明申请

US20130015600A1 APPARATUS FOR PRODUCING POROUS BODY AND METHOD FOR PRODUCING POROUS BODY 有权
标题翻译：用于生产多孔体的装置和生产多孔体的方法
公开(公告)号：US20130015600A1
公开(公告)日：2013-01-17
申请号：US13625560
申请日：2012-09-24
申请人： Tetsuji Tsujimoto , Takumi Shibuya , Hiroki Ueno , Sakae Akiyama , Masahiro Wada
发明人： Tetsuji Tsujimoto , Takumi Shibuya , Hiroki Ueno , Sakae Akiyama , Masahiro Wada
IPC分类号： B29C44/02
CPC分类号： B22F3/1125 , B22F3/003 , B22F5/006
摘要： An apparatus for producing a porous body that forms an expandable slurry containing at least inorganic powder, a foaming agent, and a binder into a sheet, causes the expandable slurry sheet to be foamed and baked, and thereby produces the porous body, the apparatus includes: a mixer preparing the expandable slurry by containing inorganic powder, a foaming agent, and a binder; a die-coater that has a discharge opening which discharges the expandable slurry provided from the mixer to an external thereof so as to shape the expandable slurry into a sheet; and a carrier sheet arranged so as to face the discharge opening of the die-coater with a gap interposed therebetween, and feeding the expandable slurry discharged from the discharge opening, wherein a flow path of the expandable slurry from inside the mixer to the discharge opening of the die-coater is hermetically sealed from an outside.
摘要翻译：一种用于制造多孔体的装置，其形成至少含有无机粉末，发泡剂和粘合剂的片材的可膨胀浆料，使可膨胀浆料片发泡和烘烤，从而产生多孔体，该装置包括：通过含有无机粉末，发泡剂和粘合剂制备可膨胀浆料的混合机; 具有将从混合器提供的可膨胀浆料排出到其外部的排出口的模涂机，以将可膨胀浆料成形为片材; 以及载体片，其布置成与所述模具涂布机的排出口面对并间隔开，并且从所述排出口排出的所述可膨胀浆料供给，所述可膨胀浆料从所述混合器内部到所述排出口的涂布机与外部气密密封。

9. 发明授权

US08303284B2 Apparatus for producing porous body and method for producing porous body 有权
标题翻译：多孔体制造装置及多孔体的制造方法
公开(公告)号：US08303284B2
公开(公告)日：2012-11-06
申请号：US12446625
申请日：2007-10-23
申请人： Tetsuji Tsujimoto , Takumi Shibuya , Hiroki Ueno , Sakae Akiyama , Masahiro Wada
发明人： Tetsuji Tsujimoto , Takumi Shibuya , Hiroki Ueno , Sakae Akiyama , Masahiro Wada
IPC分类号： B29C44/16
CPC分类号： B22F3/1125 , B22F3/003 , B22F5/006
摘要： An apparatus for producing a porous body that forms an expandable slurry containing at least inorganic powder, a foaming agent, and a binder into a sheet, causes the expandable slurry sheet to be foamed and baked, and thereby produces the porous body, the apparatus includes: a mixer preparing the expandable slurry by containing inorganic powder, a foaming agent, and a binder; a die-coater that has a discharge opening which discharges the expandable slurry provided from the mixer to an external thereof so as to shape the expandable slurry into a sheet; and a carrier sheet arranged so as to face the discharge opening of the die-coater with a gap interposed therebetween, and feeding the expandable slurry discharged from the discharge opening, wherein a flow path of the expandable slurry from inside the mixer to the discharge opening of the die-coater is hermetically sealed from an outside.
摘要翻译：一种用于制造多孔体的装置，其形成至少含有无机粉末，发泡剂和粘合剂的片材的可膨胀浆料，使可膨胀浆料片发泡和烘烤，从而产生多孔体，该装置包括：通过含有无机粉末，发泡剂和粘合剂制备可膨胀浆料的混合机; 具有将从混合器提供的可膨胀浆料排出到其外部的排出口的模涂机，以将可膨胀浆料成形为片材; 以及载体片，其布置成与所述模具涂布机的排出口面对并间隔开，并且从所述排出口排出的所述可膨胀浆料供给，所述可膨胀浆料从所述混合器内部到所述排出口的涂布机与外部气密密封。

10. 发明授权

US08227424B2 Collagen peptide, dipeptide and malady inhibitor 有权
公开(公告)号：US08227424B2
公开(公告)日：2012-07-24
申请号：US12443298
申请日：2008-11-14
申请人： Fumihito Sugihara , Naoki Inoue , Seiko Koizumi , Chinfang Liu , Hajime Takasaki , Hisayuki Kobayashi , Hiroshi Mano , Sachie Nakatani , Masahiro Wada
发明人： Fumihito Sugihara , Naoki Inoue , Seiko Koizumi , Chinfang Liu , Hajime Takasaki , Hisayuki Kobayashi , Hiroshi Mano , Sachie Nakatani , Masahiro Wada
IPC分类号： A61K38/05 , A61P10/02
CPC分类号： C07K5/06139 , A61K38/05 , C07K5/06165
摘要： A problem that the present invention is to solve is to provide: a main body of a peptide molecule which is effective for inhibition of various maladies such as osteoporosis, osteoarthritis and pressure ulcer, particularly, a dipeptide which is easy to absorb into a body in an intestine; a collagen peptide which comprises the dipeptide as an essential dipeptide; and a malady inhibitor which comprises the dipeptide as an essential effective component. As a means of solving such a problem, a collagen peptide according to the present invention is characterized by comprising a dipeptide having a structure of Hyp-Gly as an essential dipeptide. A dipeptide according to the present invention is characterized by having a structure of Hyp-Gly. A malady inhibitor according to the present invention is characterized by comprising a dipeptide having a structure of Hyp-Gly as an essential effective component.

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