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    • 1. 发明授权
    • Harness producing apparatus and method
    • 线束产生装置及方法
    • US4862587A
    • 1989-09-05
    • US158287
    • 1988-02-19
    • Kenji NakataKyo TomonariTakeo Yamanaka
    • Kenji NakataKyo TomonariTakeo Yamanaka
    • H01R43/048H01R43/05H01R43/052H01R43/055
    • H01R43/048H01R43/05H01R43/052H01R43/055Y10T29/49192Y10T29/49201Y10T29/514Y10T29/5142Y10T29/53235
    • A wire harness is produced by attaching terminals to one of the respective ends of a plurality of wires and gathering the other ends and attaching a single terminal thereto. The plurality of insulated wires are intermittently fed by respective predetermined lengths along predetermined feed paths, and then cut to respective predetermined lengths to provide remaining wires and cut wire sections. The insulation on the forward ends of the remaining wires and on the rear ends of the cut wire sections, next to the cut just made, are stripped. Terminals are crimped to insulation-stripped ends of the remaining wires. The cut wire sections are transferred so that their insulation-stripped ends are gathered in one place and then the insulation-stripped ends of the cut wire sections are trued-up and a single terminal is crimped thereto to form a single terminal for the plurality of cut wire sections.
    • 通过将端子连接到多根线的各个端部之一并收集另一端并将单个端子附接到其上而制造线束。 多条绝缘线沿着预定的馈送路径间歇地进给预定的长度,然后切割成相应的预定长度,以提供剩余的线和切割线段。 其余电线前端和切割电线部分后端的绝缘材料,刚刚切割的切口被剥离。 端子被压接到剩余电线的绝缘剥离端。 切割的线段被转移,使得其绝缘剥离的端部聚集在一个位置,然后切割的线段的绝缘剥离端被修整,并且单个端子被压接到其上以形成用于多个 切割线段。
    • 2. 发明授权
    • Ozone treatment method and ozone treatment apparatus
    • 臭氧处理方法和臭氧处理装置
    • US06867150B2
    • 2005-03-15
    • US10312560
    • 2002-03-18
    • Tatsuo KikuchiTakeo YamanakaYukitaka YamaguchiTokiko Kanayama
    • Tatsuo KikuchiTakeo YamanakaYukitaka YamaguchiTokiko Kanayama
    • H01L21/00H01L21/306H01L21/31
    • H01L21/67253H01L21/67017
    • The invention concerns an ozone treatment method and an ozone treatment apparatus for performing a treatment such as the formation and reformation of an oxide film, the removal of a resist film by blowing an ozone gas onto a surface of a substrate such as a semiconductor substrate or liquid crystal substrate. The ozone treatment apparatus 1 includes: a placement table 20 on which the substrate K is placed; a heating unit for heating the substrate K placed on the placement table 20; an opposed plate 40, disposed opposite the substrate K, for discharging the ozone gas through a discharge port 44 formed in a surface facing the substrate K, a gas feeding means 43 for feeding the ozone gas into the discharge port 44; a lifter 30 for moving the placement table 20 up and down; and a control unit 35 for controlling the operation of said lifter 30. During the discharge of the ozone gas, the control unit 35 operates the lifter 30 so as to vary the spacing g between the opposed plate 40 and the substrate K placed on the placement table 20.
    • 本发明涉及一种臭氧处理方法和臭氧处理装置,用于进行诸如氧化膜的形成和重整的处理,通过将臭氧气体吹送到诸如半导体衬底的衬底的表面上去除抗蚀膜,或 液晶基板。 臭氧处理装置1包括:放置台20,放置基板K. 用于加热放置在放置台20上的基板K的加热单元; 相对的板40,与基板K相对设置,用于通过形成在与基板K相对的表面的排出口44排出臭氧气体;气体供给装置43,用于将臭氧气体供给到排出口44中; 用于上下移动放置台20的升降器30; 以及用于控制所述提升器30的操作的控制单元35.在排出臭氧气体期间,控制单元35操作升降器30,以便改变相对板40和放置在放置物上的基板K之间的间距g 表20。
    • 3. 发明授权
    • Ozone processing device
    • 臭氧处理装置
    • US07713378B2
    • 2010-05-11
    • US10890318
    • 2004-07-12
    • Tatsuo KikuchiTakeo YamanakaYukitaka YamaguchiTokiko Kanayama
    • Tatsuo KikuchiTakeo YamanakaYukitaka YamaguchiTokiko Kanayama
    • C23F1/00H01L21/306C23C16/56C23C16/02
    • H01L21/6708
    • A substrate ozone processing device includes: a substrate-carrying/heating platform; above the platform, a gas supply head made up of a main head unit bored with platform-directed vent holes, gas conduits connected at their basal ends to the gas vent holes and separated by an interspace communicating with the gas-supply-head exterior, and a plurality of coplanar facing plates perforated, top-side-to-underside, with gas-discharging through-holes receiving the distal ends of the gas conduits, and with a latticework of gaps surrounding the discharging through-holes and communicating with the interspace; and a gas supply device for supplying ozone gas to the discharging through-holes. The facing plates are of small volume such that even should heat transfer between the plates and the substrate occur, thermal equilibrium between the plates and the substrate is reached in a short time, facilitating substrate temperature management.
    • 基板臭氧处理装置包括:基板承载/加热平台; 在平台上方,由主平台导向孔组成的气体供给头,气体导管在其基端连接到排气孔,并与气体供应头外部连通的空间隔开, 以及多个面向平面的板,其顶侧到下侧,具有容纳气体管道的远端的气体排放通孔,以及围绕排放通孔的间隙的网格,并与间隙连通 ; 以及用于向排出通孔供给臭氧气体的气体供给装置。 面板的体积小,使得即使在板和基板之间发生热传递,板和基板之间的热平衡在短时间内达到,从而有助于衬底温度管理。