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1. 发明授权

US08350306B2 Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate 有权
标题翻译：配线基板中的电容器，电容器的制造方法以及布线基板
公开(公告)号：US08350306B2
公开(公告)日：2013-01-08
申请号：US12951739
申请日：2010-11-22
申请人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
发明人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
IPC分类号： H01L21/02
CPC分类号： H05K1/0231 , H01G4/228 , H01G4/30 , H01G4/38 , H01L23/49822 , H01L2924/0002 , H01L2924/3511 , H05K1/185 , H05K3/4602 , H05K2201/10712 , H01L2924/00
摘要： A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
摘要翻译：一种电容器，其具有电容器，所述电容器包括：电容器主体，包括多个电介质层和设置在所述不同电介质层之间的内部电极层，其中所述电容器本体在所述电容器主体的至少一个侧面中，从所述电容器主体的第一主面和位于与所述第一主面相反的一侧的第二主面中的至少一个在所述电容器本体的厚度方向上延伸的凹部。

2. 发明申请

US20110083794A1 CAPACITOR TO BE INCORPORATED IN WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE CAPACITOR, AND WIRING SUBSTRATE 有权
标题翻译：在配线基板中并入的电容器，制造电容器的方法和接线基板
公开(公告)号：US20110083794A1
公开(公告)日：2011-04-14
申请号：US12951895
申请日：2010-11-22
申请人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
发明人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
IPC分类号： B29C65/02
CPC分类号： H05K1/0231 , H01G4/228 , H01G4/30 , H01G4/38 , H01L23/49822 , H01L2924/0002 , H01L2924/3511 , H05K1/185 , H05K3/4602 , H05K2201/10712 , H01L2924/00
摘要： A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
摘要翻译：一种电容器，其具有电容器，所述电容器包括：电容器主体，包括多个电介质层和设置在所述不同电介质层之间的内部电极层，其中所述电容器本体在所述电容器主体的至少一个侧面中，从所述电容器主体的第一主面和位于与所述第一主面相反的一侧的第二主面中的至少一个在所述电容器本体的厚度方向上延伸的凹部。

3. 发明授权

US06795295B2 Multi-layer capacitor and method for producing the same 有权
公开(公告)号：US06795295B2
公开(公告)日：2004-09-21
申请号：US10680409
申请日：2003-10-08
申请人： Kenji Murakami , Motohiko Sato , Jun Otsuka , Manabu Sato
发明人： Kenji Murakami , Motohiko Sato , Jun Otsuka , Manabu Sato
IPC分类号： H01G4228
CPC分类号： H01G4/232 , H01G4/30
摘要： A multi-layer capacitor including a capacitor body including dielectric layers, and first and second internal electrode layers which are alternately laminated by mediation of the dielectric layers. The laminate of the first and second internal electrode layers and the dielectric layers are co-fired. The capacitor body further includes first and second electrode terminals formed on one main surface of the capacitor body. At least a single first via electrode extends through the capacitor body in the lamination direction of the capacitor body so as to connect the first electrode terminal and the first internal electrode layers, and at least a single second via electrode extends through the capacitor body in the lamination direction of the capacitor body so as to connect the second electrode terminal and the second internal electrode layers. The via electrodes have an aspect ratio of 4 to 30 as measured after firing.

4. 发明授权

US08697534B2 Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate 有权
标题翻译：配线基板中的电容器，电容器的制造方法以及布线基板
公开(公告)号：US08697534B2
公开(公告)日：2014-04-15
申请号：US13610936
申请日：2012-09-12
申请人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
发明人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
IPC分类号： H01L21/20
CPC分类号： H05K1/0231 , H01G4/228 , H01G4/30 , H01G4/38 , H01L23/49822 , H01L2924/0002 , H01L2924/3511 , H05K1/185 , H05K3/4602 , H05K2201/10712 , H01L2924/00
摘要： A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
摘要翻译：一种电容器，其具有电容器，所述电容器包括：电容器主体，包括多个电介质层和设置在所述不同电介质层之间的内部电极层，其中所述电容器本体在所述电容器主体的至少一个侧面中，从所述电容器主体的第一主面和位于与所述第一主面相反的一侧的第二主面中的至少一个在所述电容器本体的厚度方向上延伸的凹部。

5. 发明申请

US20110090615A1 CAPACITOR TO BE INCORPORATED IN WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE CAPACITOR, AND WIRING SUBSTRATE 有权
公开(公告)号：US20110090615A1
公开(公告)日：2011-04-21
申请号：US12951739
申请日：2010-11-22
申请人： Motohiko SATO , Kazuhiro Hayashi , Kenji Murakami , Motonobu Karahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
发明人： Motohiko SATO , Kazuhiro Hayashi , Kenji Murakami , Motonobu Karahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
IPC分类号： H01G4/30
CPC分类号： H05K1/0231 , H01G4/228 , H01G4/30 , H01G4/38 , H01L23/49822 , H01L2924/0002 , H01L2924/3511 , H05K1/185 , H05K3/4602 , H05K2201/10712 , H01L2924/00
摘要： A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.

6. 发明授权

US07863662B2 Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate 有权
标题翻译：配线基板中的电容器，电容器的制造方法以及布线基板
公开(公告)号：US07863662B2
公开(公告)日：2011-01-04
申请号：US11643871
申请日：2006-12-22
申请人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
发明人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
IPC分类号： H01L21/02
CPC分类号： H05K1/0231 , H01G4/228 , H01G4/30 , H01G4/38 , H01L23/49822 , H01L2924/0002 , H01L2924/3511 , H05K1/185 , H05K3/4602 , H05K2201/10712 , H01L2924/00
摘要： A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
摘要翻译：一种电容器，其具有电容器，所述电容器包括：电容器主体，包括多个电介质层和设置在所述不同电介质层之间的内部电极层，其中所述电容器本体在所述电容器主体的至少一个侧面中，从所述电容器主体的第一主面和位于与所述第一主面相反的一侧的第二主面中的至少一个在所述电容器本体的厚度方向上延伸的凹部。

7. 发明申请

US20080251285A1 CAPACITOR AND WIRING BOARD INCLUDING THE CAPACITOR 有权
标题翻译：电容器和接线板，包括电容器
公开(公告)号：US20080251285A1
公开(公告)日：2008-10-16
申请号：US12100527
申请日：2008-04-10
申请人： Motohiko Sato , Kenji Murakami , Jun Otsuka , Manabu Sato , Masahiko Okuyama , Kozo Yamazaki
发明人： Motohiko Sato , Kenji Murakami , Jun Otsuka , Manabu Sato , Masahiko Okuyama , Kozo Yamazaki
IPC分类号： H01G4/06 , H05K1/16
CPC分类号： H05K1/0231 , H01G4/232 , H01G4/30 , H01G4/33 , H01L23/50 , H01L23/642 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16265 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/01025 , H01L2924/01078 , H01L2924/09701 , H01L2924/3011 , H01L2924/3025 , H01L2924/3511 , H05K1/185 , H05K3/4602 , H05K2201/10712 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A capacitor is provided having a tough surface portion which prevents cracking that tends to occur when the capacitor is built-in or surface-mounted on a wiring board. A ceramic sintered body of the capacitor includes a capacitor forming layer portion, a cover layer portion and an interlayer portion. The capacitor forming layer portion has a laminated structure wherein ceramic dielectric layers and inner electrodes connected to a peripheral portion of capacitor via conductors, are alternately laminated. The cover layer portion is exposed at a surface portion of the ceramic body and has a laminated structure wherein ceramic dielectric layers and dummy electrodes not connected to the capacitor via conductors, are alternately laminated.
摘要翻译：提供一种电容器，其具有坚韧的表面部分，其防止当电容器内置或表面安装在布线板上时容易发生的开裂。电容器的陶瓷烧结体包括电容器形成层部分，覆盖层部分和中间层部分。电容器形成层部分具有层叠结构，其中陶瓷电介质层和连接到电容器通孔导体的周边部分的内部电极交替层叠。覆盖层部分在陶瓷体的表面部分露出，并且具有层叠结构，其中不连接到电容器通孔导体的陶瓷电介质层和虚拟电极交替层叠。

8. 发明申请

US20070145449A1 Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate 有权
标题翻译：配线基板中的电容器，电容器的制造方法以及布线基板
公开(公告)号：US20070145449A1
公开(公告)日：2007-06-28
申请号：US11643871
申请日：2006-12-22
申请人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
发明人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
IPC分类号： H01L29/94
CPC分类号： H05K1/0231 , H01G4/228 , H01G4/30 , H01G4/38 , H01L23/49822 , H01L2924/0002 , H01L2924/3511 , H05K1/185 , H05K3/4602 , H05K2201/10712 , H01L2924/00
摘要： A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
摘要翻译：一种电容器，其具有电容器，所述电容器包括：电容器主体，包括多个电介质层和设置在所述不同电介质层之间的内部电极层，其中所述电容器本体在所述电容器主体的至少一个侧面中，从所述电容器主体的第一主面和位于与所述第一主面相反的一侧的第二主面中的至少一个在所述电容器本体的厚度方向上延伸的凹部。

9. 发明申请

US20050007724A1 Multi-layer capacitor and method for producing the same 有权
标题翻译：多层电容器及其制造方法
公开(公告)号：US20050007724A1
公开(公告)日：2005-01-13
申请号：US10916546
申请日：2004-08-12
申请人： Kenji Murakami , Motohiko Sato , Jun Otsuka , Manabu Sato
发明人： Kenji Murakami , Motohiko Sato , Jun Otsuka , Manabu Sato
IPC分类号： H01G4/30 , H01G4/06 , H01G4/228 , H01G4/232 , H01L21/20 , H01L31/113
CPC分类号： H01G4/232 , H01G4/30
摘要： A multi-layer capacitor including a capacitor body including dielectric layers, and first and second internal electrode layers which are alternately laminated by mediation of the dielectric layers. The laminate of the first and second internal electrode layers and the dielectric layers are co-fired. The capacitor body further includes first and second electrode terminals formed on one main surface of the capacitor body. At least a single first via electrode extends through the capacitor body in the lamination direction of the capacitor body so as to connect the first electrode terminal and the first internal electrode layers, and at least a single second via electrode extends through the capacitor body in the lamination direction of the capacitor body so as to connect the second electrode terminal and the second internal electrode layers. The via electrodes have an aspect ratio of 4 to 30 as measured after firing.
摘要翻译：一种包括电介质层的电容器本体的多层电容器，以及通过介电层的介质交替层叠的第一和第二内部电极层。第一和第二内部电极层和电介质层的层压体共烧。电容器体还包括形成在电容器主体的一个主表面上的第一和第二电极端子。至少一个第一通孔电极沿着电容器体的层叠方向延伸穿过电容器本体，以便连接第一电极端子和第一内部电极层，并且至少一个第二通孔电极延伸穿过电容器主体电容器体的层叠方向，以连接第二电极端子和第二内部电极层。通孔电极的焙烧后测得的纵横比为4〜30。

10. 发明授权

US08304321B2 Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate 有权
标题翻译：配线基板中的电容器，电容器的制造方法以及布线基板
公开(公告)号：US08304321B2
公开(公告)日：2012-11-06
申请号：US12951895
申请日：2010-11-22
申请人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
发明人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
IPC分类号： H01L21/20
CPC分类号： H05K1/0231 , H01G4/228 , H01G4/30 , H01G4/38 , H01L23/49822 , H01L2924/0002 , H01L2924/3511 , H05K1/185 , H05K3/4602 , H05K2201/10712 , H01L2924/00
摘要： A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
摘要翻译：一种电容器，其具有电容器，所述电容器包括：电容器主体，包括多个电介质层和设置在所述不同电介质层之间的内部电极层，其中所述电容器本体在所述电容器主体的至少一个侧面中，从所述电容器主体的第一主面和位于与所述第一主面相反的一侧的第二主面中的至少一个在所述电容器本体的厚度方向上延伸的凹部。

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