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1. 发明申请

US20080090335A1 Circuit module and manufacturing method thereof 失效
标题翻译：电路模块及其制造方法
公开(公告)号：US20080090335A1
公开(公告)日：2008-04-17
申请号：US11905870
申请日：2007-10-05
申请人： Kenji Morimoto , Shigetoshi Segawa
发明人： Kenji Morimoto , Shigetoshi Segawa
IPC分类号： H01L21/50
CPC分类号： H05K1/186 , H01L23/24 , H01L23/5389 , H01L2224/16225 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/15153 , H01L2924/1517 , H05K1/0306 , H05K3/386 , H05K3/4069 , H05K3/4605 , H05K3/4614 , H05K3/4617 , H05K3/4629 , H05K3/4652 , H05K2203/061
摘要： A circuit module includes an electronic component, a ceramic multilayer substrate and a resin wiring substrate. The ceramic multilayer substrate is provided with a wiring layer disposed on top thereof and a cavity in which the electronic component is mounted, wherein a space between the electronic component and the cavity is filled with a thermosetting resin and a surface of the filled cavity is planarized. The resin wiring substrate has an insulating adhesive layer disposed at one side thereof and provided with at least one opening filled with a conductive resin. The ceramic multilayer substrate and the resin wiring substrate are bonded by the insulating adhesive layer, and the wiring layer on the ceramic multilayer substrate is electrically connected with the conductive resin.
摘要翻译：电路模块包括电子部件，陶瓷多层基板和树脂布线基板。陶瓷多层基板设置有设置在其顶部的布线层和安装有电子部件的空腔，其中电子部件和空腔之间的空间填充有热固性树脂，并且填充空腔的表面被平坦化。该树脂布线基板的一侧设置有绝缘性粘合剂层，并且设置有填充有导电性树脂的至少一个开口部。陶瓷多层基板和树脂布线基板通过绝缘粘合剂层接合，并且陶瓷多层基板上的布线层与导电树脂电连接。

2. 发明授权

US08003438B2 Circuit module and manufacturing method thereof 失效
标题翻译：电路模块及其制造方法
公开(公告)号：US08003438B2
公开(公告)日：2011-08-23
申请号：US11905870
申请日：2007-10-05
申请人： Kenji Morimoto , Shigetoshi Segawa
发明人： Kenji Morimoto , Shigetoshi Segawa
IPC分类号： H01L23/48 , H01L23/12
CPC分类号： H05K1/186 , H01L23/24 , H01L23/5389 , H01L2224/16225 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/15153 , H01L2924/1517 , H05K1/0306 , H05K3/386 , H05K3/4069 , H05K3/4605 , H05K3/4614 , H05K3/4617 , H05K3/4629 , H05K3/4652 , H05K2203/061
摘要： A circuit module includes an electronic component, a ceramic multilayer substrate and a resin wiring substrate. The ceramic multilayer substrate is provided with a wiring layer disposed on top thereof and a cavity in which the electronic component is mounted, wherein a space between the electronic component and the cavity is filled with a thermosetting resin and a surface of the filled cavity is planarized. The resin wiring substrate has an insulating adhesive layer disposed at one side thereof and provided with at least one opening filled with a conductive resin. The ceramic multilayer substrate and the resin wiring substrate are bonded by the insulating adhesive layer, and the wiring layer on the ceramic multilayer substrate is electrically connected with the conductive resin.
摘要翻译：电路模块包括电子部件，陶瓷多层基板和树脂布线基板。陶瓷多层基板设置有设置在其顶部的布线层和安装有电子部件的空腔，其中电子部件和空腔之间的空间填充有热固性树脂，并且填充空腔的表面被平坦化。该树脂布线基板的一侧设置有绝缘性粘合剂层，并且设置有填充有导电性树脂的至少一个开口部。陶瓷多层基板和树脂布线基板通过绝缘粘合剂层接合，并且陶瓷多层基板上的布线层与导电树脂电连接。

3. 发明申请

US20050017347A1 Circuit module and manufacturing method thereof 审中-公开
标题翻译：电路模块及其制造方法
公开(公告)号：US20050017347A1
公开(公告)日：2005-01-27
申请号：US10895050
申请日：2004-07-21
申请人： Kenji Morimoto , Shigetoshi Segawa
发明人： Kenji Morimoto , Shigetoshi Segawa
IPC分类号： H01L23/13 , H01L23/24 , H01L23/538 , H01L25/00 , H01L25/065 , H01L25/07 , H01L25/18 , H05K1/03 , H05K1/18 , H05K3/38 , H05K3/40 , H05K3/46 , H05K1/00
CPC分类号： H05K1/186 , H01L23/24 , H01L23/5389 , H01L2224/16225 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/15153 , H01L2924/1517 , H05K1/0306 , H05K3/386 , H05K3/4069 , H05K3/4605 , H05K3/4614 , H05K3/4617 , H05K3/4629 , H05K3/4652 , H05K2203/061
摘要： A circuit module includes an electronic component, a ceramic multilayer substrate and a resin wiring substrate. The ceramic multilayer substrate is provided with a wiring layer disposed on top thereof and a cavity in which the electronic component is mounted, wherein a space between the electronic component and the cavity is filled with a thermosetting resin and a surface of the filled cavity is planarized. The resin wiring substrate has an insulating adhesive layer disposed at one side thereof and provided with at least one opening filled with a conductive resin. The ceramic multilayer substrate and the resin wiring substrate are bonded by the insulating adhesive layer, and the wiring layer on the ceramic multilayer substrate is electrically connected with the conductive resin.
摘要翻译：电路模块包括电子部件，陶瓷多层基板和树脂布线基板。陶瓷多层基板设置有设置在其顶部的布线层和安装有电子部件的空腔，其中电子部件和空腔之间的空间填充有热固性树脂，并且填充空腔的表面被平坦化。该树脂布线基板的一侧设置有绝缘性粘合剂层，并且设置有填充有导电性树脂的至少一个开口部。陶瓷多层基板和树脂布线基板通过绝缘粘合剂层接合，并且陶瓷多层基板上的布线层与导电树脂电连接。

4. 发明申请

US20120319159A1 SUBSTRATE FOR LIGHT-EMITTING ELEMENT, METHOD FOR MANUFACTURING THE SAME AND LIGHT-EMITTING DEVICE 有权
标题翻译：用于发光元件的基板，其制造方法和发光装置
公开(公告)号：US20120319159A1
公开(公告)日：2012-12-20
申请号：US13581695
申请日：2011-02-23
申请人： Seiichi Nakatani , Tatsuo Ogawa , Kazuo Kimura , Shigetoshi Segawa
发明人： Seiichi Nakatani , Tatsuo Ogawa , Kazuo Kimura , Shigetoshi Segawa
IPC分类号： H01L33/62 , H01L21/02 , H01L29/86
CPC分类号： H01L25/167 , H01L33/486 , H01L33/54 , H01L33/641 , H01L2924/0002 , H01L2924/09701 , H01L2933/0033 , H01L2924/00
摘要： There is provided a substrate for light-emitting element, including a mounting surface on which a light-emitting element is to be mounted, the mounting surface being one of two opposed main surfaces of the substrate. The substrate of the present invention is provided with a protection element for the light-emitting element, the protection element comprising a voltage-dependent resistive layer embedded in a body of the substrate, and comprising a first electrode and a second electrode each of which is in connection with the voltage-dependent resistive layer wherein the light-emitting element is to be mounted such that it is positioned in an overlapping relation with the voltage-dependent resistive layer.
摘要翻译：提供了一种用于发光元件的基板，其包括安装有发光元件的安装表面，该安装表面是基板的两个相对的主表面之一。本发明的基板设置有用于发光元件的保护元件，该保护元件包括嵌入在该基板本体中的依赖于电压的电阻层，并且包括第一电极和第二电极，每个第一电极和第二电极与电压相关的电阻层相关联，其中发光元件将被安装成使其与电压相关的电阻层重叠。

5. 发明授权

US06598292B1 Method of manufacturing a circuit board using a porous sheet composed of cellulose 有权
标题翻译：使用由纤维素构成的多孔片材来制造电路板的方法
公开(公告)号：US06598292B1
公开(公告)日：2003-07-29
申请号：US09554395
申请日：2000-07-13
申请人： Shigetoshi Segawa , Yasuyuki Baba , Katsuyoshi Ishikawa , Kazuhiko Ihara
发明人： Shigetoshi Segawa , Yasuyuki Baba , Katsuyoshi Ishikawa , Kazuhiko Ihara
IPC分类号： H01K310
CPC分类号： H05K3/4061 , B41F15/20 , B41P2215/134 , H05K3/1216 , H05K3/4053 , H05K2201/0116 , H05K2201/0284 , H05K2203/0152 , H05K2203/0156 , H05K2203/082 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165
摘要： A manufacturing method of a circuit board comprises the steps of: (a) feeding a printing stage having a porous member comprising a porous plate and a porous sheet, the porous sheet is composed of 90 wt % to 98 wt % of cellulose; (b) placing a plate for the circuit board having a pierced hole above the porous member; and (c) filling a conductive material in the pierced hole from an upper side of the plate for circuit board by sucking the porous member at a prescribed vacuum pressure from a back of the porous member.
摘要翻译：电路板的制造方法包括以下步骤：（a）馈送具有包括多孔板和多孔片的多孔构件的印刷台，所述多孔片由90重量％至98重量％的纤维素组成; （b）在所述多孔构件上方设置具有穿孔的所述电路板的板; 以及（c）从所述多孔构件的背面以规定的真空压力吸取所述多孔构件，从所述电路板用板的上侧填充所述穿孔孔内的导电性材料。

6. 发明申请

US20050029011A1 Circuit board 审中-公开
标题翻译：电路板
公开(公告)号：US20050029011A1
公开(公告)日：2005-02-10
申请号：US10911148
申请日：2004-08-03
申请人： Toshifumi Morita , Shigetoshi Segawa
发明人： Toshifumi Morita , Shigetoshi Segawa
IPC分类号： H01L23/373 , H01L23/48 , H05K1/02 , H05K1/03 , H05K3/34 , H05K3/36 , H05K3/46 , H05K1/11
CPC分类号： H01L23/3735 , H01L24/72 , H01L2224/32225 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01322 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/351 , H05K1/0271 , H05K1/0306 , H05K3/3436 , H05K3/368 , H05K3/4626 , H05K3/4629 , H05K3/4688 , H05K2201/0212 , H05K2201/068 , Y02P70/613 , H01L2924/00
摘要： A circuit board including a plurality of substrates fixed on a main substrate with solder, wherein the plurality of substrates include a substrate having a smaller thermal expansion coefficient than the main substrate, and wherein the plurality of substrates are made by bonding together a ceramic substrate and a substrate having a higher strength than the ceramic substrate, with the higher-strength substrate bonded to the main substrate side of the ceramic substrate. Since a substrate having a higher strength than a ceramic substrate is bonded to the main substrate side of the ceramic substrate, it is possible to reduce the thermal stress applied to the ceramic substrate side of the circuit board so as to prevent cracking in the ceramic substrate, thus improving the reliability of the circuit board against a thermal stress.
摘要翻译：一种电路板，包括用焊料固定在主基板上的多个基板，其中所述多个基板包括具有比所述主基板更小的热膨胀系数的基板，并且其中所述多个基板通过将陶瓷基板和具有比陶瓷衬底高的强度的衬底，其中较高强度衬底粘合到陶瓷衬底的主衬底侧。由于具有比陶瓷基板更高的强度的基板被接合到陶瓷基板的主基板侧，因此可以降低施加到电路板的陶瓷基板侧的热应力，以防止陶瓷基板中的开裂，从而提高电路板抵抗热应力的可靠性。

7. 发明授权

US09076714B2 Substrate for mounting light-emitting element and light-emitting device 有权
标题翻译：用于安装发光元件和发光装置的基板
公开(公告)号：US09076714B2
公开(公告)日：2015-07-07
申请号：US13581695
申请日：2011-02-23
申请人： Seiichi Nakatani , Tatsuo Ogawa , Kazuo Kimura , Shigetoshi Segawa
发明人： Seiichi Nakatani , Tatsuo Ogawa , Kazuo Kimura , Shigetoshi Segawa
IPC分类号： H01L29/86 , H01L25/16 , H01L33/48 , H01L33/54 , H01L33/64
CPC分类号： H01L25/167 , H01L33/486 , H01L33/54 , H01L33/641 , H01L2924/0002 , H01L2924/09701 , H01L2933/0033 , H01L2924/00
摘要： There is provided a substrate for light-emitting element, including a mounting surface on which a light-emitting element is to be mounted, the mounting surface being one of two opposed main surfaces of the substrate. The substrate of the present invention is provided with a protection element for the light-emitting element, the protection element comprising a voltage-dependent resistive layer embedded in a body of the substrate, and comprising a first electrode and a second electrode each of which is in connection with the voltage-dependent resistive layer wherein the light-emitting element is to be mounted such that it is positioned in an overlapping relation with the voltage-dependent resistive layer.
摘要翻译：提供了一种用于发光元件的基板，其包括安装有发光元件的安装表面，该安装表面是基板的两个相对的主表面之一。本发明的基板设置有用于发光元件的保护元件，该保护元件包括嵌入在该基板本体中的依赖于电压的电阻层，并且包括第一电极和第二电极，每个第一电极和第二电极与电压相关的电阻层相关联，其中发光元件将被安装成使其与电压相关的电阻层重叠。

8. 发明授权

US06740183B1 Method of producing ceramic multi-layered substrate 有权
标题翻译：陶瓷多层基板的制造方法
公开(公告)号：US06740183B1
公开(公告)日：2004-05-25
申请号：US09445892
申请日：2000-04-24
申请人： Shigetoshi Segawa , Hiroshi Ochi , Yasuyuki Baba , Osamu Shiraishi , Masao Konishi
发明人： Shigetoshi Segawa , Hiroshi Ochi , Yasuyuki Baba , Osamu Shiraishi , Masao Konishi
IPC分类号： B32B3122
CPC分类号： H05K3/0044 , H01L21/481 , H01L21/4857 , H01L21/4864 , H05K1/0306 , H05K2203/025 , H05K2203/0746
摘要： A method for manufacturing a multi-layered ceramic substrate which enables to remove a shrinkage suppression sheet without damaging the multi-layered substrate. The shrinkage suppression sheets are formed on both faces of unfired laminated green sheets, and then the laminated green sheets are fired. For removing the shrinkage suppression sheets on both faces of the multi-layered ceramic substrate 2 after sintering, water, ceramic powder, or water and ceramic powder mixture is sprayed together with compressed air.
摘要翻译：一种多层陶瓷基板的制造方法，其能够在不损害多层基板的情况下除去收缩抑制片。在未烧结的层压生坯的两面上形成收缩抑制片，然后烧结层压的生片。将水，陶瓷粉末或水和陶瓷粉末混合物与压缩空气一起在烧结后的多层陶瓷基板的两面上在收缩抑制片上喷涂，以除去收缩抑制片。

9. 发明授权

US06647845B1 Sheet retainer for punching ceramic green sheet and punching apparatus 有权
标题翻译：用于冲压陶瓷生坯片和冲孔装置的片保持器
公开(公告)号：US06647845B1
公开(公告)日：2003-11-18
申请号：US09719647
申请日：2001-02-26
申请人： Hiroshi Ochi , Shigetoshi Segawa
发明人： Hiroshi Ochi , Shigetoshi Segawa
IPC分类号： B26F114
CPC分类号： B26D7/025 , B26F1/02 , B26F2210/08 , B28B11/12 , H05K1/0306 , H05K3/005 , H05K2201/0133 , H05K2203/0165 , H05K2203/0195 , Y10T83/2157 , Y10T83/2172
摘要： Move, deformation, or damages of a green sheet can be securely prevented by improvement of the material and shape of a green sheet retainer 40 affixed to a punching tool 30 provided with a cutter section 32 for punching a via hole on a ceramic green sheet 20. The sheet retainer 40 of the present invention is composed of an elastic material with hardness between 50 to 60 degrees, and comprises: a support portion 46 disposed on one end in the axial direction with a relatively large outer diameter, thick-walled in the radial direction, and engageable in the punching tool 30; a contact portion 42 disposed on the other end in the axial direction with a relatively small outer diameter, thin-walled in the radial direction, and comes in contact with the green sheet 20; and a housing hole 48 axially extending from the contact portion 42 for housing the cutter section 32.
摘要翻译：通过改善固定在冲压工具30上的生片保持器40的材料和形状，可以可靠地防止生片的移动，变形或损坏，该切割工具30具有用于冲压陶瓷生片20上的通孔的切割部32 本发明的片材保持器40由硬度在50〜60度之间的弹性材料构成，其特征在于，包括：支撑部46，其沿径向一端具有较大的外径，并且可接合在冲压工具30中; 接触部分42，其沿轴向另一端设置有较小的外径，在径向方向上薄壁，并与生片20接触; 以及从接触部分42轴向延伸以容纳切割器部分32的容纳孔48。

10. 发明授权

US06942745B2 Production method of circuit board module 失效
标题翻译：电路板模块的生产方法
公开(公告)号：US06942745B2
公开(公告)日：2005-09-13
申请号：US10220211
申请日：2001-12-27
申请人： Shigetoshi Segawa
发明人： Shigetoshi Segawa
IPC分类号： H05K1/11 , H05K1/14 , H05K3/32 , H05K3/36 , H05K3/46
CPC分类号： H05K3/361 , H05K1/117 , H05K1/141 , H05K3/323 , H05K2201/09427 , Y10T29/49126 , Y10T156/10 , Y10T156/1089
摘要： The present invention provides a method of manufacturing a circuit board module for connecting a circuit conductor (2) of a first circuit board (1) to a circuit conductor (4) of a second circuit board (5) using at least one selected from the group consisting of an anisotropic conductive film (6), an anisotropic conductive paste and an adhesive resin, wherein a difference in a pattern width between the circuit conductor of the first circuit board and that of the second circuit board is in a range of 5 μm to 50 μm. In such a method of manufacturing a circuit board module, connection of a connecting conductor with a narrow pitch can be realized, and poor connection can be reduced, thus providing a method of manufacturing a circuit board module having higher reliability.
摘要翻译：本发明提供一种制造电路板模块的方法，该电路板模块用于使用选自以下的至少一种来将第一电路板（1）的电路导体（2）连接到第二电路板（5）的电路导体（4）由各向异性导电膜（6），各向异性导电膏和粘合剂树脂组成的组，其中第一电路板的电路导体与第二电路板的电路导体之间的图案宽度之差在5μm的范围内到50个妈妈在制造电路板模块的这种方法中，可以实现连接导体与窄间距的连接，并且可以减少连接不良，从而提供制造具有更高可靠性的电路板模块的方法。

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