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1. 发明授权

US08242015B2 Film forming method and film forming apparatus 有权
标题翻译：成膜方法和成膜装置
公开(公告)号：US08242015B2
公开(公告)日：2012-08-14
申请号：US12631556
申请日：2009-12-04
申请人： Kenji Matsumoto , Hitoshi Itoh , Koji Neishi , Junichi Koike
发明人： Kenji Matsumoto , Hitoshi Itoh , Koji Neishi , Junichi Koike
IPC分类号： H01L21/4763
CPC分类号： C23C16/045 , C23C16/18 , C23C16/40 , C23C16/408 , C23C16/45525 , C23C16/45531 , C23C16/56 , H01L21/28562 , H01L21/76831 , H01L21/76843 , H01L21/76844 , H01L21/76855 , H01L21/76864 , H01L21/76867 , H01L21/76873 , H01L23/53238 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： On a surface of an object to be treated, a Mn-containing thin film or CuMn-containing alloy thin film is formed by heat treatment (CVD or ALD) by using a Mn-containing source gas (or Mn-containing source gas and a Cu-containing gas) and an oxygen-containing gas (for instance, water vapor) as a processing gas. The Mn-containing thin film or the CuMn-containing alloy thin film can be formed with high step coverage in a fine recess formed on the surface of the object to be treated.
摘要翻译：在待处理物体的表面上，通过使用含Mn的源气体（或含Mn源气体，和含有Mn的源气体），通过热处理（CVD或ALD）形成含Mn的薄膜或含CuMn的合金薄膜含Cu气体）和含氧气体（例如水蒸气）作为处理气体。含Mn薄膜或含CuMn合金薄膜可以形成在形成在待处理物体表面上的细凹槽中的高阶覆盖。

2. 发明申请

US20120135612A1 FILM FORMING METHOD, PRETREATMENT DEVICE, AND PROCESSING SYSTEM 有权
标题翻译：电影形成方法，预处理装置和处理系统
公开(公告)号：US20120135612A1
公开(公告)日：2012-05-31
申请号：US13378535
申请日：2010-06-16
申请人： Kenji Matsumoto , Hitoshi Itoh , Hidenori Miyoshi , Shigetoshi Hosaka , Hiroshi Sato , Koji Neishi , Junichi Koike
发明人： Kenji Matsumoto , Hitoshi Itoh , Hidenori Miyoshi , Shigetoshi Hosaka , Hiroshi Sato , Koji Neishi , Junichi Koike
IPC分类号： H01L21/31 , C23C16/44 , C23C16/02
CPC分类号： H01L21/76814 , C23C16/02 , C23C16/40 , H01L21/28556 , H01L21/3105 , H01L21/32051 , H01L21/76831 , H01L21/76844 , H01L21/76867
摘要： A film forming method is disclosed in which a thin film comprising manganese is formed on an object to be processed which has, on a surface thereof, an insulating layer constituted of a low-k film and having a recess. The method comprises a hydrophilization step in which the surface of the insulating layer is hydrophilized to make the surface hydrophilic and a thin-film formation step in which a thin film containing manganese is formed on the surface of the hydrophilized insulating layer by performing a film forming process using a manganese-containing material gas on the surface of the hydrophilized insulating layer. Thus, a thin film comprising manganese, e.g., an MnOx film, is effectively formed on the surface of the insulating layer constituted of a low-k film, which has a low dielectric constant.
摘要翻译：公开了一种成膜方法，其中在被处理物体上形成包含锰的薄膜，其表面上由低k膜构成并具有凹陷的绝缘层。该方法包括亲水化步骤，其中绝缘层的表面被亲水化以使表面亲水，并且薄膜形成步骤通过进行成膜在亲水化绝缘层的表面上形成含有锰的薄膜在亲水化绝缘层的表面上使用含锰材料气体的方法。因此，在由具有低介电常数的低k膜构成的绝缘层的表面上有效地形成了包含锰的薄膜，例如MnO x膜。

3. 发明授权

US08865590B2 Film forming method, pretreatment device, and processing system 有权
标题翻译：成膜方法，预处理装置和加工系统
公开(公告)号：US08865590B2
公开(公告)日：2014-10-21
申请号：US13378535
申请日：2010-06-16
申请人： Kenji Matsumoto , Hitoshi Itoh , Hidenori Miyoshi , Shigetoshi Hosaka , Hiroshi Sato , Koji Neishi , Junichi Koike
发明人： Kenji Matsumoto , Hitoshi Itoh , Hidenori Miyoshi , Shigetoshi Hosaka , Hiroshi Sato , Koji Neishi , Junichi Koike
IPC分类号： H01L21/00 , H01L21/768 , H01L21/3205 , H01L21/285 , H01L21/3105 , C23C16/40 , C23C16/02
CPC分类号： H01L21/76814 , C23C16/02 , C23C16/40 , H01L21/28556 , H01L21/3105 , H01L21/32051 , H01L21/76831 , H01L21/76844 , H01L21/76867
摘要： A film forming method is disclosed in which a thin film comprising manganese is formed on an object to be processed which has, on a surface thereof, an insulating layer constituted of a low-k film and having a recess. The method comprises a hydrophilization step in which the surface of the insulating layer is hydrophilized to make the surface hydrophilic and a thin-film formation step in which a thin film containing manganese is formed on the surface of the hydrophilized insulating layer by performing a film forming process using a manganese-containing material gas on the surface of the hydrophilized insulating layer. Thus, a thin film comprising manganese, e.g., an MnOx film, is effectively formed on the surface of the insulating layer constituted of a low-k film, which has a low dielectric constant.
摘要翻译：公开了一种成膜方法，其中在被处理物体上形成包含锰的薄膜，其表面上由低k膜构成并具有凹陷的绝缘层。该方法包括亲水化步骤，其中绝缘层的表面被亲水化以使表面亲水，并且薄膜形成步骤通过进行成膜在亲水化绝缘层的表面上形成含有锰的薄膜在亲水化绝缘层的表面上使用含锰材料气体的方法。因此，在由具有低介电常数的低k膜构成的绝缘层的表面上有效地形成了包含锰的薄膜，例如MnO x膜。

4. 发明授权

US08247321B2 Method of manufacturing semiconductor device, semiconductor device, electronic instrument, semiconductor manufacturing apparatus, and storage medium 有权
标题翻译：半导体装置，半导体装置，电子仪器，半导体制造装置和存储介质的制造方法
公开(公告)号：US08247321B2
公开(公告)日：2012-08-21
申请号：US12864824
申请日：2009-01-20
申请人： Kenji Matsumoto , Hitoshi Itoh , Hiroshi Sato , Junichi Koike , Koji Neishi
发明人： Kenji Matsumoto , Hitoshi Itoh , Hiroshi Sato , Junichi Koike , Koji Neishi
IPC分类号： H01L21/4763
CPC分类号： C23C16/40 , C23C28/00 , C23C28/322 , C23C28/345 , H01L21/28562 , H01L21/76814 , H01L21/76831 , H01L21/76844
摘要： When a barrier film is formed on an exposed surface of an interlayer insulation film on a substrate, the interlayer insulation film having a recess formed therein, and a metal wiring to be electrically connected to a metal wiring in a lower layer is formed in the recess, a barrier film having an excellent step coverage can be formed and increase of a wiring resistance can be restrained. An oxide film on a surface of the lower copper wiring exposed to a bottom surface of the interlayer insulation film is reduced or edged so as to remove oxygen on the surface of the copper wiring. Then, by supplying an organic metal compound containing manganese and containing no oxygen, generation of manganese oxide as a self-forming barrier film is selectively allowed on an area containing oxygen, such as a sidewall of the recess and a surface of the interlayer insulation film, while generation of the manganese oxide is not allowed on the surface of the copper wiring. Thereafter, copper is embedded in the recess.
摘要翻译：当在衬底上的层间绝缘膜的暴露表面上形成阻挡膜时，形成有形成在其中的凹部的层间绝缘膜和与下层中的金属布线电连接的金属布线形成在凹部可以形成具有优异的台阶覆盖的阻挡膜，并且可以抑制布线电阻的增加。暴露在层间绝缘膜的底面的下铜布线的表面上的氧化膜被还原或边缘化以去除铜布线表面上的氧。然后，通过供给含有锰并且不含氧的有机金属化合物，在包含氧的区域，例如凹部的侧壁和层间绝缘膜的表面上，选择性地允许产生作为自形成阻挡膜的氧化锰而在铜布线的表面上不允许生成氧化锰。此后，铜嵌入凹槽中。

5. 发明申请

US20110049718A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, ELECTRONIC INSTRUMENT, SEMICONDUCTOR MANUFACTURING APPARATUS, AND STORAGE MEDIUM 有权
标题翻译：制造半导体器件的方法，半导体器件，电子仪器，半导体器件制造设备和存储介质
公开(公告)号：US20110049718A1
公开(公告)日：2011-03-03
申请号：US12864824
申请日：2009-01-20
申请人： Kenji Matsumoto , Hitoshi Itoh , Hiroshi Sato , Junichi Koike , Koji Neishi
发明人： Kenji Matsumoto , Hitoshi Itoh , Hiroshi Sato , Junichi Koike , Koji Neishi
IPC分类号： H01L23/48 , H01L21/768 , B05C13/02
CPC分类号： C23C16/40 , C23C28/00 , C23C28/322 , C23C28/345 , H01L21/28562 , H01L21/76814 , H01L21/76831 , H01L21/76844
摘要： When a barrier film is formed on an exposed surface of an interlayer insulation film on a substrate, the interlayer insulation film having a recess formed therein, and a metal wiring to be electrically connected to a metal wiring in a lower layer is formed in the recess, a barrier film having an excellent step coverage can be formed and increase of a wiring resistance can be restrained. An oxide film on a surface of the lower copper wiring exposed to a bottom surface of the interlayer insulation film is reduced or edged so as to remove oxygen on the surface of the copper wiring. Then, by supplying an organic metal compound containing manganese and containing no oxygen, generation of manganese oxide as a self-forming barrier film is selectively allowed on an area containing oxygen, such as a sidewall of the recess and a surface of the interlayer insulation film, while generation of the manganese oxide is not allowed on the surface of the copper wiring. Thereafter, copper is embedded in the recess.
摘要翻译：当在衬底上的层间绝缘膜的暴露表面上形成阻挡膜时，形成有形成在其中的凹部的层间绝缘膜和与下层中的金属布线电连接的金属布线形成在凹部可以形成具有优异的台阶覆盖的阻挡膜，并且可以抑制布线电阻的增加。暴露在层间绝缘膜的底面的下铜布线的表面上的氧化膜被还原或边缘化以去除铜布线表面上的氧。然后，通过供给含有锰并且不含氧的有机金属化合物，在包含氧的区域，例如凹部的侧壁和层间绝缘膜的表面上，选择性地允许产生作为自形成阻挡膜的氧化锰而在铜布线的表面上不允许生成氧化锰。此后，铜嵌入凹槽中。

6. 发明申请

US20120122289A1 SEMICONDUCTOR DEVICE MANUFACTURING METHOD 失效
标题翻译：半导体器件制造方法
公开(公告)号：US20120122289A1
公开(公告)日：2012-05-17
申请号：US13356812
申请日：2012-01-24
申请人： Kenji Matsumoto , Hitoshi Itoh , Hiroshi Sato
发明人： Kenji Matsumoto , Hitoshi Itoh , Hiroshi Sato
IPC分类号： H01L21/02
CPC分类号： H01L21/31604 , H01L21/3145 , H01L28/40
摘要： Provided is a semiconductor device manufacturing method for a capacitor having a dielectric film which can be formed into a thin film, can be formed at a low temperature, and has a readily controllable property. The manufacturing method includes: forming, on a conductor for serving as one electrode of a capacitor, a manganese oxide film for serving as a dielectric film of the capacitor; and forming, on the manganese oxide film, a conductive film for serving as the other electrode of the capacitor.
摘要翻译：提供一种具有可形成为薄膜的电介质膜的电容器的半导体器件制造方法，可以在低温下形成，并具有容易控制的特性。制造方法包括：在用作电容器的一个电极的导体上形成用作电容器的电介质膜的氧化锰膜; 在氧化锰膜上形成用作电容器的另一个电极的导电膜。

7. 发明申请

US20100210097A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件的制造方法
公开(公告)号：US20100210097A1
公开(公告)日：2010-08-19
申请号：US12706237
申请日：2010-02-16
申请人： Hiroshi Sato , Kenji Matsumoto , Hitoshi Itoh
发明人： Hiroshi Sato , Kenji Matsumoto , Hitoshi Itoh
IPC分类号： H01L21/28
CPC分类号： H01L21/28194 , H01L21/823857 , H01L29/517 , H01L29/6659 , H01L29/7833
摘要： Provided is a manufacturing method of a semiconductor device including a gate insulating film which can be formed into a thin film and of which film composition is easy to be controlled. The manufacturing method includes: forming a manganese oxide film for serving as a gate insulating film on a semiconductor substrate, on which a transistor is formed; forming a conductive film for serving as a gate electrode on the manganese oxide film; and forming a gate electrode and a gate insulating film by processing the conductive film and the manganese oxide film.
摘要翻译：提供一种半导体器件的制造方法，其包括可以形成为薄膜并且易于控制膜组成的栅极绝缘膜。制造方法包括：在形成有晶体管的半导体衬底上形成用作栅极绝缘膜的氧化锰膜; 在氧化锰膜上形成用作栅电极的导电膜; 以及通过处理导电膜和氧化锰膜形成栅电极和栅极绝缘膜。

8. 发明申请

US20130136859A1 FILM FORMING METHOD AND PROCESSING SYSTEM 有权
标题翻译：电影制作方法与处理系统
公开(公告)号：US20130136859A1
公开(公告)日：2013-05-30
申请号：US13807079
申请日：2011-06-24
申请人： Kenji Matsumoto , Shigetoshi Hosaka , Hitoshi Itoh
发明人： Kenji Matsumoto , Shigetoshi Hosaka , Hitoshi Itoh
IPC分类号： B05D5/12
CPC分类号： B05D5/12 , C23C16/40 , H01L21/76831 , H01L21/76846 , H01L21/76856 , H01L21/76861 , H01L21/76867 , H01L21/76873 , H01L23/53238 , H01L23/5329 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： A film forming method performs a film forming process on a target object having on a surface thereof an insulating layer. The film forming method includes a first thin film forming step of forming a first thin film containing a first metal, an oxidation step of forming an oxide film by oxidizing the first thin film, and a second thin film forming step of forming a second thin film containing a second metal on the oxide film.
摘要翻译：成膜方法对其表面上具有绝缘层的目标物体进行成膜处理。该成膜方法包括：形成含有第一金属的第一薄膜的第一薄膜形成步骤，通过氧化第一薄膜形成氧化膜的氧化步骤和形成第二薄膜的第二薄膜形成步骤在氧化膜上含有第二金属。

9. 发明授权

US08349725B2 Method of manufacturing semiconductor device, semiconductor manufacturing apparatus, and storage medium 有权
标题翻译：制造半导体器件，半导体制造装置和存储介质的方法
公开(公告)号：US08349725B2
公开(公告)日：2013-01-08
申请号：US12920701
申请日：2009-02-20
申请人： Hiroshi Sato , Hitoshi Itoh , Kenji Matsumoto
发明人： Hiroshi Sato , Hitoshi Itoh , Kenji Matsumoto
IPC分类号： H01L21/4763
CPC分类号： H01L21/67207 , H01L21/02063 , H01L21/02068 , H01L21/67253 , H01L21/67742 , H01L21/76814 , H01L21/76831 , H01L21/76834 , H01L21/76843 , H01L21/76858 , H01L21/76861 , H01L21/76865 , H01L21/76873 , H01L21/76877 , H01L23/53238 , H01L23/53295 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： The present invention is a method of manufacturing a semiconductor device comprising: forming a recess in an interlayer insulating film formed on a substrate surface, the recess being configured to be embedded with an upper conductive channel mainly made of copper to be electrically connected to a lower conductive channel; supplying a gas containing an organic compound of manganese, and forming a barrier layer made of a compound of manganese for preventing diffusion of copper to the interlayer insulating film, such that the barrier layer covers an exposed surface of the interlayer insulating film; after the formation of the barrier layer, supplying organic acid to the barrier layer in order to increase a ratio of manganese in the compound of manganese forming the barrier layer; after the supply of the organic acid, forming a seed layer mainly made of copper on a surface of the barrier layer; after the formation of the seed-layer, heating the substrate in order to separate out manganese from on the surface of the barrier layer or from in the barrier layer onto a surface of the seed layer; supplying a cleaning liquid to the seed layer in order to remove the manganese separated out on the surface of the seed layer by the heating; and after the supply of the cleaning liquid, forming the upper conductive channel mainly made of copper in the recess.
摘要翻译：本发明是一种制造半导体器件的方法，包括：在形成在衬底表面上的层间绝缘膜中形成凹部，所述凹部被构造成嵌入有主要由铜制成的上部导电沟道，以与下部电连接导电通道; 提供含锰有机化合物的气体，形成由锰化合物制成的阻挡层，以防止铜向层间绝缘膜扩散，使得阻挡层覆盖层间绝缘膜的暴露表面; 在形成阻挡层之后，向阻挡层供给有机酸，以增加形成阻挡层的锰化合物中的锰的比例; 在供给有机酸之后，在阻挡层的表面上形成主要由铜制成的种子层; 在形成种子层之后，加热衬底以将锰从阻挡层的表面或阻挡层中分离出到种子层的表面上; 向种子层供应清洗液，以便通过加热去除种子层表面上分离的锰; 并且在供应清洁液之后，在凹槽中形成主要由铜制成的上导电通道。

10. 发明授权

US08124492B2 Semiconductor device manufacturing method 失效
标题翻译：半导体器件制造方法
公开(公告)号：US08124492B2
公开(公告)日：2012-02-28
申请号：US12720831
申请日：2010-03-10
申请人： Kenji Matsumoto , Hitoshi Itoh , Hiroshi Sato
发明人： Kenji Matsumoto , Hitoshi Itoh , Hiroshi Sato
IPC分类号： H01L21/20
CPC分类号： H01L21/31604 , H01L21/3145 , H01L28/40
摘要： Provided is a semiconductor device manufacturing method for a capacitor having a dielectric film which can be formed into a thin film, can be formed at a low temperature, and has a readily controllable property. The manufacturing method includes: forming an oxide film or an oxynitride film on a conductor for serving as one electrode of a capacitor; forming, on the oxide film or the oxynitride film, a manganese oxide film for serving as a dielectric film of the capacitor; and forming, on the manganese oxide film, a conductive film for serving as the other electrode of the capacitor.
摘要翻译：提供一种具有可形成为薄膜的电介质膜的电容器的半导体器件制造方法，可以在低温下形成，并具有容易控制的特性。制造方法包括：在用作电容器的一个电极的导体上形成氧化膜或氮氧化物膜; 在氧化膜或氮氧化物膜上形成用作电容器的电介质膜的氧化锰膜; 在氧化锰膜上形成用作电容器的另一个电极的导电膜。

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