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    • 10. 发明授权
    • Plating pretreatment solution and method for producing aluminum substrate for hard disk devices using same
    • 电镀预处理液及其制造方法
    • US09127170B2
    • 2015-09-08
    • US13981355
    • 2012-01-19
    • Nobuaki MukaiTakahiro Yoshida
    • Nobuaki MukaiTakahiro Yoshida
    • G11B5/84C09D1/00C23C18/18C23C18/32B05D3/10
    • C09D1/00B05D3/102C23C18/1831C23C18/32
    • An object of the invention is to provide a plating pretreatment solution that can convert the surface of an aluminum substrate for hard disk devices into a surface suitable for electroless nickel plating, and a method for producing an aluminum substrate for hard disk devices using the same. The plating pretreatment solution of the present invention used for a plating pretreatment in production of an aluminum substrate for hard disk devices has an iron ion concentration of 0.1 g/l to 1.0 g/l and a nitric acid concentration of 2.0 wt % to 12.0 wt %. This plating pretreatment solution is used for a pretreatment of a plating step in which electroless nickel plating is applied to an aluminum substrate for hard disk devices. Accordingly, the surface of the aluminum substrate for hard disk devices is converted into a surface suitable for electroless Ni plating, and a smooth surface of a plated film is obtained by suppressing generation of waviness, nodules, and pits on the plated surface when electroless nickel plating is performed in the plating step.
    • 本发明的目的是提供一种电镀预处理溶液,其可以将用于硬盘装置的铝基板的表面转换成适用于无电解镀镍的表面,以及用于制造使用其的硬盘装置的铝基板的方法。 用于硬盘装置的铝基板的电镀预处理的本发明的电镀预处理液的铁离子浓度为0.1g / l〜1.0g / l,硝酸浓度为2.0〜12.0wt %。 该电镀预处理溶液用于将硬化镍电镀用于硬盘装置的铝基板的电镀步骤的预处理。 因此,用于硬盘装置的铝基板的表面被转换成适合于化学镀镍的表面,并且当化学镀镍时,通过抑制电镀表面上的波纹,结块和凹坑的产生,获得镀膜的光滑表面 在电镀步骤中进行电镀。