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    • 7. 发明授权
    • Infrared sensor and infrared sensor array
    • 红外传感器和红外传感器阵列
    • US07332717B2
    • 2008-02-19
    • US10580534
    • 2005-09-15
    • Takahiko MurataTakumi YamaguchiShigetaka KasugaShinji YoshidaYoshito Ikeda
    • Takahiko MurataTakumi YamaguchiShigetaka KasugaShinji YoshidaYoshito Ikeda
    • G01J5/00
    • G01J5/24G01J1/46H04N5/33
    • An infrared sensor includes a series capacitor element and a reference capacitor element each exhibiting a predetermined capacitance value; an infrared-detecting capacitor element whose capacitance value varies depending on an intensity of infrared light incident on the element; and an output node being a node at which a first terminal of the series capacitor element, a first terminal of the reference capacitor element and a first terminal of the infrared-detecting capacitor element are connected to one another. The intensity of infrared light is output as a potential difference between the reference potential which is brought to a potential by applying a predetermined voltage between the series capacitor element and the reference capacitor element and the detection potential which is brought to a potential by applying a predetermined voltage between the series capacitor element and the infrared-detecting capacitor element.
    • 红外线传感器包括串联电容器元件和参考电容器元件,每个都具有预定的电容值; 其电容值根据入射到元件上的红外光的强度而变化的红外线检测电容器元件; 并且输出节点是串联电容器元件的第一端子,参考电容器元件的第一端子和红外线检测电容器元件的第一端子彼此连接的节点。 红外光的强度通过在串联电容器元件和参考电容器元件之间施加预定电压而被引入到电位的参考电位之间的电位差和通过施加预定的 串联电容器元件和红外线检测电容器元件之间的电压。
    • 9. 发明申请
    • Solid-state imaging device and its manufacturing method
    • 固态成像装置及其制造方法
    • US20070020795A1
    • 2007-01-25
    • US10568961
    • 2005-01-07
    • Mitsuyoshi MoriTakumi YamaguchiShinji Yoshida
    • Mitsuyoshi MoriTakumi YamaguchiShinji Yoshida
    • H01L21/00
    • H01L27/1463H01L21/76205H01L27/14689
    • In a method for manufacturing a solid-state imaging device of the present invention, a pad insulting film 2 made of an oxide film and an anti-oxidizing film 3 made of a nitride film are deposited on a n-type semiconductor substrate 1. Then, an opening 4 is formed to expose an element isolation formation region of the semiconductor substrate 1. Next, an anti-oxidizing film (not shown) for burying the opening 4 is formed on the substrate and anisotropic etching is performed to form a sidewall 5. Subsequently, a trench 6 is formed using the anti-oxidizing film 3 and the sidewall 5 as a mask. Then, a p-type impurity is implanted into a part of the semiconductor substrate 1 which is exposed at the side face of the trench 6 and a thermal oxide film is formed in the surface portion of the trench 6 in the semiconductor substrate 1. Thereafter, the trench 6 is buried with a burying film 8.
    • 在本发明的固体摄像装置的制造方法中,在n型半导体基板1上沉积由氧化膜构成的焊盘绝缘膜2和由氮化物膜构成的抗氧化膜3。 然后,形成开口4以露出半导体衬底1的元件隔离形成区域。 接下来,在基板上形成用于埋入开口4的抗氧化膜(未示出),并执行各向异性蚀刻以形成侧壁5。 随后,使用抗氧化膜3和侧壁5作为掩模形成沟槽6。 然后,将p型杂质注入到在沟槽6的侧面露出的半导体衬底1的一部分中,并且在半导体衬底1中的沟槽6的表面部分中形成热氧化膜。 此后,沟槽6被埋入掩埋膜8。