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    • 9. 发明授权
    • Duplexer
    • 双工器
    • US07034392B2
    • 2006-04-25
    • US10886047
    • 2004-07-08
    • Akio HirakawaYoshiaki FujitaTomokazu Komazaki
    • Akio HirakawaYoshiaki FujitaTomokazu Komazaki
    • H01L23/053
    • H01L25/165H01L2924/0002H01L2924/3011H01L2924/00
    • A filter chip lying on an upper surface of a top layer package substrate is connected to an upper surface ground electrode (235). The upper ground electrode (235) and a lower surface ground electrode (237) are connected to each other via through electrodes (261, 262, 263), ground wiring patterns (251, 252), first connecting lines (271 to 276), and second connecting lines (281, 282). The first connecting lines (271 to 276) are connected to the ground wiring patterns (251, 252), whereas the second connecting lines (281, 282) are not connected to the ground wiring patterns (251, 252), respectively. Owing to the provision of the connecting lines connected to the ground wiring patterns (251, 252) and the connecting lines unconnected to the ground wiring patterns (251, 252), the impedance between a multilayer package substrate and ground can be adjusted.
    • 位于顶层封装衬底的上表面上的滤波器芯片连接到上表面接地电极(235)。 上接地电极(235)和下表面接地电极(237)经由电极(261,262,263),接地布线图案(251,252),第一连接线(271〜276), 和第二连接线(281,282)。 第一连接线(271〜276)连接到接地布线图案(251,252),而第二连接线(281,282)分别不连接到接地布线图案(251,252)。 由于提供连接到接地布线图案(251,252)的连接线和未连接到接地布线图案(251,252)的连接线,可以调节多层封装基板和接地之间的阻抗。
    • 10. 发明授权
    • Saw branching filter with a branching filter circuit formed on the package
    • 具有形成在封装上的分支滤波器电路的锯分波器
    • US06870440B2
    • 2005-03-22
    • US09785501
    • 2001-02-20
    • Tomokazu KomazakiYoshiaki FujitaHajime Shimamura
    • Tomokazu KomazakiYoshiaki FujitaHajime Shimamura
    • H03H9/72H03H9/64
    • H03H9/725H03H9/0576H03H9/72
    • A surface acoustic wave duplexer having an antenna terminal, a transmitting terminal and a receiving terminal. The surface acoustic wave duplexer includes a transmitting SAW filter coupled between the antenna terminal and the transmitting terminal, a receiving SAW filter coupled between the antenna terminal and the receiving terminal, a common piezoelectric substrate on which both of the transmitting SAW filter and the receiving SAW filter are formed, a package covering the common piezoelectric substrate. The antenna terminal, the transmitting terminal and the receiving terminal are formed on the package, and a frequency adjusting circuit is coupled between the antenna terminal and the transmitting SAW filter or the receiving SAW filter. The frequency adjusting circuit has a capacitance element.
    • 具有天线端子,发送端子和接收端子的表面声波双工器。 表面声波双工器包括耦合在天线端子和发射端子之间的发射SAW滤波器,耦合在天线端子和接收端子之间的接收SAW滤波器,公共压电基片,发射SAW滤波器和接收SAW 滤波器形成,覆盖公共压电基板的封装。 天线端子,发送端子和接收端子形成在封装上,并且频率调节电路耦合在天线端子和发射SAW滤波器或接收SAW滤波器之间。 频率调整电路具有电容元件。