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1. 发明授权

US10020568B2 RFID inlet antenna and RFID employing same 有权
公开(公告)号：US10020568B2
公开(公告)日：2018-07-10
申请号：US14130037
申请日：2012-06-22
申请人： Kengo Den , Masateru Watanabe , Hiroki Higashiyama , Masataka Saruwatari
发明人： Kengo Den , Masateru Watanabe , Hiroki Higashiyama , Masataka Saruwatari
IPC分类号： H01Q1/38 , G06K19/077 , G06K19/073
CPC分类号： H01Q1/38 , G06K19/0739 , G06K19/07722 , G06K19/07726 , G06K19/0776
摘要： The present invention provides an RFID inlet antenna comprising a resin base film and a metallic circuit formed via an adhesive layer on the surface of the resin base film. The RFID inlet antenna is prevented from removal of the metallic circuit by unauthorized detachment after the RFID inlet antenna is bonded to an item by a bonding material disposed in such a manner as to cover the metallic circuit.

2. 发明申请

US20140159963A1 RFID INLET ANTENNA AND RFID EMPLOYING SAME 有权
标题翻译： RFID入口天线和使用RFID的RFID
公开(公告)号：US20140159963A1
公开(公告)日：2014-06-12
申请号：US14130037
申请日：2012-06-22
申请人： Kengo Den , Masateru Watanabe , Hiroki Higashiyama , Masataka Saruwatari
发明人： Kengo Den , Masateru Watanabe , Hiroki Higashiyama , Masataka Saruwatari
IPC分类号： H01Q1/38
CPC分类号： H01Q1/38 , G06K19/0739 , G06K19/07722 , G06K19/07726 , G06K19/0776
摘要： The present invention provides an RFID inlet antenna comprising a resin base film and a metallic circuit formed via an adhesive layer on the surface of the resin base film. The RFID inlet antenna is prevented from removal of the metallic circuit by unauthorized detachment after the RFID inlet antenna is bonded to an item by a bonding material disposed in such a manner as to cover the metallic circuit.
摘要翻译：本发明提供一种RFID入口天线，其包括树脂基膜和通过树脂基膜表面上的粘合剂层形成的金属电路。在RFID入口天线通过以覆盖金属电路的方式设置的接合材料接合到物品之后，防止RFID入口天线被未经授权的拆卸而移除金属电路。

3. 发明授权

US09053406B2 Antenna circuit constituent body for IC card/tag and method for manufacturing the same 有权
标题翻译： IC卡/标签用天线电路构成体及其制造方法
公开(公告)号：US09053406B2
公开(公告)日：2015-06-09
申请号：US13702983
申请日：2011-06-06
申请人： Hiroki Higashiyama
发明人： Hiroki Higashiyama
IPC分类号： H01Q1/36 , G06K19/077 , H01Q1/38 , H01Q1/22 , H01Q7/00 , H05K3/46
CPC分类号： G06K19/07775 , G06K19/07718 , G06K19/07773 , G06K19/07783 , H01Q1/2225 , H01Q1/38 , H01Q7/00 , H05K3/4685
摘要： Provided are an antenna circuit constituent body for an IC card/tag capable of reducing environmental load in a manufacturing process for joining both end portions of an antenna circuit pattern layer and capable of enhancing reliability of joined portions of the both end portions of the antenna circuit pattern layer: and a method for manufacturing the antenna circuit constituent body for an IC card/tag. In the antenna circuit constituent body for an IC card/tag, an insulating layer (107) is formed so as to extend from an upper part of a first circuit pattern layer part (103), via an upper part of a third circuit pattern layer part (101), and to an upper part of a second circuit pattern layer part (104). A conductive layer (108) is formed on the insulating layer (107) so as to bring the first circuit pattern layer part (103) and the second circuit pattern layer part (104) into conduction. The insulating layer (107) has a plurality of inclined end surfaces on each of the first circuit pattern layer part (103) and the second circuit pattern layer part (104).
摘要翻译：在天线电路图案层的两端部接合的制造工序中能够减小环境负荷的能够提高天线电路的两端部的接合部的可靠性的IC卡/标签的天线电路构成体图案层和用于制造用于IC卡/标签的天线电路构成体的方法。在用于IC卡/标签的天线电路构成体中，绝缘层（107）形成为从第一电路图案层部分（103）的上部经由第三电路图案层的上部部分（101）和第二电路图案层部分（104）的上部。在绝缘层（107）上形成导电层（108），以使第一电路图案层部分（103）和第二电路图案层部分（104）导通。绝缘层（107）在第一电路图案层部（103）和第二电路图案层部（104）的每一个上具有多个倾斜端面。

4. 发明申请

US20130082882A1 ANTENNA CIRCUIT CONSTITUENT BODY FOR IC CARD/TAG AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：用于IC卡/标签的天线电路体系及其制造方法
公开(公告)号：US20130082882A1
公开(公告)日：2013-04-04
申请号：US13702983
申请日：2011-06-06
申请人： Hiroki Higashiyama
发明人： Hiroki Higashiyama
IPC分类号： G06K19/077 , H01Q1/38
CPC分类号： G06K19/07775 , G06K19/07718 , G06K19/07773 , G06K19/07783 , H01Q1/2225 , H01Q1/38 , H01Q7/00 , H05K3/4685
摘要： Provided are an antenna circuit constituent body for an IC card/tag capable of reducing environmental load in a manufacturing process for joining both end portions of an antenna circuit pattern layer and capable of enhancing reliability of joined portions of the both end portions of the antenna circuit pattern layer: and a method for manufacturing the antenna circuit constituent body for an IC card/tag. In the antenna circuit constituent body for an IC card/tag, an insulating layer (107) is formed so as to extend from an upper part of a first circuit pattern layer part (103), via an upper part of a third circuit pattern layer part (101), and to an upper part of a second circuit pattern layer part (104). A conductive layer (108) is formed on the insulating layer (107) so as to bring the first circuit pattern layer part (103) and the second circuit pattern layer part (104) into conduction. The insulating layer (107) has a plurality of inclined end surfaces on each of the first circuit pattern layer part (103) and the second circuit pattern layer part (104).
摘要翻译：在天线电路图案层的两端部接合的制造工序中能够减小环境负荷的能够提高天线电路的两端部的接合部的可靠性的IC卡/标签的天线电路构成体图案层和用于制造用于IC卡/标签的天线电路构成体的方法。在用于IC卡/标签的天线电路构成体中，绝缘层（107）形成为从第一电路图案层部分（103）的上部经由第三电路图案层的上部部分（101）和第二电路图案层部分（104）的上部。在绝缘层（107）上形成导电层（108），以使第一电路图案层部分（103）和第二电路图案层部分（104）导通。绝缘层（107）在第一电路图案层部（103）和第二电路图案层部（104）的每一个上具有多个倾斜端面。

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