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    • 10. 发明授权
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US07696024B2
    • 2010-04-13
    • US11693447
    • 2007-03-29
    • Hotaka MaruyamaKengo Akimoto
    • Hotaka MaruyamaKengo Akimoto
    • H01L21/00H01L27/088
    • H01L27/127H01L27/1214H01L27/1266H01L29/41733H01L29/458H01L29/66757H01L29/78621
    • A semiconductor device is provided, which comprises a semiconductor film, a gate insulating film, a gate electrode, an insulating film, and a source and drain electrodes. The semiconductor film includes at least a channel forming region, a region, a source and drain regions disposed between the channel forming region and the region, a first silicide region over the region, and a second silicide region over a portion of the source and drain regions. The insulating film has a contact hole to expose at least the first silicide region. Each of the source and drain electrodes is electrically connected to the first silicide region via the contact hole. The region includes an element imparting one conductivity type at a lower concentration than the source and drain regions.
    • 提供一种半导体器件,其包括半导体膜,栅极绝缘膜,栅电极,绝缘膜以及源极和漏极。 半导体膜包括至少沟道形成区域,区域,设置在沟道形成区域和区域之间的源极和漏极区域,该区域上的第一硅化物区域和源极和漏极的一部分上的第二硅化物区域 地区。 绝缘膜具有至少露出第一硅化物区域的接触孔。 源电极和漏电极中的每一个经由接触孔电连接到第一硅化物区域。 该区域包括赋予比源区和漏区更低浓度的一种导电类型的元件。