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    • 8. 发明授权
    • Group III nitride semiconductor device
    • III族氮化物半导体器件
    • US07211839B2
    • 2007-05-01
    • US10771528
    • 2004-02-05
    • Tetsu KachiYoshitaka NakanoTsutomu Uesugi
    • Tetsu KachiYoshitaka NakanoTsutomu Uesugi
    • H01L29/793
    • H01L29/7788H01L29/0646H01L29/2003H01L29/7786H01L29/7789H01L29/7828
    • A semiconductor device is formed by a first layer 32 composed of AlGaN, a second layer 42 composed of GaN, a gate electrode 34, a source electrode 38, and a drain electrode 28. The first layer 32 has a region 32a formed between the gate electrode 34 and the second layer 42. A channel is formed in the vicinity of the boundary 24 of the first layer 32 and the second layer 42. The second layer 42 has p-type conductivity and is in contact with the source electrode 38. When electrons flow in the channel, the electrons collide with surrounding atoms, and holes are formed. If holes are accumulated inside the semiconductor device, the presence of the accumulated holes causes dielectric breakdown. In the semiconductor device of the invention, holes are discharged to the outside of the device thorough the second layer 42 and the source electrode 38, and accumulation of holes can be prevented.
    • 半导体器件由由AlGaN构成的第一层32,由GaN构成的第二层42,栅电极34,源电极38和漏电极28形成。 第一层32具有形成在栅电极34和第二层42之间的区域32a。 在第一层32和第二层42的边界24附近形成沟道。 第二层42具有p型导电性并且与源电极38接触。当电子在沟道中流动时,电子与周围的原子碰撞,形成孔。 如果在半导体器件内部积聚有孔,则积聚的孔的存在引起介质击穿。 在本发明的半导体器件中,通过第二层42和源电极38将孔排放到器件的外部,并且可以防止空穴的累积。