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1. 发明授权

US08664738B2 Solid-state imaging apparatus having a translucent member 有权
标题翻译：具有半透明构件的固体摄像装置
公开(公告)号：US08664738B2
公开(公告)日：2014-03-04
申请号：US13369889
申请日：2012-02-09
申请人： Ken Sugahara , Satoru Takahashi
发明人： Ken Sugahara , Satoru Takahashi
IPC分类号： H01L27/146
CPC分类号： H01L31/0203 , H01L27/14618 , H01L2924/0002 , H01L2924/00
摘要： A solid-state imaging apparatus including an insulating structural body having a through opening, a wiring part formed on a front surface of the structural body, a solid-state imaging element which is connected to the wiring part and also is attached to the structural body so as to close the through opening, a translucent member which is opposed to the solid-state imaging element and is attached to the structural body through an adhesive inside an adhesion region R so as to close the through opening, and a solder resist film with which at least a part of the front surface of the structural body is covered, and is characterized in that a region R0 in which the solder resist film is selectively removed is had in the adhesion region R and the removed region R0 is filled with the adhesive.
摘要翻译：一种固态成像装置，包括具有通孔的绝缘结构体，形成在结构体的前表面上的布线部分，固定成像元件，其连接到布线部分，并且还附接到结构体以便关闭通孔，该透光构件与固态成像元件相对并且通过粘合剂区域R内的粘合剂附着到结构体上以封闭通孔，并且具有阻焊膜其结构体的前表面的至少一部分被覆盖，其特征在于，在粘合区域R中具有其中选择性去除阻焊膜的区域R0，并且去除的区域R0填充有粘合剂。

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