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    • 1. 发明申请
    • ANTIBACTERIAL SURFACE AND METHOD OF FABRICATION
    • 抗菌表面和制造方法
    • US20110046747A1
    • 2011-02-24
    • US12706483
    • 2010-02-16
    • Kelvin Wai Kwok YeungKenneth Man Chee CheungKeith Dip Kei LukChe Yan YeungRichard Yi Tsun KaoPaul Kim Ho Chu
    • Kelvin Wai Kwok YeungKenneth Man Chee CheungKeith Dip Kei LukChe Yan YeungRichard Yi Tsun KaoPaul Kim Ho Chu
    • A61F2/28
    • A61L27/06A61L27/34A61L27/54A61L2300/25A61L2300/404A61L2300/602A61L2300/606C08L89/00
    • This invention involves a plasma treated and controllable release antimicrobial peptide coated titanium alloy for surgical implantation, where the alloy with antimicrobial properties is fabricated using surface techniques without adversely compromising its biocompatibility and original mechanical properties. The surface techniques form antimicrobial layers on the alloy capable of resisting microbial adhesion and proliferation, while allowing mammalian cell adhesion and proliferation when the alloy is implanted to human body. In one embodiment, PIII&D is applied to incorporate ions, electrons, free radicals, atoms or molecules on a titanium alloy substrate. A pressurized hydrothermal treatment can be carried out to establish reactive functional groups for antimicrobial purpose or for connecting the substrate and external antimicrobial molecules. An outermost layer of the titanium alloy includes antibacterial peptides possessing a controllable release mechanism, and is fabricated alone or in an assembly of the aforementioned basal surface layers. The controllable release mechanism is able to withstand long-term deep tissue infection after surgery, and in an embodiment comprises APTES as a linker molecule.
    • 本发明涉及用于手术植入的等离子体处理和可控释放的抗微生物肽包被的钛合金,其中具有抗微生物性质的合金使用表面技术制造而不会不利地损害其生物相容性和原始机械性能。 表面技术在能够抵抗微生物粘附和增殖的合金上形成抗微生物层,同时当将合金植入人体时允许哺乳动物细胞粘附和增殖。 在一个实施方案中,应用PIII和D将离子,电子,自由基,原子或分子掺入钛合金基底上。 可以进行加压水热处理以建立用于抗微生物目的的反应性官能团或用于连接底物和外部抗微生物分子。 钛合金的最外层包括具有可控释放机构的抗菌肽,并且单独制造或在上述基础表面层的组装中制造。 可释放机制能够经受手术后的长期深部组织感染,并且在一个实施方案中包含作为连接分子的APTES。
    • 3. 发明申请
    • NICKEL COMPLEXES FOR FLEXIBLE TRANSISTORS AND INVERTERS
    • 用于柔性晶体管和逆变器的镍系复合物
    • US20120276687A1
    • 2012-11-01
    • US13097656
    • 2011-04-29
    • Vellaisamy A. L. RoyZong-Xiang XuPaul Kim Ho ChuTat Kun Kwok
    • Vellaisamy A. L. RoyZong-Xiang XuPaul Kim Ho ChuTat Kun Kwok
    • H01L51/40C07F15/04
    • H01L51/0083H01L51/0003H01L51/0051H01L51/0084H01L51/0512H01L51/0533H01L51/0558H01L51/105
    • The design and synthesis of six nickel charge transfer (CT) complexes are described herein. The six nickel CT complexes have a nickel center, two organic ligands coordinated with the nickel center to form a dianionic square planar supramolecule and an organic counter-cation. The ligands and counter-cations are selected to optimize properties, such as molecular alignment, film morphology, and molecular packaging. Described herein, the ligands can be 2,3-pyrazinedithiol (L1), 1,2-benzenedithol (L2) or 2,3-quinoxalinedithol (L3) and the counter-cations can be diquat (2,2′-ebpy) or methyl viologen (4,4′-mbpy). The six nickel CT complexes can also be utilized semiconductor devices, such as thin film transistors or inverters. Processes are also provided for the fabrication of semiconductors devices. The processes can include fabricating a substrate with a bilayer octadecylphosphonic acid (ODPA)/Al2O3 dielectric and applying one of the six nickel charge transfer (CT) complexes to the substrate.
    • 本文描述了六种镍电荷转移(CT)复合物的设计和合成。 六个镍CT复合物具有镍中心,两个有机配体与镍中心配位以形成二离子正方形平面超分子和有机反应物。 选择配体和抗衡阳离子以优化特性,例如分子取向,膜形态和分子包装。 本文描述的配体可以是2,3-吡嗪二硫醇(L1),1,2-苯二酚(L2)或2,3-喹喔啉基二醇(L3),抗衡阳离子可以是二季铵盐(2,2'-ebpy)或 甲基紫精(4,4'-mbpy)。 六个镍CT复合体也可以用于薄膜晶体管或逆变器等半导体器件。 还提供了用于制造半导体器件的工艺。 这些方法可以包括用双层十八烷基膦酸(ODPA)/ Al 2 O 3电介质制造衬底,并将六种镍电荷转移(CT)复合物中的一种施加到衬底上。
    • 4. 发明授权
    • Nickel complexes for flexible transistors and inverters
    • 镍复合物用于柔性晶体管和逆变器
    • US08981096B2
    • 2015-03-17
    • US13097656
    • 2011-04-29
    • Vellaisamy A. L. RoyZong-Xiang XuPaul Kim Ho ChuTat Kun Kwok
    • Vellaisamy A. L. RoyZong-Xiang XuPaul Kim Ho ChuTat Kun Kwok
    • C07D241/38H01L51/00H01L51/05
    • H01L51/0083H01L51/0003H01L51/0051H01L51/0084H01L51/0512H01L51/0533H01L51/0558H01L51/105
    • The design and synthesis of six nickel charge transfer (CT) complexes are described herein. The six nickel CT complexes have a nickel center, two organic ligands coordinated with the nickel center to form a dianionic square planar supramolecule and an organic counter-cation as represented by The ligands and counter-cations are selected to optimize properties, such as molecular alignment, film morphology, and molecular packaging. Described herein, the ligands can be 2,3-pyrazinedithiol (L1), 1,2-benzenedithol (L2) or 2,3-quinoxalinedithol (L3) and the counter-cations can be diquat (2,2′-ebpy) or methyl viologen (4,4′-mbpy). The six nickel CT complexes can also be utilized semiconductor devices, such as thin film transistors or inverters. Processes are also provided for the fabrication of semiconductors devices. The processes can include fabricating a substrate with a bilayer octadecylphosphonic acid (ODPA)/Al2O3 dielectric and applying one of the six nickel charge transfer (CT) complexes to the substrate.
    • 本文描述了六种镍电荷转移(CT)复合物的设计和合成。 六个镍CT复合物具有镍中心,两个有机配体与镍中心配位以形成二阴离子正方形平面超分子和由“配体”和“反阳离子”所表示的有机抗衡阳离子,以优化特性,如分子对准 ,膜形态和分子包装。 本文描述的配体可以是2,3-吡嗪二硫醇(L1),1,2-苯二酚(L2)或2,3-喹喔啉基二醇(L3),抗衡阳离子可以是二季铵盐(2,2'-ebpy)或 甲基紫精(4,4'-mbpy)。 六个镍CT复合体也可以用于薄膜晶体管或逆变器等半导体器件。 还提供了用于制造半导体器件的工艺。 这些方法可以包括用双层十八烷基膦酸(ODPA)/ Al 2 O 3电介质制造衬底,并将六种镍电荷转移(CT)复合物中的一种施加到衬底上。