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1. 发明申请

US20060006760A1 Surface acoustic wave device, its manufacturing method, and electronic circuit device 有权
标题翻译：声表面波装置及其制造方法和电子电路装置
公开(公告)号：US20060006760A1
公开(公告)日：2006-01-12
申请号：US11220815
申请日：2005-09-07
申请人： Akihiko Namba , Keiji Onishi , Yasuhiro Sugaya , Katsunori Moritoki
发明人： Akihiko Namba , Keiji Onishi , Yasuhiro Sugaya , Katsunori Moritoki
IPC分类号： H01L41/04
CPC分类号： H03H9/0542 , H01L21/568 , H01L21/6835 , H01L24/97 , H01L2224/16 , H01L2224/16245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01021 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/16235 , H01L2924/181 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , H03H3/08 , H03H9/059 , H03H9/1085 , H03H9/1092 , Y10T29/42 , Y10T29/49005 , Y10T29/49144 , Y10T29/49146 , Y10T29/49158 , Y10T29/49171 , H01L2224/81 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A surface acoustic wave device which occupies a small mounting area and has a low profile, yet having an improved reliability, and can be made available at low cost. The surface acoustic wave device comprises a piezoelectric substrate, a function region formed of comb-like electrodes for exciting surface acoustic wave provided on a main surface of the piezoelectric substrate, a space formation member covering the function region, a plurality of bump electrodes provided on a main surface of the piezoelectric substrate and a terminal electrode provided opposed to the main surface of piezoelectric substrate. The bump electrode and the terminal electrode are having a direct electrical connection, and a space between piezoelectric substrate and terminal electrode is filled with resin. When the above-configured acoustic wave device is applied for a frequency filter, a resonator, in a portable telephone unit, a keyless entry or the like communication apparatus, the overall size of such apparatus can be reduced and a higher reliability is implemented.
摘要翻译：表面声波装置占据小的安装面积并且具有低轮廓，但具有改进的可靠性，并且可以以低成本获得。表面声波装置包括压电基板，由用于激发设置在压电基板的主表面上的表面声波的梳状电极形成的功能区域，覆盖该功能区域的空间形成部件，设置在该功能区域上的多个凸块电极压电基板的主表面和与压电基板的主表面相对设置的端子电极。突起电极和端子电极具有直接的电连接，并且压电基板和端子电极之间的空间填充有树脂。当将上述构造的声波装置应用于频率滤波器，便携式电话单元中的谐振器，无钥匙进入等通信装置时，可以减少这种装置的总体尺寸并实现更高的可靠性。

2. 发明授权

US06969945B2 Surface acoustic wave device, method for manufacturing, and electronic circuit device 有权
标题翻译：表面声波装置，制造方法和电子电路装置
公开(公告)号：US06969945B2
公开(公告)日：2005-11-29
申请号：US10399305
申请日：2002-02-06
申请人： Akihiko Namba , Keiji Onishi , Yasuhiro Sugaya , Katsunori Moritoki
发明人： Akihiko Namba , Keiji Onishi , Yasuhiro Sugaya , Katsunori Moritoki
IPC分类号： H01L21/68 , H03H3/08 , H03H9/05 , H01L41/08
CPC分类号： H03H9/0542 , H01L21/568 , H01L21/6835 , H01L24/97 , H01L2224/16 , H01L2224/16245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01021 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/16235 , H01L2924/181 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , H03H3/08 , H03H9/059 , H03H9/1085 , H03H9/1092 , Y10T29/42 , Y10T29/49005 , Y10T29/49144 , Y10T29/49146 , Y10T29/49158 , Y10T29/49171 , H01L2224/81 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A surface acoustic wave device which occupies a small mounting area and has a low profile, yet having an improved reliability, and can be made available at low cost. The surface acoustic wave device comprises a piezoelectric substrate, a function region formed of comb-like electrodes for exciting surface acoustic wave provided on a main surface of the piezoelectric substrate, a space formation member covering the function region, a plurality of bump electrodes provided on a main surface of the piezoelectric substrate and a terminal electrode provided opposed to the main surface of piezoelectric substrate. The bump electrode and the terminal electrode are having a direct electrical connection, and a space between piezoelectric substrate and terminal electrode is filled with resin. When the above-configured acoustic wave device is applied for a frequency filter, a resonator, in a portable telephone unit, a keyless entry or the like communication apparatus, the overall size of such apparatus can be reduced and a higher reliability is implemented.
摘要翻译：表面声波装置占据小的安装面积并且具有低轮廓，但具有改进的可靠性，并且可以以低成本获得。表面声波装置包括压电基板，由用于激发设置在压电基板的主表面上的表面声波的梳状电极形成的功能区域，覆盖该功能区域的空间形成部件，设置在该功能区域上的多个凸块电极压电基板的主表面和与压电基板的主表面相对设置的端子电极。突起电极和端子电极具有直接的电连接，并且压电基板和端子电极之间的空间填充有树脂。当将上述构造的声波装置应用于频率滤波器，便携式电话机中的谐振器，无钥匙进入等通信装置时，可以减少这种装置的总体尺寸并实现更高的可靠性。

3. 发明授权

US07246421B2 Method for manufacturing surface acoustic wave device 有权
标题翻译：声表面波装置的制造方法
公开(公告)号：US07246421B2
公开(公告)日：2007-07-24
申请号：US11220815
申请日：2005-09-07
申请人： Akihiko Namba , Keiji Onishi , Yasuhiro Sugaya , Katsunori Moritoki
发明人： Akihiko Namba , Keiji Onishi , Yasuhiro Sugaya , Katsunori Moritoki
IPC分类号： H04R17/00 , H01L41/00
CPC分类号： H03H9/0542 , H01L21/568 , H01L21/6835 , H01L24/97 , H01L2224/16 , H01L2224/16245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01021 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/16235 , H01L2924/181 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , H03H3/08 , H03H9/059 , H03H9/1085 , H03H9/1092 , Y10T29/42 , Y10T29/49005 , Y10T29/49144 , Y10T29/49146 , Y10T29/49158 , Y10T29/49171 , H01L2224/81 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A surface acoustic wave device which occupies a small mounting area and has a low profile, yet having an improved reliability, and can be made available at low cost. The surface acoustic wave device comprises a piezoelectric substrate, a function region formed of comb-like electrodes for exciting surface acoustic wave provided on a main surface of the piezoelectric substrate, a space formation member covering the function region, a plurality of bump electrodes provided on a main surface of the piezoelectric substrate and a terminal electrode provided opposed to the main surface of piezoelectric substrate. The bump electrode and the terminal electrode are having a direct electrical connection, and a space between piezoelectric substrate and terminal electrode is filled with resin. When the above-configured acoustic wave device is applied for a frequency filter, a resonator, in a portable telephone unit, a keyless entry or the like communication apparatus, the overall size of such apparatus can be reduced and a higher reliability is implemented.
摘要翻译：表面声波装置占据小的安装面积并且具有低轮廓，但具有改进的可靠性，并且可以以低成本获得。表面声波装置包括压电基板，由用于激发设置在压电基板的主表面上的表面声波的梳状电极形成的功能区域，覆盖该功能区域的空间形成部件，设置在该功能区域上的多个凸块电极压电基板的主表面和与压电基板的主表面相对设置的端子电极。突起电极和端子电极具有直接的电连接，并且压电基板和端子电极之间的空间填充有树脂。当将上述构造的声波装置应用于频率滤波器，便携式电话单元中的谐振器，无钥匙进入等通信装置时，可以减少这种装置的总体尺寸并实现更高的可靠性。

4. 发明授权

US06590293B2 Electronic component, having projection electrodes and methods for manufacturing thereof 失效
标题翻译：具有投影电极的电子部件及其制造方法
公开(公告)号：US06590293B2
公开(公告)日：2003-07-08
申请号：US10055609
申请日：2002-01-25
申请人： Keiji Onishi , Akihiko Namba , Katsunori Moritoki
发明人： Keiji Onishi , Akihiko Namba , Katsunori Moritoki
IPC分类号： H01L2348
CPC分类号： H03H3/08 , H01L23/315 , H01L24/11 , H01L24/13 , H01L2224/05548 , H01L2224/05573 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/16 , H01L2224/274 , H01L2224/45144 , H01L2224/75743 , H01L2224/83191 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/15787 , H01L2924/19043 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2224/05624
摘要： An electronic component includes a projection electrode to be bonded to a circuit board. The projection electrode is prevented from being contaminated or oxidized during a period from manufacturing of the electronic component until mounting of the component to the circuit board. Methods of manufacturing the electronic component and an electronic circuit device are also provided. The electronic component includes the projection electrode formed on a connection terminal on a substrate having a circuit element and a protective film for covering the circuit element and the projection electrode. The projection electrode is prevented from being contaminated or oxidized since the manufacturing of the electronic component until mounting thereof to the circuit board, and reliable bonding of the projection electrode to a connection terminal of the circuit board can be realized.
摘要翻译：电子部件包括要接合到电路板的投影电极。在从电子部件的制造到部件安装到电路基板的期间，防止投影电极被污染或氧化。还提供了制造电子部件和电子电路装置的方法。电子部件包括形成在具有电路元件的基板上的连接端子上的投影电极和用于覆盖电路元件和投影电极的保护膜。由于电子部件的制造直到安装到电路板，并且可以实现投影电极与电路板的连接端子的可靠接合，因此防止了投影电极被污染或氧化。

5. 发明授权

US06710682B2 Surface acoustic wave device, method for producing the same, and circuit module using the same 有权
标题翻译：声表面波装置及其制造方法以及使用其的电路模块
公开(公告)号：US06710682B2
公开(公告)日：2004-03-23
申请号：US09971102
申请日：2001-10-03
申请人： Keiji Onishi , Akihiro Nanba , Hiroki Sato , Katsunori Moritoki , Yoshihiro Bessho , Kunihiro Fujii , Kouzou Murakami
发明人： Keiji Onishi , Akihiro Nanba , Hiroki Sato , Katsunori Moritoki , Yoshihiro Bessho , Kunihiro Fujii , Kouzou Murakami
IPC分类号： H03H964
CPC分类号： H03H9/1085 , H01L2224/05573 , H01L2224/05624 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2924/15174 , H01L2924/181 , H03H9/02559 , H03H9/0542 , H03H9/0547 , H03H9/0557 , H03H9/059 , H03H9/1092 , Y10T29/42 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2224/05644 , H01L2224/05647 , H01L2924/013 , H01L2924/01029 , H01L2924/01079
摘要： A surface acoustic wave device of the present invention includes a piezoelectric substrate, a plurality of comb electrodes for exciting a surface acoustic wave, disposed on a principal plane of the piezoelectric substrate, a plurality of bumps disposed on the principal plane, and an insulating sheet disposed so as to be opposed to the principal plane, wherein the bumps and the comb electrodes are connected electrically to each other, and the bumps penetrate through the insulating sheet.
摘要翻译：本发明的声表面波装置包括：压电基板，设置在压电基板的主面上的多个用于激励表面声波的梳形电极，设置在主平面上的多个凸块和绝缘片被设置为与主平面相对，其中凸块和梳电极彼此电连接，并且凸块穿过绝缘片。

6. 发明授权

US07170215B2 Electronic component and method for manufacturing the same 失效
标题翻译：电子元件及其制造方法
公开(公告)号：US07170215B2
公开(公告)日：2007-01-30
申请号：US10865125
申请日：2004-06-10
申请人： Akihiko Namba , Keiji Onishi , Katsu Takeda
发明人： Akihiko Namba , Keiji Onishi , Katsu Takeda
IPC分类号： H01L41/08
CPC分类号： H03H9/564 , B41J2002/14266 , H03H3/04 , H03H9/173 , H03H9/174 , H03H9/175 , H03H2003/0435 , H03H2003/0478 , Y10T29/42 , Y10T29/49005 , Y10T29/49128 , Y10T29/4913 , Y10T29/49135
摘要： An electronic component includes a substrate; a piezoelectric material layer supported directly or indirectly by the substrate; a first electrode arranged on a surface of the piezoelectric material layer on an opposite side of the substrate; and a second electrode arranged on a surface of the piezoelectric material layer on the substrate side. The piezoelectric material layer is sandwiched between the first electrode and the second electrode. The first electrode has a smaller surface area than the piezoelectric material layer. A portion where the piezoelectric material layer is exposed from the first electrode includes a portion that is thinner than a thickness of the piezoelectric material layer between the first electrode and the second electrode. Thus, it is possible to configure a resonator with a higher frequency than its ordinary resonance, and it is easy to achieve an adjustment of the resonance frequency of the resonator, as well as improving the yield of the component and enabling the configuration of an electronic component that includes a plurality of resonators of different frequencies.
摘要翻译：电子部件包括基板; 由衬底直接或间接支撑的压电材料层; 布置在所述压电材料层的与所述基板相反的一侧的表面上的第一电极; 以及设置在基板侧的压电体层的表面上的第二电极。压电材料层夹在第一电极和第二电极之间。第一电极具有比压电材料层更小的表面积。压电材料层从第一电极露出的部分包括比第一电极和第二电极之间的压电材料层的厚度薄的部分。因此，可以构成具有比其普通谐振更高的频率的谐振器，并且容易实现谐振器的谐振频率的调节，以及提高元件的产量并且能够构造电子该组件包括多个不同频率的谐振器。

7. 发明授权

US07370396B2 Method for manufacturing an electronic component 失效
标题翻译：电子部件的制造方法
公开(公告)号：US07370396B2
公开(公告)日：2008-05-13
申请号：US11564142
申请日：2006-11-28
申请人： Akihiko Namba , Keiji Onishi , Katsu Takeda
发明人： Akihiko Namba , Keiji Onishi , Katsu Takeda
IPC分类号： H01L41/22 , H01L41/00
CPC分类号： H03H9/564 , B41J2002/14266 , H03H3/04 , H03H9/173 , H03H9/174 , H03H9/175 , H03H2003/0435 , H03H2003/0478 , Y10T29/42 , Y10T29/49005 , Y10T29/49128 , Y10T29/4913 , Y10T29/49135
摘要： An electronic component includes a substrate; a piezoelectric material layer supported directly or indirectly by the substrate; a first electrode arranged on a surface of the piezoelectric material layer on an opposite side of the substrate; and a second electrode arranged on a surface of the piezoelectric material layer on the substrate side. The piezoelectric material layer is sandwiched between the first electrode and the second electrode. The first electrode has a smaller surface area than the piezoelectric material layer. A portion where the piezoelectric material layer is exposed from the first electrode includes a portion that is thinner than a thickness of the piezoelectric material layer between the first electrode and the second electrode. Thus, it is possible to configure a resonator with a higher frequency than its ordinary resonance, and it is easy to achieve an adjustment of the resonance frequency of the resonator, as well as improving the yield of the component and enabling the configuration of an electronic component that includes a plurality of resonators of different frequencies.
摘要翻译：电子部件包括基板; 由衬底直接或间接支撑的压电材料层; 布置在所述压电材料层的与所述基板相反的一侧的表面上的第一电极; 以及设置在基板侧的压电体层的表面上的第二电极。压电材料层夹在第一电极和第二电极之间。第一电极具有比压电材料层更小的表面积。压电材料层从第一电极露出的部分包括比第一电极和第二电极之间的压电材料层的厚度薄的部分。因此，可以构成具有比其普通谐振更高的频率的谐振器，并且容易实现谐振器的谐振频率的调节，以及提高元件的产量并且能够构造电子分量，其包括多个不同频率的谐振器。

8. 发明授权

US06236141B1 Surface acoustic wave element 有权
标题翻译：表面声波元件
公开(公告)号：US06236141B1
公开(公告)日：2001-05-22
申请号：US09459107
申请日：1999-12-13
申请人： Hiroki Sato , Keiji Onishi , Akihiko Namba , Yutaka Taguchi , Yosihiro Tomita
发明人： Hiroki Sato , Keiji Onishi , Akihiko Namba , Yutaka Taguchi , Yosihiro Tomita
IPC分类号： H03H925
CPC分类号： H03H9/02834 , H03H3/10 , H03H9/02574 , H03H9/25
摘要： Disclosed is a SAW element with a propagation substrate that is a piezoelectric substrate. An auxiliary substrate is laminated on one surface of the propagation substrate by way of direct bonding, and a comb-shaped electrode is formed on another surface of the propagation substrate that is opposite the surface with the auxiliary substrate. The electrode excites an acoustic wave. The propagation substrate and the auxiliary substrate are not bonded to each other in at least a region immediately below a region where the comb-shaped electrode is formed. A coefficient of thermal expansion in a propagation direction of the acoustic wave of the auxiliary substrate is smaller than a coefficient of thermal expansion in a propagation direction of the acoustic wave of the propagation substrate.
摘要翻译：公开了具有作为压电基板的传播基板的SAW元件。辅助基板通过直接接合层叠在传播基板的一个表面上，并且梳状电极形成在传播基板的与辅助基板的表面相对的另一表面上。电极激发声波。传播基板和辅助基板在至少形成有梳状电极的区域的正下方的区域中不结合。辅助基板的声波的传播方向的热膨胀系数小于传播基板的声波的传播方向的热膨胀系数。

9. 发明授权

US5998907A Surface acoustic wave devices and their manufacturing method 失效
标题翻译：表面声波器件及其制造方法
公开(公告)号：US5998907A
公开(公告)日：1999-12-07
申请号：US087079
申请日：1998-05-29
申请人： Yutaka Taguchi , Kazuo Eda , Osamu Kawasaki , Yosihiro Tomita , Keiji Onishi , Shun-ichi Seki , Akihiko Namba , Hiroki Sato , Tetsuyosi Ogura
发明人： Yutaka Taguchi , Kazuo Eda , Osamu Kawasaki , Yosihiro Tomita , Keiji Onishi , Shun-ichi Seki , Akihiko Namba , Hiroki Sato , Tetsuyosi Ogura
IPC分类号： H03H9/145 , H03H9/02 , H03H9/25 , H03H9/64
CPC分类号： H03H9/02834 , H03H9/02574 , H03H9/02921
摘要： A surface acoustic wave device has a main substrate; a comb-like electrode formed on one of the main surfaces of said main substrate; and a supplementary substrate joined with the other main surface of said main substrate, wherein said supplementary substrate has a smaller thermal expansion coefficient and a larger thickness than said main substrate.
摘要翻译：表面声波装置具有主基板; 形成在所述主基板的一个主表面上的梳状电极; 以及与所述主基板的另一个主表面接合的辅助基板，其中所述辅助基板具有比所述主基板更小的热膨胀系数和更大的厚度。

10. 发明申请

US20070090731A1 ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译：电子元件及其制造方法
公开(公告)号：US20070090731A1
公开(公告)日：2007-04-26
申请号：US11564142
申请日：2006-11-28
申请人： Akihiko NAMBA , Keiji Onishi , Katsu Takeda
发明人： Akihiko NAMBA , Keiji Onishi , Katsu Takeda
IPC分类号： B44C1/22 , H01L41/00
CPC分类号： H03H9/564 , B41J2002/14266 , H03H3/04 , H03H9/173 , H03H9/174 , H03H9/175 , H03H2003/0435 , H03H2003/0478 , Y10T29/42 , Y10T29/49005 , Y10T29/49128 , Y10T29/4913 , Y10T29/49135
摘要： An electronic component includes a substrate; a piezoelectric material layer supported directly or indirectly by the substrate; a first electrode arranged on a surface of the piezoelectric material layer on an opposite side of the substrate; and a second electrode arranged on a surface of the piezoelectric material layer on the substrate side. The piezoelectric material layer is sandwiched between the first electrode and the second electrode. The first electrode has a smaller surface area than the piezoelectric material layer. A portion where the piezoelectric material layer is exposed from the first electrode includes a portion that is thinner than a thickness of the piezoelectric material layer between the first electrode and the second electrode. Thus, it is possible to configure a resonator with a higher frequency than its ordinary resonance, and it is easy to achieve an adjustment of the resonance frequency of the resonator, as well as improving the yield of the component and enabling the configuration of an electronic component that includes a plurality of resonators of different frequencies.
摘要翻译：电子部件包括基板; 由衬底直接或间接支撑的压电材料层; 布置在所述压电材料层的与所述基板相反的一侧的表面上的第一电极; 以及设置在基板侧的压电体层的表面上的第二电极。压电材料层夹在第一电极和第二电极之间。第一电极具有比压电材料层更小的表面积。压电材料层从第一电极露出的部分包括比第一电极和第二电极之间的压电材料层的厚度薄的部分。因此，可以构成具有比其普通谐振更高的频率的谐振器，并且容易实现谐振器的谐振频率的调节，以及提高元件的产量并且能够构造电子该组件包括多个不同频率的谐振器。

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