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1. 发明授权

US4026940A Process for producing alpha-sulfophenylacetic acid derivatives 失效
标题翻译： α-磺基苯基乙酸衍生物的制备方法
公开(公告)号：US4026940A
公开(公告)日：1977-05-31
申请号：US624285
申请日：1975-10-20
申请人： Keiichi Sugimoto , Koji Nishijima , Hiroshi Akimoto , Tadashi Hanaoka , Nobuharu Kakeya
发明人： Keiichi Sugimoto , Koji Nishijima , Hiroshi Akimoto , Tadashi Hanaoka , Nobuharu Kakeya
IPC分类号： C07C309/70 , C07D307/12 , C07C143/68
CPC分类号： C07C309/70 , C07D307/12
摘要： .alpha.-Sulfophenylacetic acid derivatives of the general formula: ##STR1## (wherein R is a substituted or unsubstituted primary alcohol, cyclic alcohol or phenol compound residue), which are of value as intermediates of antibacterial agents, are selectively produced in a high yield by bringing a diester compound of the general formula: ##STR2## (wherein R has the same meaning as defined above) into contact with a strong acid.
摘要翻译：通过以下方式选择性地制备具有下列通式的α-磺基苯乙酸衍生物：其中R为取代或未取代的伯醇，环醇或酚化合物残基）作为抗菌剂的中间体，以高产率由得到通式如下的二酯化合物：其中R与上述定义相同）与强酸接触。

2. 发明授权

US4057544A .alpha.-Alkylsulfobenzyl penicillins 失效
标题翻译： {60-烷基亚磺酰基青霉素
公开(公告)号：US4057544A
公开(公告)日：1977-11-08
申请号：US417527
申请日：1973-11-20
申请人： Keiichi Sugimoto , Koji Nishijima , Hiroshi Akimoto , Tadashi Hanaoka , Nobuharu Kakeya
发明人： Keiichi Sugimoto , Koji Nishijima , Hiroshi Akimoto , Tadashi Hanaoka , Nobuharu Kakeya
IPC分类号： C07D499/12 , A61K31/43 , A61P31/04 , C07D207/08 , C07D307/12 , C07D499/62 , C07D499/68 , C07D499/46
CPC分类号： C07D307/12 , C07D207/08
摘要： Novel penicillins of the formula ##STR1## wherein R is a branched chain alkyl group of from 3 to 14 carbon atoms, and their pharmaceutically acceptable salts, are easily absorbed in the blood and tissues through oral administration and show excellent antimicrobial activity against Gram-positive and Gram-negative bacteria, particularly against microorganisms of the genus Pseudomonas, such as Pseudomonas aeruginosa.
摘要翻译：其中R为3〜14个碳原子的支链烷基及其药学上可接受的盐的新型青霉素通过口服给药容易地吸收在血液和组织中，并显示出优异的抗革兰氏阳性的抗微生物活性和革兰氏阴性细菌，特别是针对假单胞菌属（Pseudomonas）的微生物，如铜绿假单胞菌（Pseudomonas aeruginosa）。

3. 发明授权

US4048158A d-.alpha.-Isobutylsulfobenzylpenicillin hemi-solvate crystals 失效
标题翻译： d- {60-异丁基磺苄苯青霉素半溶剂化物晶体
公开(公告)号：US4048158A
公开(公告)日：1977-09-13
申请号：US645913
申请日：1975-12-31
申请人： Keiichi Sugimoto , Koji Nishijima , Tadashi Hanaoka , Hiroshi Akimoto , Nobuharu Kakeya
发明人： Keiichi Sugimoto , Koji Nishijima , Tadashi Hanaoka , Hiroshi Akimoto , Nobuharu Kakeya
IPC分类号： C07D499/04 , C07D499/00 , C07D499/62
CPC分类号： C07D499/00
摘要： Novel d-.alpha.-isobutylsulfobenzylpenicillin hemi-solvate crystals of the formula: ##STR1## (wherein A is a solvent selected from the class consisting of alcohols, ketones, ethers and esters) have excellent antibacterial activities and improved stability in terms of shelf-life.
摘要翻译：下式的新型d-α-异丁基磺苄青霉素半溶剂化物晶体：其中A是选自醇，酮，醚和酯的溶剂，具有优异的抗菌活性和改善保质期的稳定性。

4. 发明授权

US3954826A Process for producing .alpha.-sulfophenylacetic acid derivatives 失效
标题翻译：生产{60-磺基苯基乙酸衍生物的方法
公开(公告)号：US3954826A
公开(公告)日：1976-05-04
申请号：US486835
申请日：1974-07-09
申请人： Keiichi Sugimoto , Koji Nishijima , Hiroshi Akimoto , Tadashi Hanaoka , Nobuharu Kakeya
发明人： Keiichi Sugimoto , Koji Nishijima , Hiroshi Akimoto , Tadashi Hanaoka , Nobuharu Kakeya
IPC分类号： C07C309/03 , C07C309/73 , C07D207/08 , C07D307/12 , C07D499/62 , C07C143/68
CPC分类号： C07D207/08 , C07C309/00 , C07D307/12
摘要： .alpha.-Sulfophenylacetic acid derivatives of the general formula: ##EQU1## (wherein R is a substituted or unsubsituted primary alcohol, cyclic alcohol or phenol compound residue), which are of value as intermediates of antibacterial agents, are selectively produced in a high yield by bringing a diester compound of the general formula: ##EQU2## (wherein R has the same meaning as defined above) into contact with a strong acid.
摘要翻译：选择性地以高产率制备具有通式为-CHCOOH | SO 3 R（其中R为取代或未取代的伯醇，环醇或酚化合物残基）的α-磺基苯乙酸衍生物，其为抗菌剂的中间体通过将具有通式：CH 3 | -CHCOO-C-CH 3 || SO 3 R CH 3（其中R具有与上述相同的含义）的二酯化合物与强酸接触。

5. 发明申请

US20100242273A1 Method of producing electronic device 有权
标题翻译：电子设备的制造方法
公开(公告)号：US20100242273A1
公开(公告)日：2010-09-30
申请号：US12661497
申请日：2010-03-18
申请人： Keiichi Sugimoto , Mitsuru Nakagawa
发明人： Keiichi Sugimoto , Mitsuru Nakagawa
IPC分类号： H05K3/30
CPC分类号： H05K3/284 , H01L21/565 , H01L2224/16227 , H01L2924/15313 , H05K3/3415 , H05K2203/1316 , H05K2203/1476 , H05K2203/1572 , Y02P70/613 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49165
摘要： A method of producing an electronic device includes a molding of a first casing to seal a first face of a circuit board and electronic parts mounted on the first face. The producing method further includes a mounting of electronic parts on a second face of the circuit board opposite from the first face, after the molding of the first casing is finished. The producing method further includes a molding of a second casing to seal the second face of the circuit board and the electronic parts mounted on the second face. The molding of the second casing integrates the first casing and the second casing with each other.
摘要翻译：电子设备的制造方法包括：密封电路板的第一面和安装在第一面上的电子部件的第一壳体的成型。该制造方法还包括在第一壳体的模制完成之后将电子部件安装在电路板的与第一面相对的第二面上。该制造方法还包括第二壳体的模制，以密封电路板的第二面和安装在第二面上的电子部件。第二壳体的模制将第一壳体和第二壳体彼此集成。

6. 发明授权

US07604765B2 Electronic circuit device and manufacturing method of the same 有权
标题翻译：电子电路装置及其制造方法相同
公开(公告)号：US07604765B2
公开(公告)日：2009-10-20
申请号：US11715392
申请日：2007-03-08
申请人： Keiichi Sugimoto , Mitsuru Nakagawa
发明人： Keiichi Sugimoto , Mitsuru Nakagawa
IPC分类号： B29C39/10 , B29C70/72
CPC分类号： B29C45/14065 , B29C45/14639 , H05K3/284 , H05K3/3405 , H05K5/0034 , H05K5/065 , H05K2201/09754 , H05K2201/1034 , H05K2203/1316
摘要： A casing of an electronic key transmitting and receiving apparatus is formed to seal entire bodies of circuit parts, a mounting face of a printed board, on which the circuit parts are mounted, and parts of terminals while the other parts of the terminals are exposed. A rear face of the printed board opposite from the mounting face provides a part of an outer surface of the casing. When the printed board is provided in the casing through an insert molding process, the printed board is held in a cavity of a molding die such that the rear face of the printed board closely contacts an inner face of the cavity. Accordingly, deformation of the printed board due to pressure caused when the resin is poured or when the resin hardens is inhibited.
摘要翻译：电子钥匙收发装置的壳体形成为密封电路部件的整体，安装有电路部件的印刷电路板的安装面以及端子的其他部分露出的部分端子。印刷电路板的与安装面相对的后表面提供了外壳的外表面的一部分。当通过插入成型工艺将印刷板设置在壳体中时，印刷板被保持在成型模具的空腔中，使得印刷板的后表面紧密接触空腔的内表面。因此，由于在树脂浇注时或当树脂硬化时引起的压力导致印刷基板的变形被抑制。

7. 发明申请

US20090086447A1 ELECTRONIC CIRCUIT DEVICE AND METHOD OF MAKING THE SAME 有权
标题翻译：电子电路装置及其制造方法
公开(公告)号：US20090086447A1
公开(公告)日：2009-04-02
申请号：US12243243
申请日：2008-10-01
申请人： Keiichi Sugimoto , Mitsuru Nakagawa
发明人： Keiichi Sugimoto , Mitsuru Nakagawa
IPC分类号： H05K3/30 , H05K5/00
CPC分类号： H05K3/303 , G07C9/00944 , H01L2924/1815 , H05K1/182 , H05K3/284 , H05K2201/10037 , H05K2201/10568 , H05K2201/10651 , H05K2201/10689 , H05K2201/2036 , Y02P70/613 , Y10T29/49146
摘要： A method of making an electronic circuit device includes preparing an electronic element having at least one projection, mounting the electronic element on only a first side of a circuit board in such a manner that the projection is substantially held in point contact with the first side of the circuit board to form a gap between the circuit board and the electronic element, placing the circuit board in a mold cavity in such a manner that a second side of the circuit board is held in close contact with an inner surface of the cavity. The method further includes encapsulating the circuit board in a casing by filling the cavity with a resin material so that the gap is filled with the resin material.
摘要翻译：一种制造电子电路装置的方法包括制备具有至少一个突起的电子元件，将电子元件仅安装在电路板的第一侧上，使得突出部基本上保持与第一侧点接触所述电路板在所述电路板和所述电子元件之间形成间隙，将所述电路板放置在模腔中，使得所述电路板的第二面与所述腔的内表面紧密接触。该方法还包括通过用树脂材料填充空腔将电路板封装在壳体中，使得间隙填充有树脂材料。

8. 发明申请

US20090086446A1 ELECTRONIC CIRCUIT DEVICE AND METHOD OF MAKING THE SAME 有权
标题翻译：电子电路装置及其制造方法
公开(公告)号：US20090086446A1
公开(公告)日：2009-04-02
申请号：US12243217
申请日：2008-10-01
申请人： Keiichi Sugimoto , Mitsuru Nakagawa
发明人： Keiichi Sugimoto , Mitsuru Nakagawa
IPC分类号： H05K7/02 , H01L21/56
CPC分类号： H05K5/065 , H01L2924/15159 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H05K3/284 , H05K2203/025 , H05K2203/1316
摘要： A method of making an electronic circuit device includes placing a circuit board in a cavity of a mold such that one side of the circuit board is held in close contact with an inner surface of the cavity, and encapsulating the circuit board in a casing by filling the cavity with a resin material. The one side of the circuit board is exposed to one side of an outer surface of the casing to define part of the one side of the outer surface of the casing. The method further includes thinning the casing by machining the entire one side of the outer surface of the casing.
摘要翻译：一种制造电子电路装置的方法包括将电路板放置在模具的空腔中，使得电路板的一侧保持与空腔的内表面紧密接触，并且通过填充将电路板封装在壳体中该腔用树脂材料。电路板的一侧暴露于壳体的外表面的一侧，以限定外壳的外表面的一侧的一部分。该方法还包括通过加工壳体的外表面的整个一侧来使壳体变薄。

9. 发明申请

US20060252384A1 Electronic circuit device and manufacturing method of the same 有权
公开(公告)号：US20060252384A1
公开(公告)日：2006-11-09
申请号：US11408076
申请日：2006-04-21
申请人： Keiichi Sugimoto , Mitsuru Nakagawa
发明人： Keiichi Sugimoto , Mitsuru Nakagawa
IPC分类号： H04B1/38
CPC分类号： B29C45/14065 , B29C45/14639 , H05K3/284 , H05K3/3405 , H05K5/0034 , H05K5/065 , H05K2201/09754 , H05K2201/1034 , H05K2203/1316
摘要： A casing of an electronic key transmitting and receiving apparatus is formed to seal entire bodies of circuit parts, a mounting face of a printed board, on which the circuit parts are mounted, and parts of terminals while the other parts of the terminals are exposed. A rear face of the printed board opposite from the mounting face provides a part of an outer surface of the casing. When the printed board is provided in the casing through an insert molding process, the printed board is held in a cavity of a molding die such that the rear face of the printed board closely contacts an inner face of the cavity. Accordingly, deformation of the printed board due to pressure caused when the resin is poured or when the resin hardens is inhibited.

10. 发明授权

US07046136B2 Portable transmitter having tact switches with front film 有权
标题翻译：便携式变送器，带有前膜的触觉开关
公开(公告)号：US07046136B2
公开(公告)日：2006-05-16
申请号：US10819962
申请日：2004-04-08
申请人： Keiichi Sugimoto , Mitsuru Nakagawa
发明人： Keiichi Sugimoto , Mitsuru Nakagawa
IPC分类号： G08B1/00
CPC分类号： H01H9/0235 , G05G1/02 , G07C9/00944 , H01H2009/0257 , H01H2223/003 , H01H2227/032 , H01H2231/032
摘要： An ID code is wirelessly sent to a device, such as a keyless-entry system or a keyless-starter system mounted on an automobile, from a portable transmitter. Electronic components including tact switches for transmitting signals are all contained in a resin case composed of a front case and a rear case connected to each other. Front openings are formed on the font case, and the tact switches are disposed in the resin case so that they face the respective front openings. The front openings are covered with a front film formed integrally with the front case. Function displays corresponding to the respective tact switches are printed on the rear surface of the front film. The tact switches are pushed from the front surface of the front film.
摘要翻译： ID码从便携式发射机无线发送到诸如无钥匙进入系统或安装在汽车上的无钥匙启动器系统的设备。包括用于发送信号的触觉开关的电子部件都包含在由彼此连接的前壳体和后壳体构成的树脂箱中。前开口形成在字体壳体上，并且触觉开关设置在树脂壳体中，使得它们面向相应的前开口。前开口用与前壳一体形成的前膜覆盖。对应于各个节拍开关的功能显示打印在前胶片的后表面上。触控开关从前胶片的前表面推出。

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