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1. 发明授权

US08029653B2 Electroplating apparatus and electroplating method 有权
标题翻译：电镀设备和电镀方法
公开(公告)号：US08029653B2
公开(公告)日：2011-10-04
申请号：US11708548
申请日：2007-02-21
申请人： Satoru Yamamoto , Keiichi Kurashina , Takashi Kawakami , Tsutomu Nakada , Hiroyuki Kanda , Junji Kunisawa , Kunihito Ide
发明人： Satoru Yamamoto , Keiichi Kurashina , Takashi Kawakami , Tsutomu Nakada , Hiroyuki Kanda , Junji Kunisawa , Kunihito Ide
IPC分类号： C25D17/00
CPC分类号： C25D17/001 , C25D5/18 , C25D7/123 , C25D17/004 , C25D17/008 , C25D17/12 , H01L21/6723
摘要： An electroplating apparatus can form a plated film having a more uniform thickness and good film quality over an entire surface of a substrate having a conductive layer (seed layer) whose resistivity is equal to or higher than that of copper. The electroplating apparatus includes: a substrate holder for holding a substrate; a sealing member for contact with a peripheral portion of a surface of a substrate, held by the substrate holder, to seal the peripheral portion; a cathode contact for contact with a conductive layer formed in the surface of the substrate, held by the substrate holder, to feed electricity to the conductive layer; and a housing having therein an anode to be immersed in a plating solution, and a porous structure disposed at an open end facing the substrate held by the substrate holder, said porous structure defining a plating chamber in the housing; wherein the plating chamber is divided into rooms by a partition plate and the porous structure, and the anode is comprised of a plurality of divided anodes, each divided anode being disposed in each room of the plating chamber so that each divided anode can pass an independent plating current.
摘要翻译：电镀装置可以在具有等于或高于铜的导电层（种子层）的基板的整个表面上形成具有更均匀的厚度和更好的膜质量的镀膜。电镀装置包括：用于保持基板的基板保持件; 密封构件，其与由所述基板保持件保持的基板的表面的周边部接触，以密封所述周边部; 阴极接触件，用于与由衬底保持器保持的衬底表面中形成的导电层接触，以将电力馈送到导电层; 以及壳体，其中具有要浸入电镀溶液中的阳极，以及设置在面向由所述基板保持件保持的所述基板的开口端的多孔结构，所述多孔结构在所述壳体中限定电镀室; 其特征在于，通过分隔板和多孔结构将电镀室分为室，阳极由多个分开的阳极组成，每个分隔的阳极设置在电镀室的每个房间中，使得每个分隔的阳极可以通过独立的电镀电流。

2. 发明申请

US20060113192A1 Plating device and planting method 审中-公开
标题翻译：电镀装置和种植方法
公开(公告)号：US20060113192A1
公开(公告)日：2006-06-01
申请号：US10543097
申请日：2004-01-22
申请人： Keiichi Kurashina , Keisuke Namiki , Tsutomu Nakada , Koji Mishima
发明人： Keiichi Kurashina , Keisuke Namiki , Tsutomu Nakada , Koji Mishima
IPC分类号： C25D21/12 , C25B9/00
CPC分类号： C25D5/06 , C25D7/123 , C25D17/001 , C25D17/14 , H01L21/2885
摘要： According to the present invention, there is provided a plating apparatus which can deposit a metal plated film such as a copper layer selectively in fine recesses for interconnects, such as trenches or via holes in a circuit form. The plating apparatus of the present invention includes an electrode head (701) having an anode (704), a plating solution impregnated material (703) for holding a plating solution, and a porous contact member (702) which is brought into contact with a surface of a substrate; a cathode electrode (712) which is brought into contact with the substrate to supply current to the substrate; a pressing mechanism (709) for pressing the porous contact member of the electrode head against the surface of the substrate under a desired pressure; a power source (723) for applying plating voltage between the anode and the cathode electrode; and a control unit (721) for correlating and controlling the state for pressing the porous contact member of the electrode head against the surface of the substrate, and the state of plating voltage applied between the anode and the cathode electrode.
摘要翻译：根据本发明，提供了一种电镀装置，其可以选择性地在诸如沟槽或电路形式的通孔之间的互连的细小凹槽中沉积诸如铜层的金属电镀膜。本发明的电镀装置包括具有阳极（704）的电极头（701），用于保持电镀液的电镀液浸渍材料（703）以及与电镀液接触的多孔接触部件（702）基材表面; 与基板接触以向基板提供电流的阴极电极（712）; 用于在所需压力下将电极头的多孔接触构件压靠在衬底的表面上的按压机构（709）用于在阳极和阴极之间施加电镀电压的电源（723）; 以及控制单元（721），用于将电极头的多孔接触构件相对于基板的表面按压和控制的状态以及施加在阳极和阴极之间的电镀电压的状态。

3. 发明授权

US09556533B2 Substrate processing apparatus and substrate processing method 有权
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US09556533B2
公开(公告)日：2017-01-31
申请号：US13572924
申请日：2012-08-13
申请人： Keiichi Kurashina , Tsutomu Nakada
发明人： Keiichi Kurashina , Tsutomu Nakada
IPC分类号： C25D5/08 , C25D7/12 , C25D17/02 , H01L21/288 , H01L21/768
CPC分类号： C25D17/02 , C25D5/08 , C25D7/123 , H01L21/2885 , H01L21/76877 , H01L21/76879
摘要： A substrate processing apparatus includes a plurality of inlet pipes and a plurality of outlet pipes, connected to a processing tank and configured to be switched therebetween to create a flow of a processing liquid in the processing tank in a direction different from that of the processing liquid before the switching. The inlet pipes and the outlet pipes are each provided with a flow control device which is controlled by a control section so that upon the switching, a flow rate of the processing liquid flowing therethrough changes with time.
摘要翻译：基板处理装置包括多个入口管和多个出口管，连接到处理槽并被配置为在其之间切换，以在处理槽中产生与处理液不同的方向的处理液流在切换之前。入口管和出口管各自设置有由控制部控制的流量控制装置，使得在切换时流过的处理液的流量随时间而变化。

4. 发明申请

US20090020434A1 Substrate processing method and substrate processing apparatus 审中-公开
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US20090020434A1
公开(公告)日：2009-01-22
申请号：US12216224
申请日：2008-07-01
申请人： Akira Susaki , Tsutomu Nakada , Satoru Yamamoto , Keiichi Kurashina , Hiroyuki Kanda
发明人： Akira Susaki , Tsutomu Nakada , Satoru Yamamoto , Keiichi Kurashina , Hiroyuki Kanda
IPC分类号： C25D3/58 , C25D3/38 , C25D17/00
CPC分类号： C25D3/38 , C25D5/10 , C25D5/34 , C25D17/001 , C25D21/00 , C25D21/12 , H01L21/2885 , H01L21/67005 , H01L21/67051 , H01L21/6715 , H01L21/68728 , H01L21/76843 , H01L21/76873 , H01L21/76877
摘要： A substrate processing method makes it possible to fill interconnect recesses, such as trenches, with a defect-free interconnect material by carrying out electroplating directly on a surface of a ruthenium film as a barrier layer. The substrate processing method comprises: providing a substrate having interconnect recesses formed in a substrate surface and having a ruthenium film formed in the entire substrate surface including interior surfaces of the interconnect recesses; keeping the substrate surface in contact with a plating solution for a predetermined time to adsorb an additive in the plating solution onto the ruthenium film, and then carrying out electroplating to form a conductive film on a surface of the ruthenium film.
摘要翻译：基板处理方法可以通过在作为阻挡层的钌膜的表面上直接进行电镀而用无缺陷的互连材料填充诸如沟槽的互连凹槽。基板处理方法包括：提供具有形成在基板表面中的互连凹槽并且在包括互连凹槽的内表面的整个基板表面中形成的钌膜的基板; 保持基板表面与电镀液接触预定的时间，以将镀液中的添加剂吸附到钌膜上，然后进行电镀以在钌膜的表面上形成导电膜。

5. 发明申请

US20080029398A1 Electroplating apparatus and electroplating method 有权
标题翻译：电镀设备和电镀方法
公开(公告)号：US20080029398A1
公开(公告)日：2008-02-07
申请号：US11708548
申请日：2007-02-21
申请人： Satoru Yamamoto , Keiichi Kurashina , Takashi Kawakami , Tsutomu Nakada , Hiroyuki Kanda , Junji Kunisawa , Kunihito Ide
发明人： Satoru Yamamoto , Keiichi Kurashina , Takashi Kawakami , Tsutomu Nakada , Hiroyuki Kanda , Junji Kunisawa , Kunihito Ide
IPC分类号： C25D5/00 , C25D17/00
CPC分类号： C25D17/001 , C25D5/18 , C25D7/123 , C25D17/004 , C25D17/008 , C25D17/12 , H01L21/6723
摘要： An electroplating apparatus can form a plated film having a more uniform thickness and good film quality over an entire surface of a substrate having a conductive layer (seed layer) whose resistivity is equal to or higher than that of copper. The electroplating apparatus includes: a substrate holder for holding a substrate; a sealing member for contact with a peripheral portion of a surface of a substrate, held by the substrate holder, to seal the peripheral portion; a cathode contact for contact with a conductive layer formed in the surface of the substrate, held by the substrate holder, to feed electricity to the conductive layer; and a housing having therein an anode to be immersed in a plating solution, and a porous structure disposed at an open end facing the substrate held by the substrate holder, said porous structure defining a plating chamber in the housing; wherein the plating chamber is divided into rooms by a partition plate and the porous structure, and the anode is comprised of a plurality of divided anodes, each divided anode being disposed in each room of the plating chamber so that each divided anode can pass an independent plating current.
摘要翻译：电镀装置可以在具有等于或高于铜的导电层（种子层）的基板的整个表面上形成具有更均匀的厚度和更好的膜质量的镀膜。电镀装置包括：用于保持基板的基板保持件; 密封构件，其与由所述基板保持件保持的基板的表面的周边部接触，以密封所述周边部; 阴极接触件，用于与由衬底保持器保持的衬底表面中形成的导电层接触，以将电力馈送到导电层; 以及壳体，其中具有要浸入电镀溶液中的阳极，以及设置在面向由所述基板保持件保持的所述基板的开口端的多孔结构，所述多孔结构在所述壳体中限定电镀室; 其特征在于，通过分隔板和多孔结构将电镀室分为室，阳极由多个分开的阳极组成，每个分隔的阳极设置在电镀室的每个房间中，使得每个分隔的阳极可以通过独立的电镀电流。

6. 发明申请

US20100163408A1 Plating apparatus and plating method 审中-公开
标题翻译：电镀装置及电镀方法
公开(公告)号：US20100163408A1
公开(公告)日：2010-07-01
申请号：US12659334
申请日：2010-03-04
申请人： Keiichi Kurashina , Tsutomu Nakada , Takashi Kawakami , Satoru Yamamoto , Keisuke Hayabusa
发明人： Keiichi Kurashina , Tsutomu Nakada , Takashi Kawakami , Satoru Yamamoto , Keisuke Hayabusa
IPC分类号： C25B9/00
CPC分类号： C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/7684 , H01L21/76877
摘要： A plating apparatus can form a plated film having a more uniform thickness over an entire surface of a substrate and can securely fill interconnect recesses with the metal without forming voids in the embedded metal even when the substrate has a high sheet resistance in the surface. The plating apparatus includes a substrate holder for holding a substrate, a cathode portion including a cathode for contact with the substrate held by the substrate holder to feed electricity to the substrate, and an anode, partly or wholly having a high resistance, disposed opposite a surface of the substrate held by the substrate holder, wherein plating of the surface of the substrate is carried out while filling between the anode and the substrate held by the substrate holder with a plating solution.
摘要翻译：电镀装置可以在基板的整个表面上形成具有更均匀厚度的镀膜，并且即使当基板在表面中具有高的薄层电阻时，也可以牢固地填充与金属的互连凹槽，而不会在嵌入的金属中形成空隙。电镀装置包括用于保持基板的基板保持器，包括用于与由基板保持器保持的基板接触的阴极以向基板供电的阴极部分，以及部分或全部具有高电阻的阳极，由衬底保持器保持的衬底的表面，其中在用电镀溶液填充阳极和由衬底保持器保持的衬底之间进行衬底的表面的电镀。

7. 发明申请

US20050051437A1 Plating apparatus and plating method 审中-公开
标题翻译：电镀装置及电镀方法
公开(公告)号：US20050051437A1
公开(公告)日：2005-03-10
申请号：US10932126
申请日：2004-09-02
申请人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Tsutomu Nakada
发明人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Tsutomu Nakada
IPC分类号： B05D5/12 , C25D5/00 , C25D7/12 , C25D17/00 , H01L21/288 , H01L21/768
CPC分类号： C25D7/123 , C25D5/003 , C25D17/001 , C25D17/002 , H01L21/2885 , H01L21/76877
摘要： A plating apparatus is used for filling a fine interconnect pattern formed in the substrate with metal to form interconnects. The plating apparatus includes a substrate holder for holding a substrate, a cathode portion including a sealing member for contacting a peripheral portion of a surface, to be plated, of the substrate held by said substrate holder to seal said peripheral portion water-tightly, and a cathode for contacting the substrate to supply current to the substrate, an anode vertically movably disposed so as to face the surface, to be plated, of the substrate, and a porous member disposed between said anode and the surface, to be plated, of the substrate, said porous member being made of a water-retentive material, wherein said porous member has at least a hydrophilic substrate-facing surface which faces the surface, to be plated, of the substrate.
摘要翻译：电镀装置用于用金属填充形成在衬底中的精细互连图案以形成互连。电镀装置包括用于保持基板的基板保持件，阴极部分，其包括用于接触由所述基板保持器保持的基板的要被电镀的表面的周边部分的密封构件，以密封所述周边部分的水密性;以及阴极，用于接触基板以向基板提供电流;阳极，其可垂直移动地设置成面对要被电镀的基板;以及多孔构件，设置在所述阳极和要被电镀的表面之间，所述多孔构件由保水材料制成，其中所述多孔构件至少具有面向要被电镀的表面的亲水性基底面向表面。

8. 发明申请

US20070238265A1 Plating apparatus and plating method 审中-公开
标题翻译：电镀装置及电镀方法
公开(公告)号：US20070238265A1
公开(公告)日：2007-10-11
申请号：US11396572
申请日：2006-04-04
申请人： Keiichi Kurashina , Tsutomu Nakada , Takashi Kawakami , Satoru Yamamoto , Keisuke Hayabusa
发明人： Keiichi Kurashina , Tsutomu Nakada , Takashi Kawakami , Satoru Yamamoto , Keisuke Hayabusa
IPC分类号： C25D3/00 , B05C9/08 , B32B15/04
CPC分类号： C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/7684 , H01L21/76877
摘要： A plating apparatus can form a plated film having a more uniform thickness over an entire surface of a substrate and can securely fill interconnect recesses with the metal without forming voids in the embedded metal even when the substrate has a high sheet resistance in the surface. The plating apparatus includes a substrate holder for holding a substrate, a cathode portion including a cathode for contact with the substrate held by the substrate holder to feed electricity to the substrate, and an anode, partly or wholly having a high resistance, disposed opposite a surface of the substrate held by the substrate holder, wherein plating of the surface of the substrate is carried out while filling between the anode and the substrate held by the substrate holder with a plating solution.
摘要翻译：电镀装置可以在基板的整个表面上形成具有更均匀厚度的镀膜，并且即使当基板在表面中具有高的薄层电阻时，也可以牢固地填充与金属的互连凹槽，而不会在嵌入的金属中形成空隙。电镀装置包括用于保持基板的基板保持器，包括用于与由基板保持器保持的基板接触的阴极以向基板供电的阴极部分，以及部分或全部具有高电阻的阳极，由衬底保持器保持的衬底的表面，其中在用电镀溶液填充阳极和由衬底保持器保持的衬底之间进行衬底的表面的电镀。

9. 发明申请

US20060086616A1 Plating apparatus and plating method 失效
标题翻译：电镀装置及电镀方法
公开(公告)号：US20060086616A1
公开(公告)日：2006-04-27
申请号：US11245490
申请日：2005-10-07
申请人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Shinya Morisawa , Junji Kunisawa , Kunihito Ide , Hidenao Suzuki , Emanuel Cooper , Philippe Vereecken , Brett Baker-O' Neal , Hariklia Deligianni
发明人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Shinya Morisawa , Junji Kunisawa , Kunihito Ide , Hidenao Suzuki , Emanuel Cooper , Philippe Vereecken , Brett Baker-O' Neal , Hariklia Deligianni
IPC分类号： C25D21/12 , C25B15/00
CPC分类号： C25D5/22 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/004 , C25D17/005 , C25D17/12 , C25D21/12 , H01L21/2885 , H01L21/7684 , H01L21/76849 , H01L21/76877
摘要： A plating apparatus can securely carry out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section.
摘要翻译：电镀装置可以可靠地进行基板的平坦化镀以形成具有平坦表面的镀膜而不使用昂贵的机构，并且不对基板施加额外的电镀。电镀装置包括：基板支架; 具有用于水密密封基板的周边部分的密封部件的阴极部分和用于向基板供给电流的阴极电极; 设置在面向所述基板的表面的位置的阳极; 设置在所述阳极和所述基板的表面之间的多孔构件; 恒定电压控制部分，用于以恒定值控制在所述阴极和所述阳极之间施加的电压; 以及电流监视部分，用于监视在阴极和阳极之间流动的电流，并将检测信号反馈到恒压控制部分。

10. 发明申请

US20050241946A1 Plating apparatus and plating method 失效
标题翻译：电镀装置及电镀方法
公开(公告)号：US20050241946A1
公开(公告)日：2005-11-03
申请号：US11016924
申请日：2004-12-21
申请人： Mizuki Nagai , Hiroyuki Kanda , Keiichi Kurashina , Satoru Yamamoto , Ryoichi Kimizuka , Hariklia Deligianni , Brett Baker , Keith Kwietniak , Panayotis Andricacos , Philippe Vereecken
发明人： Mizuki Nagai , Hiroyuki Kanda , Keiichi Kurashina , Satoru Yamamoto , Ryoichi Kimizuka , Hariklia Deligianni , Brett Baker , Keith Kwietniak , Panayotis Andricacos , Philippe Vereecken
IPC分类号： C25D3/38 , C25D5/00 , C25D5/02 , C25D5/08 , C25D5/18 , C25D7/12 , C25D17/00 , H01L21/288 , H01L21/768
CPC分类号： C25D3/38 , C25D5/02 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/007 , C25D17/008 , H01L21/2885 , H01L21/76877
摘要： A plating method is capable of mechanically and electrochemically preferentially depositing a plated film in fine interconnect recesses such as trenches and via holes, and depositing the plated film to a flatter surface. The plating method including: disposing a substrate having fine interconnect recesses such that a conductive layer faces an anode; disposing a porous member between the substrate and the anode; filling a plating solution between the substrate and the anode; and repeating a process of holding the conductive layer and the porous member in contact with each other and moving the conductive layer and the porous member relatively to each other, a process of passing an electric current between the conductive layer and the anode while keeping the conductive layer still with respect to the porous member, and a process of stopping the supply of the electric current between the conductive layer and the anode.
摘要翻译：电镀方法能够机械地和电化学地优先在诸如沟槽和通孔的精细互连凹槽中沉积镀膜，并将镀膜沉积到更平坦的表面上。电镀方法包括：设置具有导电层面向阳极的细微互连凹槽的衬底; 在基板和阳极之间设置多孔构件; 在基板和阳极之间填充电镀液; 并且重复保持导电层和多孔构件彼此接触并相对于彼此移动导电层和多孔构件的过程，使导电层和阳极之间的电流通过，同时保持导电相对于多孔构件的静止层，以及停止在导电层和阳极之间的电流的供给的处理。

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