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1. 发明授权

US06373000B1 Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board 有权
公开(公告)号：US06373000B1
公开(公告)日：2002-04-16
申请号：US09735893
申请日：2000-12-14
申请人： Kei Nakamura , Masakazu Sugimoto , Yasushi Inoue , Megumu Nagasawa , Takuji Okeyui , Masayuki Kaneto , Shinya Ota
发明人： Kei Nakamura , Masakazu Sugimoto , Yasushi Inoue , Megumu Nagasawa , Takuji Okeyui , Masayuki Kaneto , Shinya Ota
IPC分类号： H01R2372
摘要： A double-sided circuit board of which a solder conductor is prevented from deformation in a cycling test so as to maintain high connection reliability, comprises an insulating layer 2 made of an organic high molecular weight resin and a circuit 3 provided on each side of the insulating layer 2, the circuits 3 on both sides being electrically connected through via-holes filled with a conductor 4 made of solder having a metal powder 6 dispersed therein.

2. 发明授权

US06333469B1 Wafer-scale package structure and circuit board attached thereto 失效
标题翻译：晶圆尺寸的封装结构和电路板
公开(公告)号：US06333469B1
公开(公告)日：2001-12-25
申请号：US09353385
申请日：1999-07-15
申请人： Yasushi Inoue , Masakazu Sugimoto , Megumu Nagasawa , Takuji Okeyui , Kei Nakamura
发明人： Yasushi Inoue , Masakazu Sugimoto , Megumu Nagasawa , Takuji Okeyui , Kei Nakamura
IPC分类号： H05K116
CPC分类号： H01L24/94 , H01L23/3114 , H01L23/4985 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01061 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/15311 , H01L2924/00 , H01L2224/05599
摘要： A wafer-scale package structure in which a circuit board for rearranging electrode pads of a wafer is laminated on the wafer integrally. The circuit board can be divided into individual chip-size packages (CSPS) and which includes a layer of polyimide resin, and connection between the wafer and the circuit board is performed by solder bump, while the circuit board is stuck on the wafer with an adhesive.
摘要翻译：一种晶片级封装结构，其中用于重新排列晶片的电极焊盘的电路板一体地层压在晶片上。电路板可分为单个芯片尺寸封装（CSPS），其中包含一层聚酰亚胺树脂，晶圆与电路板之间的连接由焊锡凸块进行，而电路板则以胶粘剂。

3. 发明授权

US06335076B1 Multi-layer wiring board and method for manufacturing the same 有权
标题翻译：多层布线板及其制造方法
公开(公告)号：US06335076B1
公开(公告)日：2002-01-01
申请号：US09615761
申请日：2000-07-13
申请人： Kei Nakamura , Masakazu Sugimoto , Yasushi Inoue , Megumu Nagasawa , Takuji Okeyui
发明人： Kei Nakamura , Masakazu Sugimoto , Yasushi Inoue , Megumu Nagasawa , Takuji Okeyui
IPC分类号： B32B1508
CPC分类号： H05K3/462 , H05K3/4038 , H05K3/445 , H05K2201/0305 , H05K2201/09536 , Y10S428/901 , Y10T156/10 , Y10T428/24273 , Y10T428/24917 , Y10T428/266 , Y10T428/31681
摘要： A plurality of double-sided circuit boards 1 in which a circuit 4 is provided on either side of an insulating layer 3 comprising an organic high molecular resin with an alloy foil 2 as a basic substance, and two circuits 4 are electrically connected by a via with a soldered conductor 5a filled therein are laminated via an adhesive layer 6. The adhesive layer 6 has a bore opened at a predetermined position of a portion in direct contact with the circuits 4 of two double-sided circuit boards 1. A bore portion is provided with a soldered conductor 7. The circuits 4 of the two double-sided circuit boards 1 are electrically connected by the soldered conductor 7.
摘要翻译：多个双面电路板1，其中电路4设置在包含有合成箔2作为基本物质的有机高分子树脂的绝缘层3的两侧，以及两个电路4通过通孔其中填充有焊接导体5a通过粘合剂层6层压。粘合层6具有在与两个双面电路板1的电路4直接接触的部分的预定位置处开口的孔。孔部分设置有焊接导体7.两个双面电路板1的电路4由焊接导体7电连接。

4. 发明授权

US06462282B1 Circuit board for mounting bare chip 失效
标题翻译：用于安装裸芯片的电路板
公开(公告)号：US06462282B1
公开(公告)日：2002-10-08
申请号：US09338659
申请日：1999-06-23
申请人： Yasushi Inoue , Masakazu Sugimoto , Megumu Nagasawa , Kei Nakamura
发明人： Yasushi Inoue , Masakazu Sugimoto , Megumu Nagasawa , Kei Nakamura
IPC分类号： H05K116
CPC分类号： H05K1/0271 , H01L23/3164 , H01L23/49816 , H01L2924/0002 , H05K3/3436 , H05K3/3452 , H05K2201/068 , H05K2201/10416 , H05K2201/10674 , H01L2924/00
摘要： A circuit board for mounting a bare chip in the form of a flip chip. A metallic foil for protecting circuits in a state insulated therefrom is arranged in an area where the bare chip is located.
摘要翻译：用于以倒装芯片的形式安装裸芯片的电路板。用于保护与绝缘的状态的电路的金属箔布置在裸芯片所在的区域中。

5. 发明授权

US06310391B1 Mounted structure of circuit board and multi-layer circuit board therefor 失效
标题翻译：电路板和多层电路板的安装结构
公开(公告)号：US06310391B1
公开(公告)日：2001-10-30
申请号：US09334631
申请日：1999-06-17
申请人： Megumu Nagasawa , Masakazu Sugimoto , Yasushi Inoue , Kei Nakamura
发明人： Megumu Nagasawa , Masakazu Sugimoto , Yasushi Inoue , Kei Nakamura
IPC分类号： H01L23053
CPC分类号： H05K3/462 , H01L23/142 , H01L23/3677 , H01L23/5385 , H01L2224/16 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H05K1/0206 , H05K1/0207 , H05K3/28 , H05K3/4038 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0305 , H05K2201/068 , H05K2201/09536 , H05K2201/096 , H05K2201/10674 , H01L2924/00 , H01L2224/0401
摘要： The present invention provides a mounted structure of circuit board which can be prepared by a simple method and exhibits a good heat dissipation from chip and undergoes relaxed heat stress and a multi-layer circuit board to be incorporated in the mounted structure. A novel mounted structure of circuit board is provided comprising a core material embedded in an insulating layer, said core material having a metal layer with a heat conductivity of not less than 100 W/m·K provided on at least one side of an Ni—Fe alloy foil, said insulating layer comprising a wire conductor provided and a semiconductor element mounted on at least one side thereof, characterized in that a solder metal member for heat conduction is provided interposed between said semiconductor element and said core material so that said semiconductor element and said core material are connected to each other. The mounted structure of circuit board comprises a 6-layer circuit board 2 having a laminate of three sheets of double-sided circuit boards 1 and a chip 13 connected to a circuit 5 on the uppermost layer. The core material 3 embedded in the intraboard insulating layer 4 in various double-sided circuit board 1 comprises a copper layer 3a having a heat conductivity of 393 W/·K provided on at least one side of an Ni—Fe alloy foil 25. The chip 13 and the underlying core material 3 are connected to each other with a solder metal member 10. The core material 3 on the horizontally adjacent double-sided circuit boards 1 are similarly connected to each other with the solder metal member 10.
摘要翻译：本发明提供了一种电路板的安装结构，其可以通过简单的方法制备，并且显示出来自芯片的良好散热并经受松弛的热应力，并且将多层电路板并入安装的结构中。提供一种电路板的新型安装结构，其包括嵌入绝缘层中的芯材，所述芯材具有设置在Ni-Fe合金的至少一侧上的导热率不小于100W / mK的金属层箔，所述绝缘层包括设置的导线导体和安装在其至少一侧上的半导体元件，其特征在于，设置用于导热的焊料金属构件插入在所述半导体元件和所述芯材之间，使得所述半导体元件和所述芯材彼此连接。电路板的安装结构包括具有三片双面电路板1和连接到最上层电路5的芯片13的叠层的6层电路板2。在各种双面电路板1中嵌入在内部绝缘层4中的芯材3包括设置在Ni-Fe合金箔25的至少一侧上的导热率为393W / K.的铜层3a。芯片13和下面的芯材3通过焊料金属部件10彼此连接。水平相邻的双面电路板1上的芯材3类似地用焊料金属部件10彼此连接。

6. 发明授权

US06258449B1 Low-thermal expansion circuit board and multilayer circuit board 失效
标题翻译：低热膨胀电路板和多层电路板
公开(公告)号：US06258449B1
公开(公告)日：2001-07-10
申请号：US09328485
申请日：1999-06-09
申请人： Megumu Nagasawa , Masakazu Sugimoto , Yasushi Inoue , Kei Nakamura
发明人： Megumu Nagasawa , Masakazu Sugimoto , Yasushi Inoue , Kei Nakamura
IPC分类号： B32B300
CPC分类号： H01L23/5385 , H01L23/3735 , H01L23/5384 , H01L2924/0002 , H05K1/056 , H05K1/09 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K2201/0154 , H05K2201/0338 , H05K2201/09536 , Y10S428/901 , Y10T428/24917 , H01L2924/00
摘要： A low-thermal expansion circuit board comprising an insulating layer made of an organic polymer having thereon a wiring conductor for bare chip mounting, wherein the wiring conductor is an iron-nickel-based alloy layer having a copper layer on at least one side thereof; and a low-thermal expansion multilayer circuit board having a plurality of the low-thermal expansion circuit boards via an adhesive layer, the adhesive layer having through-holes filled with solder to connect the circuits layers.
摘要翻译：一种低热膨胀电路板，包括由有机聚合物制成的绝缘层，其上具有用于裸芯片安装的布线导体，其中所述布线导体是在其至少一侧上具有铜层的铁镍基合金层; 以及通过粘合剂层具有多个低热膨胀电路板的低热膨胀多层电路板，所述粘合剂层具有填充有焊料的通孔，以连接电路层。

7. 发明申请

US20060057454A1 Fuel cell 失效
标题翻译：燃料电池
公开(公告)号：US20060057454A1
公开(公告)日：2006-03-16
申请号：US10542618
申请日：2004-01-19
申请人： Megumu Nagasawa , Masao Abe
发明人： Megumu Nagasawa , Masao Abe
IPC分类号： H01M4/92 , H01M8/10
CPC分类号： H01M8/1004 , H01M4/8605 , H01M4/92
摘要： The invention provides a fuel cell which comprises a cathode and an anode arranged to sandwich a proton-conductive ion exchange electrolytic membrane, oxygen and hydrogen containing carbon monoxide being supplied to the cathode and the anode, respectively, in which the cathode comprises an electroconductive porous substrate which carries thereon platinum or a platinum alloy and a proton-conductive ion exchange electrolytic polymer, and the anode comprises an electroconductive porous substrate which carries thereon platinum or a platinum alloy and a proton-conductive ion exchange electrolytic polymer, and further at least the anode carries a proton-supplying material thereon.
摘要翻译：本发明提供了一种燃料电池，其包括阴极和阳极，其分别夹置质子传导离子交换电解膜，供给阴极和阳极的含氧和氢的一氧化碳，其中阴极包括导电多孔承载铂或铂合金的基板和质子传导离子交换电解聚合物，并且阳极包括承载有铂或铂合金的导电多孔基板和质子传导离子交换电解聚合物，并且还至少阳极在其上携带质子供应材料。

8. 发明授权

US5814894A Semiconductor device, production method thereof, and tape carrier for semiconductor device used for producing the semiconductor device 失效
标题翻译：半导体装置及其制造方法以及用于制造半导体装置的半导体装置用带载体
公开(公告)号：US5814894A
公开(公告)日：1998-09-29
申请号：US627996
申请日：1996-04-04
申请人： Kazumasa Igarashi , Megumu Nagasawa , Satoshi Tanigawa , Hideyuki Usui , Nobuhiko Yoshio , Hisataka Ito , Tadao Okawa
发明人： Kazumasa Igarashi , Megumu Nagasawa , Satoshi Tanigawa , Hideyuki Usui , Nobuhiko Yoshio , Hisataka Ito , Tadao Okawa
IPC分类号： C08G73/10 , H01L21/56 , H01L23/12 , H01L23/28 , H01L23/29 , H01L23/31 , H01L23/498
CPC分类号： H01L23/3121 , H01L21/563 , H01L23/293 , H01L23/49816 , H01L23/49827 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/73203 , H01L2224/73204 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15174 , H01L2924/15311
摘要： A semiconductor device capable of preventing the occurrence of defect of electroconductivity, wherein a semiconductor chip 1 equipped with electrodes 11 is mounted on an auxiliary wiring plate 2 in the state of facing the surface of the electrode 11 side, leading conductors 23 are disposed in the inside of the auxiliary wiring plate 2, one end of each leading conductor 23 forms an internal electrode 21 projecting from the surface of the auxiliary wiring plate 2 at the side of mounting the semiconductor chip 1, the other end of the leading conductor 23 forms an external electrode 22 projecting from the surface of the auxiliary wiring plate opposite to the side of mounting the semiconductor chip 1, and each of the internal electrodes 21 is connected to each of the electrodes 11 of the semiconductor chip 1, at least a gap between the semiconductor chip 1 and the auxiliary wiring plate 2 is encapsulated with a heat-welding polyimide resin layer.
摘要翻译：一种能够防止导电性缺陷发生的半导体器件，其中，在与电极11侧的表面相对的状态下，在辅助布线板2上安装有配备有电极11的半导体芯片1，将导体23设置在在辅助配线板2的内部，每个引导导体23的一端形成从辅助布线板2的表面在安装半导体芯片1侧突出的内部电极21，引出导体23的另一端形成从辅助配线板的与安装半导体芯片1的一侧相反的表面突出的外部电极22，并且每个内部电极21连接到半导体芯片1的每个电极11，至少在半导体芯片1和辅助布线板2用热焊接聚酰亚胺树脂层封装。

9. 发明授权

US08142956B2 Fuel cell 失效
标题翻译：燃料电池
公开(公告)号：US08142956B2
公开(公告)日：2012-03-27
申请号：US10542618
申请日：2004-01-19
申请人： Megumu Nagasawa , Masao Abe
发明人： Megumu Nagasawa , Masao Abe
IPC分类号： H01M4/86 , H01M8/10
CPC分类号： H01M8/1004 , H01M4/8605 , H01M4/92
摘要： The invention provides a fuel cell which comprises a cathode and an anode arranged to sandwich a proton-conductive ion exchange electrolytic membrane, oxygen and hydrogen containing carbon monoxide being supplied to the cathode and the anode, respectively, in which the cathode comprises an electroconductive porous substrate which carries thereon platinum or a platinum alloy and a proton-conductive ion exchange electrolytic polymer, and the anode comprises an electroconductive porous substrate which carries thereon platinum or a platinum alloy and a proton-conductive ion exchange electrolytic polymer, and further at least the anode carries a proton-supplying material thereon.
摘要翻译：本发明提供了一种燃料电池，其包括阴极和阳极，其分别夹置质子传导离子交换电解膜，供给阴极和阳极的含氧和氢的一氧化碳，其中阴极包括导电多孔承载铂或铂合金的基板和质子传导离子交换电解聚合物，并且阳极包括承载有铂或铂合金的导电多孔基板和质子传导离子交换电解聚合物，并且还至少阳极在其上携带质子供应材料。

10. 发明申请

US20100039591A1 CROSSLINKED PRODUCT, COLOR CORRECTION FILTER, OPTICAL ELEMENT, IMAGE DISPLAY, AND LIQUID CRYSTAL DISPLAY 审中-公开
标题翻译：交错产品，彩色校正过滤器，光学元件，图像显示和液晶显示
公开(公告)号：US20100039591A1
公开(公告)日：2010-02-18
申请号：US12526531
申请日：2008-02-25
申请人： Megumu Nagasawa , Michie Sakamoto
发明人： Megumu Nagasawa , Michie Sakamoto
IPC分类号： G02F1/1335 , C08K5/3432 , C08K5/353 , C08K5/17 , C08K5/3415 , C08K5/3437 , C08K5/47 , G02B5/23 , G02B5/22
CPC分类号： G02B5/223 , G02F1/133509 , G02F1/133609
摘要： A crosslinked product with excellent durability is provided that can remove intermediate colors of light while preventing brightness from deteriorating and thereby can improve color tone representation. The crosslinked product of the present invention includes a J aggregate of a dye and is characterized in that the dye is at least one dye selected from the group consisting of cyanine, merocyanine, squarylium, and porphyrin, the J aggregate of the dye is formed in a matrix resin, and the matrix resin has been crosslinked.
摘要翻译：提供了具有优异的耐久性的交联产物，其可以在防止亮度劣化的同时去除中间颜色的光，从而可以改善色调表示。本发明的交联产物包括染料的J骨料，其特征在于染料是选自花青，部花青，方酸ium卟啉和卟啉中的至少一种染料，染料的J骨料形成于基质树脂，并且基质树脂已经交联。

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