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    • 7. 发明授权
    • Method of manufacturing semiconductor thin film
    • 制造半导体薄膜的方法
    • US08080450B2
    • 2011-12-20
    • US12596453
    • 2007-12-05
    • Kazuyuki SugaharaNaoki NakagawaShinsuke YuraToru TakeguchiTomoyuki IrizumiKazushi YamayoshiAtsuhiro Sono
    • Kazuyuki SugaharaNaoki NakagawaShinsuke YuraToru TakeguchiTomoyuki IrizumiKazushi YamayoshiAtsuhiro Sono
    • H01L21/84H01L21/00H01L21/205
    • H01L21/02675H01L21/02532H01L27/1285H01L27/1296H01L29/04H01L29/0657
    • On a translucent substrate, an insulating film having a refractive index n and an amorphous silicon film are deposited successively. By irradiating the amorphous silicon film with a laser beam having a beam shape of a band shape extending along a length direction with a wavelength λ, a plurality of times from a side of amorphous silicon film facing the insulating film, while an irradiation position of the laser beam is shifted each of the plurality of times in a width direction of the band shape by a distance smaller than a width dimension of the band shape, a polycrystalline silicon film is formed from the amorphous silicon film. Forming the polycrystalline silicon film forms crystal grain boundaries which extend in the width direction and are disposed at a mean spacing measured along the length direction and ranging from (λ/n)×0.95 to (λ/n)×1.05 inclusive, and crystal grain boundaries which, in a region between crystal grain boundaries adjacent to each other and extending in the width direction, extend in the length direction and are disposed at a mean spacing measured along the width direction and ranging from (λ/n)×0.95 to (λ/n)×1.05 inclusive.
    • 在半透明基板上,依次沉积具有折射率n的绝缘膜和非晶硅膜。 通过从具有波长λ方向的波长形状的波束形状的激光束照射非晶硅膜,从非晶硅膜的与绝缘膜相对的侧面多次, 激光束在带状的宽度方向上多次移动距离小于带状的宽度尺寸的距离,由非晶硅膜形成多晶硅膜。 形成多晶硅膜形成在宽度方向上延伸的晶粒边界,并且以沿长度方向测量的平均间隔设置,范围为(λ/ n)×0.95〜(λ/ n)×1.05, 在彼此相邻并且在宽度方向上延伸的晶粒边界之间的区域中,在长度方向上延伸并沿宽度方向测量的平均间隔设置在(λ/ n)×0.95〜( λ/ n)×1.05(含)。
    • 10. 发明授权
    • Thin film transistor device and method of manufacturing the same
    • 薄膜晶体管器件及其制造方法
    • US07541646B2
    • 2009-06-02
    • US11673773
    • 2007-02-12
    • Hitoshi NagataTakao SakamotoNaoki Nakagawa
    • Hitoshi NagataTakao SakamotoNaoki Nakagawa
    • H01L21/84
    • H01L29/4908H01L27/1248H01L29/66757H01L29/78636
    • A thin film transistor device according to an embodiment of the invention includes: a thin film transistor having a silicon layer including a source region, a drain region, and a channel region, a gate insulating layer, and a gate electrode formed on an insulating substrate; an interlayer insulating layer covering the thin film transistor; a line electrically connected with the source region, the drain region, and the gate electrode through a contact hole formed in the interlayer insulating layer; a first upper insulating layer covering the line and the interlayer insulating layer and smoothing out stepped portions of the line and irregularities of a surface of the interlayer insulating layer; and a second upper insulating layer covering the first upper insulating layer, the second upper insulating layer having a hydrogen diffusion coefficient smaller than a hydrogen diffusion coefficient of the first upper insulating layer.
    • 根据本发明实施例的薄膜晶体管器件包括:薄膜晶体管,其具有包括源极区,漏极区和沟道区的硅层,栅极绝缘层和形成在绝缘基板上的栅电极 ; 覆盖薄膜晶体管的层间绝缘层; 通过形成在所述层间绝缘层中的接触孔与所述源极区,所述漏极区和所述栅电极电连接的线; 覆盖所述线和所述层间绝缘层的第一上绝缘层,并平滑所述线的台阶部分和所述层间绝缘层的表面的不规则性; 以及覆盖所述第一上绝缘层的第二上绝缘层,所述第二上绝缘层的氢扩散系数小于所述第一上绝缘层的氢扩散系数。