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    • 9. 发明授权
    • Silicon carbide bipolar semiconductor device
    • 碳化硅双极半导体器件
    • US08154026B2
    • 2012-04-10
    • US12097019
    • 2006-12-13
    • Ryosuke IshiiKoji NakayamaYoshitaka SugawaraToshiyuki MiyanagiHidekazu TsuchidaIsaho KamataTomonori Nakamura
    • Ryosuke IshiiKoji NakayamaYoshitaka SugawaraToshiyuki MiyanagiHidekazu TsuchidaIsaho KamataTomonori Nakamura
    • H01L29/15
    • H01L29/1604H01L21/0465H01L21/047H01L29/0615H01L29/0619H01L29/0661H01L29/1608H01L29/6606H01L29/66068H01L29/8613
    • In a SiC bipolar semiconductor device with a mesa structure having a SiC drift layer of a first conductive type and a SiC carrier injection layer of a second conductive type that are SiC epitaxial layers grown from a surface of a SiC single crystal substrate, the formation of stacking faults and the expansion of the area thereof are prevented and thereby the increase in forward voltage is prevented. Further, a characteristic of withstand voltage in a reverse biasing is improved. An forward-operation degradation preventing layer is formed on a mesa wall or on a mesa wall and a mesa periphery to separate spatially the surface of the mesa wall from a pn-junction interface. In one embodiment, the forward-operation degradation preventing layer is composed of a silicon carbide low resistance layer of a second conductive type that is equipotential during the application of a reverse voltage. In another embodiment, the forward-operation degradation preventing layer is composed of a silicon carbide conductive layer of a second conductive type, and a metal layer that is equipotential during the application of a reverse voltage is formed on a surface of the silicon carbide conductive layer. In still another embodiment, the forward-operation degradation preventing layer is composed of a high resistance amorphous layer.
    • 在具有由SiC单晶衬底的表面生长的SiC外延层的具有第一导电类型的SiC漂移层和第二导电类型的SiC载流子注入层的台阶结构的SiC双极型半导体器件中,形成 防止堆垛层错及其面积的膨胀,从而防止正向电压的增加。 此外,提高了反向偏置中的耐受电压的特性。 在台面壁或台面壁和台面周边上形成正向操作降解防止层,以在空间上分离台面壁的表面与pn结界面。 在一个实施例中,正向操作降解防止层由在施加反向电压期间具有等电位的第二导电类型的碳化硅低电阻层构成。 在另一个实施方案中,正向操作降解防止层由第二导电类型的碳化硅导电层构成,并且在施加反向电压期间具有等电位的金属层形成在碳化硅导电层的表面上 。 在另一个实施方案中,正向操作降解防止层由高电阻非晶层组成。