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1. 发明申请

US20100014263A1 LIQUID RESIN COMPOSITION FOR ELECTRONIC PART SEALING, AND ELECTRONIC PART APPARATUS UTILIZING THE SAME 有权
标题翻译：用于电子部件密封的液体树脂组合物和使用其的电子部件装置
公开(公告)号：US20100014263A1
公开(公告)日：2010-01-21
申请号：US12444449
申请日：2007-09-28
申请人： Satoru Tsuchida , Shinsuke Hagiwara , Kazuyoshi Tendou
发明人： Satoru Tsuchida , Shinsuke Hagiwara , Kazuyoshi Tendou
IPC分类号： H01R9/00 , B32B5/16 , C08L63/00
CPC分类号： H01L23/293 , C08G59/4035 , C08G59/5033 , H01L21/563 , H01L23/295 , H01L2224/73203 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01087 , H01L2924/09701 , H01L2924/1301 , H01L2924/13034 , Y10T428/249994 , Y10T428/25 , H01L2924/00 , H01L2924/00014
摘要： The present invention provides a liquid resin composition for electronic part sealing that is good in fluidity in a narrow gap, being free from void generation, and that excels in fillet formation; and an electronic part apparatus sealed thereby of high reliability (moisture resistance and thermal shock resistance). The liquid resin composition for electronic part sealing is characterized by comprising (A) an epoxy resin including a liquid epoxy resin, (B) a hardening agent including a liquid aromatic amine, (C) a hydrazide compound having an average particle diameter of less than 2 μm, and (D) an inorganic filler having an average particle diameter of less than 2 μm.
摘要翻译：本发明提供一种电子部件密封用液体树脂组合物，其在狭窄的间隙中流动性好，无空洞产生，且成形性优异; 以及由此可靠地（耐湿性和耐热冲击性）密封的电子部件装置。电子部件密封用液态树脂组合物的特征在于：（A）包含液体环氧树脂的环氧树脂，（B）包含液体芳族胺的硬化剂，（C）平均粒径小于（D）平均粒径小于2μm的无机填料。

2. 发明授权

US07981977B2 Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler 有权
标题翻译：环氧树脂，芳香胺，促进剂和无机填料的电子密封胶
公开(公告)号：US07981977B2
公开(公告)日：2011-07-19
申请号：US12096445
申请日：2006-12-08
申请人： Kazuyoshi Tendou , Satoru Tsuchida , Shinsuke Hagiwara
发明人： Kazuyoshi Tendou , Satoru Tsuchida , Shinsuke Hagiwara
IPC分类号： C08K3/36 , C08L63/00 , C08L63/02 , H01L23/29
CPC分类号： C08G59/063 , C08G59/5033 , C08G59/686 , C08L63/00 , C08L83/04 , H01L23/293 , H01L2924/0002 , H01L2924/09701 , C08L83/00 , H01L2924/00
摘要： The invention relates to a liquid resin composition for electronic components which is used in sealing of electronic components, comprising a liquid epoxy resin, a curing agent containing a liquid aromatic amine, and an inorganic filler, and further comprising at least one member selected from a hardening accelerator, silicone polymer particles, and a nonionic surfactant. There is thereby provided a liquid resin composition for electronic components, which is excellent in fluidity in narrow gaps, is free of void generation, is excellent in adhesiveness and low-stress characteristic and is excellent in fillet formation, as well as an electronic component device having high reliability (moisture resistance, thermal shock resistance), which is sealed therewith.
摘要翻译：本发明涉及一种电子部件用液体树脂组合物，其用于电子部件的密封，包括液体环氧树脂，含有液体芳香胺的固化剂和无机填料，并且还包含至少一种选自硬化促进剂，硅氧烷聚合物颗粒和非离子表面活性剂。由此，提供了一种电子部件用液态树脂组合物，其狭窄间隙的流动性优异，无空隙生成，粘合性和低应力特性优异，成形性优异，电子部件装置具有高密度的可靠性（耐湿性，耐热冲击性）。

3. 发明授权

US07982322B2 Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the same 有权
标题翻译：用于电子部件密封的液体树脂组合物和使用该液体树脂组合物的电子部件装置
公开(公告)号：US07982322B2
公开(公告)日：2011-07-19
申请号：US12444449
申请日：2007-09-28
申请人： Satoru Tsuchida , Shinsuke Hagiwara , Kazuyoshi Tendou
发明人： Satoru Tsuchida , Shinsuke Hagiwara , Kazuyoshi Tendou
IPC分类号： H01L23/29
CPC分类号： H01L23/293 , C08G59/4035 , C08G59/5033 , H01L21/563 , H01L23/295 , H01L2224/73203 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01087 , H01L2924/09701 , H01L2924/1301 , H01L2924/13034 , Y10T428/249994 , Y10T428/25 , H01L2924/00 , H01L2924/00014
摘要： The present invention provides a liquid resin composition for electronic part sealing that is good in fluidity in a narrow gap, being free from void generation, and that excels in fillet formation; and an electronic part apparatus sealed thereby of high reliability (moisture resistance and thermal shock resistance). The liquid resin composition for electronic part sealing is characterized by comprising (A) an epoxy resin including a liquid epoxy resin, (B) a hardening agent including a liquid aromatic amine, (C) a hydrazide compound having an average particle diameter of less than 2 μm, and (D) an inorganic filler having an average particle diameter of less than 2 μm.
摘要翻译：本发明提供一种电子部件密封用液体树脂组合物，其在狭窄的间隙中流动性好，无空洞产生，且成形性优异; 以及由此可靠地（耐湿性和耐热冲击性）密封的电子部件装置。电子部件密封用液态树脂组合物的特征在于：（A）包含液体环氧树脂的环氧树脂，（B）包含液体芳族胺的硬化剂，（C）平均粒径小于 2μm，（D）平均粒径小于2μm的无机填料。

4. 发明申请

US20090273070A1 Liquid Resin Composition for Electronic Components and Electronic Component Device 有权
标题翻译：电子元件和电子元器件液体树脂组合物
公开(公告)号：US20090273070A1
公开(公告)日：2009-11-05
申请号：US12096445
申请日：2006-12-08
申请人： Kazuyoshi Tendou , Satoru Tsuchida , Shinsuke Hagiwara
发明人： Kazuyoshi Tendou , Satoru Tsuchida , Shinsuke Hagiwara
IPC分类号： H01L23/29 , H01L23/31 , H01L23/498 , C09D163/00 , C09D163/02 , C09D163/04
CPC分类号： C08G59/063 , C08G59/5033 , C08G59/686 , C08L63/00 , C08L83/04 , H01L23/293 , H01L2924/0002 , H01L2924/09701 , C08L83/00 , H01L2924/00
摘要： The invention relates to a liquid resin composition for electronic components which is used in sealing of electronic components, comprising a liquid epoxy resin, a curing agent containing a liquid aromatic amine, and an inorganic filler, and further comprising at least one member selected from a hardening accelerator, silicone polymer particles, and a nonionic surfactant. There is thereby provided a liquid resin composition for electronic components, which is excellent in fluidity in narrow gaps, is free of void generation, is excellent in adhesiveness and low-stress characteristic and is excellent in fillet formation, as well as an electronic component device having high reliability (moisture resistance, thermal shock resistance), which is sealed therewith.
摘要翻译：本发明涉及一种电子部件用液体树脂组合物，其用于电子部件的密封，包括液体环氧树脂，含有液体芳香胺的固化剂和无机填料，并且还包含至少一种选自硬化促进剂，硅氧烷聚合物颗粒和非离子表面活性剂。由此，提供了一种电子部件用液态树脂组合物，其狭窄间隙的流动性优异，无空隙生成，粘合性和低应力特性优异，成形性优异，电子部件装置具有高密度的可靠性（耐湿性，耐热冲击性）。

5. 发明授权

US5965248A Magnetic recording medium 失效
标题翻译：磁记录介质
公开(公告)号：US5965248A
公开(公告)日：1999-10-12
申请号：US996882
申请日：1997-12-23
申请人： Akira Saitoh , Yutaka Takahashi , Satoru Tsuchida
发明人： Akira Saitoh , Yutaka Takahashi , Satoru Tsuchida
IPC分类号： G11B5/706
CPC分类号： G11B5/70621 , Y10S428/90 , Y10T428/256
摘要： A magnetic recording medium having excellent electromagnetic characteristics in the medium and high frequency regions has a magnetic layer formed on a non-magnetic support or a non-magnetic under layer, said magnetic layer comprising a magnetic metal powder containing iron (Fe) as a main component, 18 to 40% by weight of Co based on iron, Al and Y or a rare earth element, and having a specific surface area (x) by the BET method not exceeding 60 m.sup.2 /g, in which said magnetic metal powder has a saturation magnetization (.sigma.s) (y) and a specific surface area (x) by the BET method within the range bounded by the following four equations:y=0.05x.sup.2 -6x+330 (1)y=0.05x.sup.2 -6x+310 (2)y=x+126 (3)y=x+104 (4)
摘要翻译：在中高频区域具有优异电磁特性的磁记录介质具有形成在非磁性载体或非磁性底层上的磁性层，所述磁性层包括以铁（Fe）为主体的磁性金属粉末 18〜40重量％的基于铁，Al和Y的Co或稀土元素，并且通过BET法的比表面积（x）不超过60m 2 / g，其中所述磁性金属粉末具有在由以下四个等式限定的范围内通过BET法得到的饱和磁化强度（sigma s）（y）和比表面积（x）：y = 0.05x2-6x + 330（1）y = 0.05x2-6x + 310（2）y = x + 126（3）y = x + 104（4）

6. 发明授权

US5641840A Epoxy resin composition for sealing photosemiconductor element and photosemiconductor device sealed with the epoxy resin composition 失效
标题翻译：用于密封光半导体元件和光半导体器件的环氧树脂组合物用环氧树脂组合物密封
公开(公告)号：US5641840A
公开(公告)日：1997-06-24
申请号：US649014
申请日：1996-05-16
申请人： Satoru Tsuchida , Masahiko Osaka , Kouzou Hirokawa , Yasuaki Nakamura
发明人： Satoru Tsuchida , Masahiko Osaka , Kouzou Hirokawa , Yasuaki Nakamura
IPC分类号： C08G59/62 , C08G59/18 , C08G59/32 , C08L63/00 , H01L23/29 , H01L23/31 , C08G59/14
CPC分类号： H01L23/293 , C08G59/182 , C08G59/32 , H01L2924/0002
摘要： An epoxy resin composition for sealing a photosemiconductor element includes(A) an epoxy resin component which comprises an epoxy resin having at least three epoxy groups per molecule,(B) a phenolic resin component which is represented by the following general formula (I) and has a phenolic hydroxyl group equivalent weight (g/eq) of 200 to 800, and(C) a cure accelerator component, ##STR1## wherein n is an integer of from 0 to 14, the phenolic resin component being a mixture of at least two phenolic resins represented by the general formula (I) with at least two different values of n, the resin with n=0 being not more than 20% by weight of the phenolic resin component;and a photosemiconductor device is sealed with the epoxy resin composition.
摘要翻译：用于密封光半导体元件的环氧树脂组合物包括（A）环氧树脂组分，其包含每分子具有至少三个环氧基的环氧树脂，（B）由以下通式（I）表示的酚醛树脂组分和酚羟基当量（g / eq）为200〜800，（C）固化促进剂成分，其中n为0〜14的整数，酚醛树脂成分是由通式（I）表示的至少两种酚醛树脂与n至少两个不同值的混合物，n = 0的树脂不超过酚醛树脂组分的20重量％; 用环氧树脂组合物密封光半导体装置。

7. 发明授权

US06632881B1 Encapsulant of epoxy resin and liquid aromatic amine curing agent 有权
标题翻译：环氧树脂和液体芳香胺固化剂的包封剂
公开(公告)号：US06632881B1
公开(公告)日：2003-10-14
申请号：US09526529
申请日：2000-03-16
申请人： Satoru Tsuchida , Masahiko Osaka , Masatsugu Ogata
发明人： Satoru Tsuchida , Masahiko Osaka , Masatsugu Ogata
IPC分类号： C08K336
CPC分类号： H01L23/293 , C08G59/5033 , C08L21/00 , C08L63/00 , H01L24/50 , H01L2924/12044 , H01L2924/1301 , H01L2924/14 , H01L2924/351 , C08L2666/24 , H01L2924/00
摘要： An encapsulating epoxy resin composition comprising an epoxy resin which is liquid at normal temperature, a curing agent containing an aromatic amine which is liquid at normal temperature, an inorganic filler, and rubber particles; an encapsulant comprising this composition; and an electronic device having an encapsulating member comprising a cured product of this encapsulant.
摘要翻译：包含在常温下为液态的环氧树脂的封装环氧树脂组合物，含有常温液体的芳香胺，无机填料和橡胶颗粒的固化剂; 包含该组合物的密封剂; 以及具有包含该密封剂的固化产物的封装构件的电子器件

8. 发明授权

US06586086B1 Magnetic recording medium and making method 失效
标题翻译：磁记录介质及制作方法
公开(公告)号：US06586086B1
公开(公告)日：2003-07-01
申请号：US09660407
申请日：2000-09-12
申请人： Satoru Tsuchida
发明人： Satoru Tsuchida
IPC分类号： G11B572
CPC分类号： G11B5/72 , G11B5/8408 , Y10T428/25 , Y10T428/265 , Y10T428/30
摘要： In a magnetic recording medium comprising a magnetic layer of 0.05-0.15 &mgr;m thick containing at least a magnetic powder and a binder on a non-magnetic substrate, a diamond-like carbon film of 5-30 nm thick is formed on the magnetic layer by plasma CVD, and a lubricating layer is formed thereon. The medium has improved friction properties and durability.
摘要翻译：在包含非磁性基板上至少含有磁性粉末和粘合剂的0.05-0.15μm厚的磁性层的磁记录介质中，通过在磁性层上形成5-30nm厚的类金刚石碳膜，等离子体CVD，形成润滑层。介质具有改善的摩擦性能和耐久性。

9. 发明授权

US5985954A Epoxy resin composition for sealing photo-semiconductor element and photo-semiconductor device sealed with the epoxy resin composition 失效
标题翻译：用于密封光半导体元件的环氧树脂组合物和用环氧树脂组合物密封的光电半导体器件
公开(公告)号：US5985954A
公开(公告)日：1999-11-16
申请号：US985208
申请日：1997-12-02
申请人： Satoru Tsuchida , Masahiko Osaka
发明人： Satoru Tsuchida , Masahiko Osaka
IPC分类号： C08L63/00 , C08G59/40 , C08K3/34 , C08L63/02 , C08L83/12 , H01L23/29 , H01L23/31 , H01L31/02 , H01L33/56
CPC分类号： C08L63/00
摘要： An epoxy resin composition for sealing a photo-semiconductor element, comprising(A) an epoxy resin,(B) a curing agent and(C) a polyether-modified silicone oil which is represented by the following general formula (1) ##STR1## wherein m, n and a are each independently a number of 1 or more, b is 0 or a positive number, and R is an alkyl group of 1 to 6 carbon atoms or H,and has a weight average molecular weight of 1,000 to 100,000, a silicone unit content {[(m+n+2)/(m+n+2+a+b+1)].times.100} of 10 to 60% and a polyether unit content {[(a+b+1)/(m+n+2+a+b+1)].times.100} of 40 to 90%and a photo-semiconductor device produced by sealing a photo-semiconductor element with the epoxy resin composition.
摘要翻译：一种用于密封光半导体元件的环氧树脂组合物，其包含（A）环氧树脂，（B）固化剂和（C）由以下通式（1）表示的聚醚改性的硅油，其中m， n和a各自独立地为1或更多数，b为0或正数，R为1至6个碳原子的烷基或H，重均分子量为1,000至100,000，硅氧烷单位含量{[（m + n + 2）/（m + n + 2 + a + b + 1）]×100}为10〜60％，聚醚单元含量{[（a + b + 1）/（m + n + 2 + a + b + 1）]×100}为40〜90％，通过用环氧树脂组合物密封光半导体元件而制造的光电半导体装置。

10. 发明授权

US6127039A Magnetic recording medium and a process for producing the same 有权
标题翻译：磁记录介质及其制造方法
公开(公告)号：US6127039A
公开(公告)日：2000-10-03
申请号：US235382
申请日：1999-01-22
申请人： Akira Saitoh , Akihiko Seki , Takayoshi Kuwajima , Satoru Tsuchida
发明人： Akira Saitoh , Akihiko Seki , Takayoshi Kuwajima , Satoru Tsuchida
IPC分类号： G11B5/702 , G11B5/73 , G11B5/735 , G11B5/738 , G11B5/84 , G11B5/842
CPC分类号： G11B5/735 , G11B5/8404 , Y10S428/90 , Y10T428/31609 , Y10T428/31935
摘要： A magnetic recording medium comprising a non-magnetic base having on at least one side a non-magnetic layer (undercoat) containing electron beam-curable resins which in turn is over-laid with a magnetic layer (topcoat) containing an iron (Fe) based magnetic powder, said magnetic layer having a glass transition temperature (Tg) of at least 65.degree. C. and said non-magnetic layer being an electron beam cured coating that is formed by coating the non-magnetic base with a non-magnetic coating mix containing electron beam curable resins, the yet to be cured coating having a glass transition temperature (Tg) of 30-53.degree. C. and said electron beam curable resins comprising an electron beam curable vinyl chloride based resin having a sulfur-containing polar group and an electron beam curable urethane resin having a phosphorus-containing polar group. Also disclosed is a process for producing the magnetic recording medium, which has good electromagnetic conversion characteristics in a high-frequency range and which can be manufactured at high production rate.
摘要翻译：一种磁记录介质，包括在至少一个侧面上具有含有电子束固化树脂的非磁性层（底涂层）的非磁性基底，该非磁性层又包含含有铁（Fe）的磁性层（面漆）所述磁性层的玻璃化转变温度（Tg）至少为65℃，所述非磁性层是通过用非磁性涂层涂覆非磁性基底形成的电子束固化涂层含有电子束固化树脂的混合物，尚待固化的涂层的玻璃化转变温度（Tg）为30-53℃，所述电子束固化树脂包含具有含硫极性基团的电子束固化氯乙烯基树脂和具有含磷极性基团的电子束固化性聚氨酯树脂。还公开了一种制造磁记录介质的方法，其在高频范围内具有良好的电磁转换特性，并且可以以高生产率制造。

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