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1. 发明授权

US07150781B2 Pyrophosphoric acid bath for use in copper-tin alloy plating 有权
标题翻译：焦磷酸浴用于铜锡合金电镀
公开(公告)号：US07150781B2
公开(公告)日：2006-12-19
申请号：US10520137
申请日：2003-05-20
申请人： Kazuya Urata , Kunio Tachibana , Naoyuki Oniwa , Mikiya Tajima , Yukio Ogawa
发明人： Kazuya Urata , Kunio Tachibana , Naoyuki Oniwa , Mikiya Tajima , Yukio Ogawa
IPC分类号： B22F7/00
CPC分类号： C25D3/58 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722
摘要： The invention relates to a pyrophosphoric acid bath for use in cyanogen-free copper-tin alloy plating that contains an additive (A) composed an amine derivative, an epihalohydrin and a glycidyl ether compound with ratios of epihalohydrin to glycidyl ether compound being 0.5–2 to 0.1–5 on mol basis, per 1 mol of the amine derivative, has a pH of 3 to 9, and optionally contains an additive (B) composed of an organic sulfonic acid and/or an organic sulfonic acid salt, and to a copper-tin alloy coating obtainable by using the bath. The invention provides a pyrophosphoric acid bath for use in copper-tin alloy plating of the cyanogen-free type utilizable on an industrial scale, particularly, capable of performing uniform treatment to exhibit low defective product generation rates even with the current density being incessantly changing between a high state and a low state, as a barrel plating method, and a copper-tin alloy coating obtainable by using the bath.
摘要翻译：本发明涉及一种用于无氰铜铜合金电镀的焦磷酸浴，其含有由表面卤代醇与缩水甘油醚化合物的比例为0.5-2的胺衍生物，表卤代醇和缩水甘油醚化合物组成的添加剂（A）相对于1摩尔的胺衍生物为0.1〜5摩尔，pH为3〜9，任选地含有由有机磺酸和/或有机磺酸盐构成的添加剂（B）铜 - 锡合金涂层可通过使用该浴来获得。本发明提供了一种用于工业规模可利用的无氰类型的铜 - 锡合金电镀的焦磷酸浴，特别是能够进行均匀处理以表现出低的缺陷产物产生速率，即使电流密度不断变化，高状态和低状态，作为滚镀方法，以及通过使用该浴可获得的铜 - 锡合金涂层。

2. 发明申请

US20050166790A1 Pyrophosphoric acid bath for use in copper-tin alloy plating 有权
标题翻译：焦磷酸浴用于铜锡合金电镀
公开(公告)号：US20050166790A1
公开(公告)日：2005-08-04
申请号：US10520137
申请日：2003-05-20
申请人： Kazuya Urata , Kunio Tachibana , Naoyuki Oniwa , Mikiya Tajima , Yukio Ogawa
发明人： Kazuya Urata , Kunio Tachibana , Naoyuki Oniwa , Mikiya Tajima , Yukio Ogawa
IPC分类号： C25D3/56 , C25D3/58 , B32B15/00 , C23C16/00
CPC分类号： C25D3/58 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722
摘要： The invention relates to a pyrophosphoric acid bath for use in cyanogen-free copper-tin alloy plating that contains an additive (A) composed an amine derivative, an epihalohydrin and a glycidyl ether compound with ratios of epihalohydrin to glycidyl ether compound being 0.5-2 to 0.1-5 on mol basis, per 1 mol of the amine derivative, has a pH of 3 to 9, and optionally contains an additive (B) composed of an organic sulfonic acid and/or an organic sulfonic acid salt, and to a copper-tin alloy coating obtainable by using the bath. The invention provides a pyrophosphoric acid bath for use in copper-tin alloy plating of the cyanogen-free type utilizable on an industrial scale, particularly, capable of performing uniform treatment to exhibit low defective product generation rates even with the current density being incessantly changing between a high state and a low state, as a barrel plating method, and a copper-tin alloy coating obtainable by using the bath.
摘要翻译：本发明涉及一种用于无氰铜铜合金电镀的焦磷酸浴，其含有由表面卤代醇与缩水甘油醚化合物的比例为0.5-2的胺衍生物，表卤代醇和缩水甘油醚化合物组成的添加剂（A）相对于1摩尔的胺衍生物为0.1〜5摩尔，pH为3〜9，任选地含有由有机磺酸和/或有机磺酸盐构成的添加剂（B）铜 - 锡合金涂层可通过使用该浴来获得。本发明提供了一种用于工业规模可利用的无氰类型的铜 - 锡合金电镀的焦磷酸浴，特别是能够进行均匀处理以表现出低的缺陷产物产生速率，即使电流密度不断变化，高状态和低状态，作为滚镀方法，以及通过使用该浴可获得的铜 - 锡合金涂层。

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