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1. 发明授权

US08482117B2 Semiconductor device with electronic component incorporation substrate 有权
标题翻译：具有电子元件结合衬底的半导体器件
公开(公告)号：US08482117B2
公开(公告)日：2013-07-09
申请号：US13181884
申请日：2011-07-13
申请人： Kazutaka Kobayashi , Tadashi Arai , Toshio Kobayashi
发明人： Kazutaka Kobayashi , Tadashi Arai , Toshio Kobayashi
IPC分类号： H01L23/04 , H01L23/28
CPC分类号： H01L23/5389 , H01L23/49827 , H01L23/49833 , H01L24/19 , H01L24/97 , H01L2224/04105 , H01L2224/16225 , H01L2224/16227 , H01L2224/97 , H01L2924/01029 , H01L2924/181 , H01L2224/81 , H01L2924/00
摘要： An electronic component incorporation substrate and a method for manufacturing the same that provide a high degree of freedom for selecting materials. An electronic component incorporation substrate includes a first structure, which has a substrate and an electronic component. The substrate includes a substrate body having first and second surfaces. A first wiring pattern is formed on the first surface and electrically connected to a second wiring pattern formed on the second surface through a through via. The electronic component is electrically connected to the first wiring pattern. The electronic component incorporation substrate includes a sealing resin, which seals the first structure, and a third wiring pattern, which is connected to the second wiring pattern through a second via.
摘要翻译：一种电子元件掺合基板及其制造方法，其提供高选择材料的自由度。电子元件并入基板包括具有基板和电子部件的第一结构。衬底包括具有第一和第二表面的衬底本体。第一布线图案形成在第一表面上，并且通过通孔电连接到形成在第二表面上的第二布线图案。电子部件电连接到第一布线图案。所述电子部件结合基板包括密封第一结构的密封树脂和通过第二通孔连接到第二布线图案的第三布线图案。

2. 发明申请

US20120013021A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDCUTOR DEVICE 有权
标题翻译：半导体器件及制造半导体器件的方法
公开(公告)号：US20120013021A1
公开(公告)日：2012-01-19
申请号：US13181884
申请日：2011-07-13
申请人： Kazutaka Kobayashi , Tadashi Arai , Toshio Kobayashi
发明人： Kazutaka Kobayashi , Tadashi Arai , Toshio Kobayashi
IPC分类号： H01L23/538 , H01L21/78 , H01L21/768
CPC分类号： H01L23/5389 , H01L23/49827 , H01L23/49833 , H01L24/19 , H01L24/97 , H01L2224/04105 , H01L2224/16225 , H01L2224/16227 , H01L2224/97 , H01L2924/01029 , H01L2924/181 , H01L2224/81 , H01L2924/00
摘要： An electronic component incorporation substrate and a method for manufacturing the same that provide a high degree of freedom for selecting materials. An electronic component incorporation substrate includes a first structure, which has a substrate and an electronic component. The substrate includes a substrate body having first and second surfaces. A first wiring pattern is formed on the first surface and electrically connected to a second wiring pattern formed on the second surface through a through via. The electronic component is electrically connected to the first wiring pattern. The electronic component incorporation substrate includes a sealing resin, which seals the first structure, and a third wiring pattern, which is connected to the second wiring pattern through a second via.
摘要翻译：一种电子元件掺合基板及其制造方法，其提供高选择材料的自由度。电子元件并入基板包括具有基板和电子元件的第一结构。衬底包括具有第一和第二表面的衬底本体。第一布线图案形成在第一表面上，并且通过通孔电连接到形成在第二表面上的第二布线图案。电子部件电连接到第一布线图案。所述电子部件结合基板包括密封所述第一结构的密封树脂和通过第二通孔连接到所述第二布线图案的第三布线图案。

3. 发明授权

US08610268B2 Semiconductor element, semiconductor element mounted board, and method of manufacturing semiconductor element 有权
标题翻译：半导体元件，半导体元件安装板以及半导体元件的制造方法
公开(公告)号：US08610268B2
公开(公告)日：2013-12-17
申请号：US13223531
申请日：2011-09-01
申请人： Kazutaka Kobayashi , Tadashi Arai , Takashi Kurihara
发明人： Kazutaka Kobayashi , Tadashi Arai , Takashi Kurihara
IPC分类号： H01L23/52 , H01L23/48
CPC分类号： H01L24/11 , H01L24/13 , H01L24/16 , H01L2224/1147 , H01L2224/11825 , H01L2224/11831 , H01L2224/1184 , H01L2224/11906 , H01L2224/13012 , H01L2224/13014 , H01L2224/13017 , H01L2224/13019 , H01L2224/13111 , H01L2224/13147 , H01L2224/13564 , H01L2224/1357 , H01L2224/13582 , H01L2224/13583 , H01L2224/13611 , H01L2224/13639 , H01L2224/13644 , H01L2224/13655 , H01L2224/13664 , H01L2224/16225 , H01L2224/81193 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/3841 , H01L2924/00014 , H01L2924/0103 , H01L2924/01083 , H01L2924/00 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00012
摘要： A semiconductor element includes connection terminals. The connection terminals are each shaped in such a manner that the transverse cross-sectional area in a portion near the leading end thereof decreases toward the leading end. Specifically, the shape of each of the connection terminals is columnar except for the portion near the leading end, and the side surface in the portion near the leading end of the connection terminal is shaped in a tapered form. Furthermore, a metal layer for improving a solder wettability may be formed at least on the side surface shaped in the tapered form, of the connection terminal.
摘要翻译：半导体元件包括连接端子。连接端子各自的形状使得其前端附近的部分的横截面积朝向前端减小。具体而言，连接端子的形状除了前端附近的部分为柱状，连接端子的前端部附近的侧面成形为锥形。此外，可以在连接端子的至少在锥形形状的侧表面上形成用于提高焊料润湿性的金属层。

4. 发明授权

US08436249B2 Wiring substrate, electronic device, and method of manufacturing wiring substrate 有权
标题翻译：布线基板，电子装置以及布线基板的制造方法
公开(公告)号：US08436249B2
公开(公告)日：2013-05-07
申请号：US13280682
申请日：2011-10-25
申请人： Kazutaka Kobayashi , Tadashi Arai
发明人： Kazutaka Kobayashi , Tadashi Arai
IPC分类号： H05K1/00 , H05K3/30
CPC分类号： H05K1/0206 , H01L23/3677 , H01L23/49861 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/14 , H01L2924/30107 , H05K3/20 , H05K2201/09118 , H05K2201/10106 , H05K2201/10416 , H05K2203/0156 , H05K2203/049 , Y10T29/4913 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A wiring substrate includes a heat sink to dissipate heat generated in an electronic part mounted in an electronic part loading area on a principal surface of the wiring substrate, an encapsulation resin to cover the heat sink, an inner connection terminal having an end face electrically connected to an electrode of the electronic part, and an outer connection terminal electrically connected to the inner connection terminal via a wiring and having an end face for inputting and outputting of a signal with an external device. The encapsulation resin is arranged to cover a part of the wiring, the inner connection terminal except the end face, and the outer connection terminal except the end face. A surface of the heat sink, the end face of the inner connection terminal, and the end face of the outer connection terminal are flush with and exposed to the principal surface.
摘要翻译：布线基板包括：散热器，其散布在安装在布线基板的主面上的电子部件装载区域中的电子部件中产生的热量;覆盖散热器的封装树脂;内部连接端子，其端面电连接连接到电子部件的电极，以及外部连接端子，其经由布线电连接到内部连接端子，并且具有用于输入和输出与外部装置的信号的端面。封装树脂被布置成覆盖布线的一部分，除了端面之外的内部连接端子以及除了端面之外的外部连接端子。散热器的表面，内部连接端子的端面和外部连接端子的端面与主表面齐平并暴露于主表面。

5. 发明申请

US20130317687A1 POWER TRANSMISSION CONTROL DEVICE FOR VEHICLE 有权
标题翻译：用于车辆的动力传动控制装置
公开(公告)号：US20130317687A1
公开(公告)日：2013-11-28
申请号：US13994920
申请日：2011-08-15
申请人： Yoshiki Ito , Hiroki Inoue , Kazutaka Kobayashi , Takeshige Miyazaki
发明人： Yoshiki Ito , Hiroki Inoue , Kazutaka Kobayashi , Takeshige Miyazaki
IPC分类号： B60W20/00
CPC分类号： B60W20/40 , B60K6/48 , B60L11/14 , B60L15/2054 , B60L2240/14 , B60L2240/16 , B60L2240/423 , B60L2240/443 , B60L2240/486 , B60L2240/507 , B60W10/02 , B60W10/08 , B60W10/10 , B60W20/00 , B60W20/10 , B60W2510/083 , B60W2540/10 , B60W2540/14 , B60W2540/16 , B60W2710/083 , B60W2710/105 , F16H61/0437 , F16H2059/6807 , Y02T10/6221 , Y02T10/645 , Y02T10/70 , Y02T10/7077 , Y02T10/72 , Y02T10/7275 , Y10S903/902 , Y10T477/26
摘要： A power transmission control device is used for a hybrid vehicle including an internal combustion engine and a motor (MG) as power sources, and includes a manual transmission and a friction clutch. A torque of the motor (MG torque) is generally adjusted to the smaller one (=MG torque final reference value) of an MG torque reference value determined based on an accelerator opening and an MG torque limit value determined based on a clutch return stroke. Based on satisfaction of a predetermined condition relating to a clutch pedal operation performed by a driver, the MG torque is intentionally adjusted to a value shifted from the MG torque final reference value in place of the MG torque final reference value. As a result, a driving force which is more appropriate or better meets a driver's intention can be obtained.
摘要翻译：动力传递控制装置用于包括内燃机和电动机（MG）作为动力源的混合动力车辆，并且包括手动变速器和摩擦离合器。电动机的转矩（MG转矩）通常根据基于加速器开度确定的MG转矩基准值和基于离合器返回行程确定的MG转矩极限值而调整为较小的（= MG转矩最终基准值）。基于对与驾驶员进行的离合器踏板操作有关的预定条件的满足，将MG转矩有意地调整为从MG转矩最终参考值偏移的值代替MG转矩最终参考值。结果，可以获得更适合或更好地满足司机意图的驱动力。

6. 发明授权

US07964950B2 Electronic parts packaging structure and method of manufacturing the same 有权
标题翻译：电子零件包装结构及制造方法相同
公开(公告)号：US07964950B2
公开(公告)日：2011-06-21
申请号：US12385814
申请日：2009-04-21
申请人： Masahiro Sunohara , Kei Murayama , Toshinori Koyama , Kazutaka Kobayashi , Mitsutoshi Higashi
发明人： Masahiro Sunohara , Kei Murayama , Toshinori Koyama , Kazutaka Kobayashi , Mitsutoshi Higashi
IPC分类号： H01L23/02
CPC分类号： H01L23/5383 , H01L21/563 , H01L23/481 , H01L23/5389 , H01L24/24 , H01L24/81 , H01L24/82 , H01L25/0657 , H01L2224/05001 , H01L2224/05022 , H01L2224/05023 , H01L2224/0508 , H01L2224/05548 , H01L2224/05568 , H01L2224/05573 , H01L2224/13144 , H01L2224/16 , H01L2224/16225 , H01L2224/24226 , H01L2224/32225 , H01L2224/73204 , H01L2224/81205 , H01L2224/8121 , H01L2224/81815 , H01L2224/82039 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06541 , H01L2225/06572 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H05K1/185 , H05K1/186 , H05K3/4644 , H05K2201/0195 , H05K2201/10636 , H05K2201/10674 , Y02P70/611 , H01L2924/00 , H01L2224/48 , H01L2224/05644 , H01L2224/05155
摘要： An electronic parts packaging structure of the present invention includes a wiring substrate having a wiring pattern, a first insulating film which is formed on the wiring substrate and which has an opening portion in a packaging area where an electronic parts is mounted, the electronic parts having a connection terminal flip-chip mounted on the wiring pattern exposed in the opening portion of the first insulating film, a second insulating film for covering the electronic parts, a via hole formed in a predetermined portion of the first and second insulating films on the wiring pattern, and an upper wiring pattern formed on the second insulating film and connected to the wiring pattern through the via hole.
摘要翻译：本发明的电子零件包装结构体包括具有布线图案的布线基板，形成在布线基板上的第一绝缘膜，并且在安装有电子部件的封装区域中具有开口部，电子部件具有安装在暴露在第一绝缘膜的开口部分中的布线图案上的连接端子倒装芯片，用于覆盖电子部件的第二绝缘膜，形成在布线上的第一和第二绝缘膜的预定部分中的通孔图案和形成在第二绝缘膜上并通过通孔连接到布线图案的上部布线图案。

7. 发明申请

US20100181852A1 MOTOR 有权
标题翻译：发动机
公开(公告)号：US20100181852A1
公开(公告)日：2010-07-22
申请号：US12652884
申请日：2010-01-06
申请人： Kazutaka Kobayashi
发明人： Kazutaka Kobayashi
IPC分类号： H02K3/46
CPC分类号： H02K3/525
摘要： The invention provides a motor including a terminal block that is insert molded into a core, so as to increase the strength to support the terminal block. A stator has paired inner cores configured by two inner cores facing back to back and each having a disk part and pole teeth. Each of the disk parts is provided with a terminal block holding part. The terminal block is connected with the terminal block holding parts via a resin connection part that is insert molded. The terminal block holding parts are provided with recesses configured by cutouts in portions to face the terminal block, respectively. The resin connection part has a thickness increased by filling the recesses so as to increase the strength at a connection portion thereof. The cutouts in the terminal block holding parts facing back to back are offset with respect to a radial line, terminal block facing ends are generally spaced apart from the terminal block by a constant distance. Therefore, the terminal block is prevented from being unstable.
摘要翻译：本发明提供一种电动机，其包括嵌入成型为芯部的端子块，以增加支撑端子块的强度。定子具有配对的内芯，其由两个面向背对背的内芯构成，每个具有盘部分和极齿。每个盘部分都设置有端子块保持部。接线端子通过插入成型的树脂连接部与端子块保持部连接。端子块保持部分分别设置有分别与端子块相对的部分的切口构成的凹部。树脂连接部分通过填充凹部而增加了厚度，以增加其连接部分处的强度。靠近背对背的端子排保持部分的切口相对于径向线偏移，端子块的端部通常与端子块间隔一定距离。因此，防止端子块不稳定。

8. 发明申请

US20090042685A1 TRANSMISSION 审中-公开
标题翻译：传输
公开(公告)号：US20090042685A1
公开(公告)日：2009-02-12
申请号：US12186646
申请日：2008-08-06
申请人： Makoto Ohmori , Norio Kayukawa , Kazutaka Kobayashi
发明人： Makoto Ohmori , Norio Kayukawa , Kazutaka Kobayashi
IPC分类号： F16H57/04
CPC分类号： F16H57/042 , F16H57/0484 , F16H57/0493 , F16H63/32
摘要： A transmission includes a rotary shaft, a clutch hub fixed to the rotary shaft a transmission gear rotatably provided at the rotary shaft, a gear piece connected to the transmission gear at the side of the clutch hub, a synchronizer ring positioned between the clutch hub and the gear piece, a sleeve held by the clutch hub slidably in an axial direction, a fork engaged with the sleeve and a fork shaft connected with the fork for shifting the fork in the axial direction. The transmission performs synchronization operation of rotation of the clutch hub and the transmission gear. The fork shaft has an in-shaft lubricant passage provided therein, a lubricant supply passage and a lubricant outlet passage.
摘要翻译：变速器包括旋转轴，固定到旋转轴的离合器轮毂，可旋转地设置在旋转轴上的变速齿轮，与离合器轮毂侧的变速齿轮连接的齿轮片，位于离合器毂和离合器毂之间的同步器环齿轮片，由离合器毂沿轴向可滑动地保持的套筒，与套筒接合的叉子和与叉子连接的叉轴，用于使叉子沿轴向方向移动。变速器执行离合器轮毂和变速器齿轮的旋转的同步操作。叉轴具有设置在其内的轴内润滑剂通路，润滑剂供给通路和润滑剂出口通路。

9. 发明申请

US20060145359A1 Electronic parts packaging structure and method of manufacturing the same 有权
公开(公告)号：US20060145359A1
公开(公告)日：2006-07-06
申请号：US11362189
申请日：2006-02-27
申请人： Masahiro Sunohara , Kei Murayama , Toshinori Koyama , Kazutaka Kobayashi , Mitsutoshi Higashi
发明人： Masahiro Sunohara , Kei Murayama , Toshinori Koyama , Kazutaka Kobayashi , Mitsutoshi Higashi
IPC分类号： H01L23/48
CPC分类号： H01L23/5383 , H01L21/563 , H01L23/481 , H01L23/5389 , H01L24/24 , H01L24/81 , H01L24/82 , H01L25/0657 , H01L2224/05001 , H01L2224/05022 , H01L2224/05023 , H01L2224/0508 , H01L2224/05548 , H01L2224/05568 , H01L2224/05573 , H01L2224/13144 , H01L2224/16 , H01L2224/16225 , H01L2224/24226 , H01L2224/32225 , H01L2224/73204 , H01L2224/81205 , H01L2224/8121 , H01L2224/81815 , H01L2224/82039 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06541 , H01L2225/06572 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H05K1/185 , H05K1/186 , H05K3/4644 , H05K2201/0195 , H05K2201/10636 , H05K2201/10674 , Y02P70/611 , H01L2924/00 , H01L2224/48 , H01L2224/05644 , H01L2224/05155
摘要： An electronic parts packaging structure of the present invention includes a wiring substrate having a wiring pattern, a first insulating film which is formed on the wiring substrate and which has an opening portion in a packaging area where an electronic parts is mounted, the electronic parts having a connection terminal flip-chip mounted on the wiring pattern exposed in the opening portion of the first insulating film, a second insulating film for covering the electronic parts, a via hole formed in a predetermined portion of the first and second insulating films on the wiring pattern, and an upper wiring pattern formed on the second insulating film and connected to the wiring pattern through the via hole.

10. 发明授权

US07057290B2 Electronic parts packaging structure and method of manufacturing the same 有权
公开(公告)号：US07057290B2
公开(公告)日：2006-06-06
申请号：US10771506
申请日：2004-02-05
申请人： Masahiro Sunohara , Kei Murayama , Toshinori Koyama , Kazutaka Kobayashi , Mitsutoshi Higashi
发明人： Masahiro Sunohara , Kei Murayama , Toshinori Koyama , Kazutaka Kobayashi , Mitsutoshi Higashi
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/28
CPC分类号： H01L23/5383 , H01L21/563 , H01L23/481 , H01L23/5389 , H01L24/24 , H01L24/81 , H01L24/82 , H01L25/0657 , H01L2224/05001 , H01L2224/05022 , H01L2224/05023 , H01L2224/0508 , H01L2224/05548 , H01L2224/05568 , H01L2224/05573 , H01L2224/13144 , H01L2224/16 , H01L2224/16225 , H01L2224/24226 , H01L2224/32225 , H01L2224/73204 , H01L2224/81205 , H01L2224/8121 , H01L2224/81815 , H01L2224/82039 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06541 , H01L2225/06572 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H05K1/185 , H05K1/186 , H05K3/4644 , H05K2201/0195 , H05K2201/10636 , H05K2201/10674 , Y02P70/611 , H01L2924/00 , H01L2224/48 , H01L2224/05644 , H01L2224/05155
摘要： An electronic parts packaging structure of the present invention includes a wiring substrate having a wiring pattern, a first insulating film which is formed on the wiring substrate and which has an opening portion in a packaging area where an electronic parts is mounted, the electronic parts having a connection terminal flip-chip mounted on the wiring pattern exposed in the opening portion of the first insulating film, a second insulating film for covering the electronic parts, a via hole formed in a predetermined portion of the first and second insulating films on the wiring pattern, and an upper wiring pattern formed on the second insulating film and connected to the wiring pattern through the via hole.

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