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1. 发明授权

US09415466B2 Cutting tool and method and apparatus for manufacturing the same 有权
标题翻译：切割工具及其制造方法和装置
公开(公告)号：US09415466B2
公开(公告)日：2016-08-16
申请号：US13882928
申请日：2011-09-16
申请人： Kazuo Nakamae , Hiroyuki Murase , Katsuko Yamamoto , Mamoru Ono , Katsuyuki Tanaka , Toshimitsu Sakata , Teruhiro Enami , Yutaka Kobayashi
发明人： Kazuo Nakamae , Hiroyuki Murase , Katsuko Yamamoto , Mamoru Ono , Katsuyuki Tanaka , Toshimitsu Sakata , Teruhiro Enami , Yutaka Kobayashi
IPC分类号： B23K26/06 , B23K26/38 , B23K26/40 , B23D65/02 , B23K26/08
CPC分类号： B23K26/0648 , B23C2226/125 , B23C2226/315 , B23C2260/56 , B23D65/02 , B23K26/06 , B23K26/0613 , B23K26/064 , B23K26/0823 , B23K26/38 , B23K26/40 , B23K2103/50 , Y10T407/27
摘要： Provided is a technology for manufacturing cutting tools that is capable of providing cutting tools that have a cut surface whose surface is uniformly smooth and that have a stable performance. Provided are a cutting tool manufacturing method in which a cutting tool material is cut by using, as a laser beam, a laser beam formed by combining two linearly polarized laser beams so that the directions of polarization of the two linearly polarized laser beams are at right angles to each other; a cutting tool manufacturing method in which a circularly polarized laser beam is used as a laser beam; a cutting tool manufacturing method in which a randomly polarized laser beam is used as a laser beam; a cutting tool manufactured by the manufacturing method; a cutting tool manufacturing apparatus that includes means for generating a combined laser beam formed of two linearly polarized laser beams, the directions of polarization of the two linearly polarized laser beams being at right angles to each other and an optical system that guides the combined laser beam to the cutting tool material; a cutting tool manufacturing apparatus that includes means for generating a circularly polarized laser beam; and a cutting tool manufacturing apparatus that includes means for generating a randomly polarized laser beam.
摘要翻译：提供了一种用于制造切削工具的技术，其能够提供具有表面均匀光滑并且具有稳定性能的切割表面的切削工具。提供一种切削工具制造方法，其中通过使用通过组合两个线性偏振激光束形成的激光束来切割切削工具材料，使得两个线性偏振激光束的偏振方向在右侧彼此的角度; 使用圆偏振激光束作为激光束的切削工具制造方法; 使用随机偏振激光束作为激光束的切削工具制造方法; 通过制造方法制造的切削工具; 一种切削工具制造装置，包括用于产生由两个线偏振激光束形成的组合激光束的装置，两个线偏振激光束的偏振方向彼此成直角;以及光学系统，其引导组合的激光束对刀具材料; 一种切削工具制造装置，包括用于产生圆偏振激光束的装置; 以及包括用于产生随机偏振激光束的装置的切削工具制造装置。

2. 发明申请

US20140054275A1 CUTTING TOOL AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME 有权
标题翻译：切割工具及其制造方法和装置
公开(公告)号：US20140054275A1
公开(公告)日：2014-02-27
申请号：US13882928
申请日：2011-09-16
申请人： Kazuo Nakamae , Hiroyuki Murase , Katsuko Yamamoto , Mamoru Ono , Katsuyuki Tanaka , Toshimitsu Sakata , Teruhiro Enami , Yutaka Kobayashi
发明人： Kazuo Nakamae , Hiroyuki Murase , Katsuko Yamamoto , Mamoru Ono , Katsuyuki Tanaka , Toshimitsu Sakata , Teruhiro Enami , Yutaka Kobayashi
IPC分类号： B23K26/06 , B23K26/40 , B23K26/38
CPC分类号： B23K26/0648 , B23C2226/125 , B23C2226/315 , B23C2260/56 , B23D65/02 , B23K26/06 , B23K26/0613 , B23K26/064 , B23K26/0823 , B23K26/38 , B23K26/40 , B23K2103/50 , Y10T407/27
摘要： Provided is a technology for manufacturing cutting tools that is capable of providing cutting tools that have a cut surface whose surface is uniformly smooth and that have a stable performance. Provided are a cutting tool manufacturing method in which a cutting tool material is cut by using, as a laser beam, a laser beam formed by combining two linearly polarized laser beams so that the directions of polarization of the two linearly polarized laser beams are at right angles to each other; a cutting tool manufacturing method in which a circularly polarized laser beam is used as a laser beam; a cutting tool manufacturing method in which a randomly polarized laser beam is used as a laser beam; a cutting tool manufactured by the manufacturing method; a cutting tool manufacturing apparatus that includes means for generating a combined laser beam formed of two linearly polarized laser beams, the directions of polarization of the two linearly polarized laser beams being at right angles to each other and an optical system that guides the combined laser beam to the cutting tool material; a cutting tool manufacturing apparatus that includes means for generating a circularly polarized laser beam; and a cutting tool manufacturing apparatus that includes means for generating a randomly polarized laser beam.
摘要翻译：提供了一种用于制造切削工具的技术，其能够提供具有表面均匀光滑并且具有稳定性能的切割表面的切削工具。提供一种切削工具制造方法，其中通过使用通过组合两个线性偏振激光束形成的激光束来切割切削工具材料，使得两个线性偏振激光束的偏振方向在右侧彼此的角度; 使用圆偏振激光束作为激光束的切削工具制造方法; 使用随机偏振激光束作为激光束的切削工具制造方法; 通过制造方法制造的切削工具; 一种切削工具制造装置，包括用于产生由两个线偏振激光束形成的组合激光束的装置，两个线偏振激光束的偏振方向彼此成直角;以及光学系统，其引导组合的激光束对刀具材料; 一种切削工具制造装置，包括用于产生圆偏振激光束的装置; 以及包括用于产生随机偏振激光束的装置的切削工具制造装置。

3. 发明申请

US20130322135A1 COMPACT, METHOD FOR PRODUCING COMPACT, REACTOR, CONVERTER, AND POWER CONVERSION DEVICE 审中-公开
标题翻译： COMPACT，METHOD FOR PRODUCE COMPACT，REACTOR，CONVERTER，AND POWER CONVERSION DEVICE
公开(公告)号：US20130322135A1
公开(公告)日：2013-12-05
申请号：US13984191
申请日：2011-12-28
申请人： Kazushi Kusawake , Masato Uozumi , Atsushi Sato , Koji Yamaguchi , Mamoru Ono , Hiroyuki Murase , Kazuo Nakamae
发明人： Kazushi Kusawake , Masato Uozumi , Atsushi Sato , Koji Yamaguchi , Mamoru Ono , Hiroyuki Murase , Kazuo Nakamae
IPC分类号： H01F3/08 , B23K26/00 , H02M7/44 , H01F41/02
CPC分类号： H01F1/24 , B22F1/02 , B22F3/105 , B22F3/12 , B22F2998/10 , B22F2999/00 , B23K26/354 , C22C2202/02 , H01F1/33 , H01F3/08 , H01F37/00 , H01F41/02 , H01F41/0246 , H02M7/44 , Y10T29/4902 , B22F3/02 , B22F3/24 , B22F2202/11
摘要： A low-loss compact and a method for producing the compact are provided.A method for producing a compact by using coated soft magnetic powder that includes coated soft magnetic particles constituted by soft magnetic particles and insulating coatings coating outer peripheries of the soft magnetic particles includes a raw material preparation step and an irradiation step. In the raw material preparation step, a raw compact is prepared by press-forming coated soft magnetic powder. In the irradiation step, part of a surface of the raw compact is irradiated with a laser. Irradiating a part of a surface of a raw compact with laser increases the number of disrupted portions of conductive portions where constituent materials of the soft magnetic particles at the surface of the raw compact have become conductive to each other, and the loss of the compact can be decreased.
摘要翻译：提供了一种低损耗密封件和用于制造该压块的方法。通过使用由软磁性粒子构成的包覆软磁性粒子和涂覆软磁性粒子的外周的绝缘涂层的涂布软磁性粉末的制造方法，包括原料制备工序和照射工序。在原料制备工序中，通过压制成形被覆软磁性粉末制备原料。在照射步骤中，用激光照射原始压块的一部分表面。用激光器照射原始压块的一部分表面增加了原始压块的表面上的软磁性颗粒的构成材料彼此导电的导电部分的破裂部分的数量，并且压实体的损失减少

4. 发明授权

US08294123B2 Laser processing method and laser processing apparatus 失效
标题翻译：激光加工方法和激光加工设备
公开(公告)号：US08294123B2
公开(公告)日：2012-10-23
申请号：US11878973
申请日：2007-07-30
申请人： Kazuo Nakamae , Motoki Kakui , Shinobu Tamaoki
发明人： Kazuo Nakamae , Motoki Kakui , Shinobu Tamaoki
IPC分类号： G21K5/10
CPC分类号： B23K26/03 , B23K26/032 , B23K26/046 , B23K26/048 , B23K26/0665 , B23K26/0861 , B23K26/53
摘要： The present invention relates to a laser processing method and the like having a structure for making it possible to process an object to be processed in various ways while accurately adjusting the installation state of the object. The method irradiates the object with plural adjustment laser light beams that are set in a specific positional relationship against a converging point of processing laser light beam, and adjusts the state of installation of the object while monitoring irradiation areas of the adjustment laser light beams on the surface of the object. Each irradiation directions of adjustment laser light beams is different from that of the processing laser light beam. By reflecting the irradiation condition of the adjustment laser light beam and monitored information of the irradiation areas in positional adjustment of the object, the installation state of the object can be adjusted in accordance with various kinds of processing.
摘要翻译：本发明涉及一种激光加工方法等，其具有能够在精确地调整物体的安装状态的情况下以各种方式处理待处理物体的结构。该方法以与处理用激光的会聚点为特定的位置关系设定的多个调整用激光照射物体，并且在监视被调节激光的照射区域的同时调整对象的安装状态物体的表面。调整激光的各照射方向与加工用激光的不同。通过在对象的位置调整中反映调整激光的照射条件和照射区域的监视信息，可以根据各种处理来调整物体的安装状态。

5. 发明授权

US08283592B2 Laser welding method 有权
标题翻译：激光焊接方法
公开(公告)号：US08283592B2
公开(公告)日：2012-10-09
申请号：US12762084
申请日：2010-04-16
申请人： Kazuo Nakamae
发明人： Kazuo Nakamae
IPC分类号： B23K11/00
CPC分类号： H01R43/0221 , B23K26/009 , B23K2101/32 , B23K2101/38 , H01R9/05
摘要： The present invention relates to a laser welding method of welding an electrode and a cable core to each other satisfactory by irradiation of a laser beam, even when the core is thin and the area of the electrode is small. The laser welding method welds on a substrate the electrode and the core of a coaxial cable to each other by irradiation of the laser beam. The core is sandwiched between a pressing member and the electrode, while the electrode and the core are brought into contact with each other at a connection section. The pressing member is a member that is transparent to the processing laser beam. A part of the core is molten by radiating the laser beam from the pressing member side. As a result, the electrode and the core are connected with each other.
摘要翻译：本发明涉及通过激光束的照射使电极和电缆芯彼此焊接的激光焊接方法，即使当芯较薄并且电极的面积小时也是如此。激光焊接方法通过照射激光束将电极和同轴电缆的芯彼此焊接在基板上。在电连接部分将电极和芯彼此接触的同时夹在压件和电极之间。按压构件是对加工激光束透明的构件。通过从加压构件侧照射激光束，芯部的一部分熔融。结果，电极和芯彼此连接。

6. 发明申请

US20110080590A1 METHOD OF MANUFACTURING PREFORM FOR OPTICAL WAVEGUIDE 审中-公开
标题翻译：光波导制造方法
公开(公告)号：US20110080590A1
公开(公告)日：2011-04-07
申请号：US12988221
申请日：2009-04-15
申请人： Eisuke Sasaoka , Kazuo Nakamae , Toshiki Taru , Takuji Nagashima
发明人： Eisuke Sasaoka , Kazuo Nakamae , Toshiki Taru , Takuji Nagashima
IPC分类号： G01B9/02 , G02B6/10 , G02B6/00
CPC分类号： G02B6/1225 , B82Y20/00 , C03B23/047 , C03B33/06 , C03B2201/02 , C03B2201/12 , C03B2201/31 , G02B6/12002 , G02B6/13 , Y02P40/57
摘要： The present invention relates to an optical waveguide manufacturing method, which excels in mass productivity of a planar optical waveguide. In an aggregating step, plural members (20), which have a rod (21) or pipe (22) shape respectively, are arranged and bundled so as to constitute a substantially similar figure to at least a part of a desired waveguide pattern on a cross-section perpendicular to the longitudinal direction of the members (20). The plural members (20) bundled in the aggregating step are, after being softened by heating, elongated in a longitudinal direction thereof in an elongating step, whereby an elongated body is formed. The elongated body formed in the elongating step is cut along a plane perpendicular to the longitudinal direction of the elongated body in a cutting step. By these steps, a planar optical waveguide, on which a waveguide pattern based on a micro-structure is formed, is manufactured.
摘要翻译：光波导制造方法技术领域本发明涉及一种平面光波导的质量生产率优异的光波导制造方法。在聚集步骤中，分别具有棒（21）或管（22）形状的多个构件（20）被布置和捆扎，以便构成与图1中所需的波导图案的至少一部分大致相似的图横截面垂直于构件（20）的纵向方向。在聚集步骤中捆扎的多个构件（20）在通过加热软化之后，在拉伸步骤中在其长度方向上伸长，由此形成细长体。在切割步骤中，沿着与细长体的纵向方向垂直的平面切割在拉伸步骤中形成的细长体。通过这些步骤，制造其上形成有基于微结构的波导图案的平面光波导。

7. 发明申请

US20080053970A1 Soldering method and laser soldering apparatus 审中-公开
标题翻译：焊接方法和激光焊接装置
公开(公告)号：US20080053970A1
公开(公告)日：2008-03-06
申请号：US11878679
申请日：2007-07-26
申请人： Kazuo Nakamae
发明人： Kazuo Nakamae
IPC分类号： B23K26/00
CPC分类号： H05K3/3494 , B23K1/0056 , H05K3/3421 , H05K2203/107
摘要： The present invention relates to a soldering method and the like comprising a structure for making it possible to solder microsize objects to each other. The soldering method is a method realizing the soldering by using a fiber laser apparatus capable of minutely adjusting the spot size of outputted laser light, and prepares the fiber laser apparatus and a spatial optical system before soldering the objects. The fiber laser apparatus includes an amplification optical fiber having a single core structure and outputting amplified single-mode light, and a seed light source supplying seed light to the amplification optical fiber. The spatial optical system includes a collimator collimating the outputted laser light from the fiber laser apparatus, and a condenser lens converging the outputted laser light transmitted through the collimator to solder which is set. Light having a pulse width of not shorter than a microsecond or continuous light outputted as outputted laser light from the fiber laser apparatus is applied to the solder set between objects to be soldered through the spatial optical system.
摘要翻译：本发明涉及一种焊接方法等，其包括用于使微量化对象彼此焊接的结构。焊接方法是通过使用能够精细调整输出的激光的光斑尺寸的光纤激光装置实现焊接的方法，并且在焊接物体之前准备光纤激光装置和空间光学系统。光纤激光装置包括具有单个核心结构并输出放大的单模光的放大光纤和向放大光纤提供种子光的种子光源。空间光学系统包括：准直器，对来自光纤激光装置的输出的激光进行准直;以及聚光透镜，将输出的准直仪的激光会聚到设定的焊料上。将来自光纤激光装置的作为输出激光输出的微秒或连续光的脉冲宽度的光施加到通过空间光学系统焊接的物体之间的焊料组。

8. 发明授权

US08080773B2 Method and apparatus of measuring backward light, and laser processing method 有权
标题翻译：测量反光的方法和装置，以及激光加工方法
公开(公告)号：US08080773B2
公开(公告)日：2011-12-20
申请号：US12392331
申请日：2009-02-25
申请人： Shinobu Tamaoki , Motoki Kakui , Kazuo Nakamae
发明人： Shinobu Tamaoki , Motoki Kakui , Kazuo Nakamae
IPC分类号： G01J1/32
CPC分类号： G01J1/20 , B23K26/705
摘要： The present invention relates to a method of measuring backward light, which is constructed for checking, prior to laser processing, backward light that propagates backward through an isolator included in a laser processing apparatus. The present invention also relates to a laser processing method and the like. A laser processing apparatus has an optical head provided with a laser light source part, light guide, and isolator. The optical head has an emitting optical system, irradiation optical system, and light collecting optical system. The method of measuring backward light uses a photodetector to detect, from reference light introduced from a measurement light source into the optical head, the power of an optical component that has passed through the isolator, while changing the position of the measurement light source. The laser processing method performs laser processing by using the laser processing apparatus that has the optical head in which the arrangement of optical components is adjusted beforehand on the basis of the result of detection or result of measurement.
摘要翻译：本发明涉及一种测量向后光的方法，其被构造用于在激光加工之前检查通过包括在激光加工设备中的隔离器向后传播的向后光。本发明还涉及一种激光加工方法等。激光加工设备具有设置有激光光源部分，光导和隔离器的光学头。光头具有发射光学系统，照射光学系统和聚光光学系统。逆向光的测量方法使用光检测器，在测量光源的位置改变的同时，从测量光源引入光头的参考光检测已经通过隔离器的光学部件的功率。激光加工方法通过使用具有基于检测结果或测量结果预先调整光学部件的布置的光头的激光加工装置进行激光加工。

9. 发明授权

US08039778B2 Laser processing apparatus and laser processing method 有权
标题翻译：激光加工设备和激光加工方法
公开(公告)号：US08039778B2
公开(公告)日：2011-10-18
申请号：US12256974
申请日：2008-10-23
申请人： Motoki Kakui , Kazuo Nakamae , Shinobu Tamaoki
发明人： Motoki Kakui , Kazuo Nakamae , Shinobu Tamaoki
IPC分类号： G01J1/32
CPC分类号： B23K26/03 , B23K26/082 , B23K2101/32 , B23K2101/36
摘要： The present invention relates to a laser processing apparatus and the like having a structure for implementing at the same time both an efficient laser processing in the place where a laser beam is difficult to reach and a laser processing without damages in the place where the laser beam is easy to reach. This laser processing apparatus comprises a laser light source, an irradiation optical system applying a laser beam to an object while scanning the laser beam, a photo-detector detecting the laser beam applied from the irradiation optical system, and a control section of making switching between a continuous oscillation and a pulse oscillation of the laser beam at the laser light source. In particular, the control section makes a continuous oscillation of the laser beam with respect to the laser light source in the case in which the laser beam applied from the irradiation optical system is detected at the photo-detector; while it makes a pulse oscillation of the laser beam with respect to the laser light source in the case in which no laser beam applied from the irradiation optical system is detected at the photo-detector.
摘要翻译：激光加工装置本发明涉及一种激光加工装置等，其结构是同时实现在激光束难以到达的地方进行有效的激光加工，激光加工在激光加工的地方很容易到达。该激光加工装置包括：激光光源，在扫描激光束的同时向物体施加激光的照射光学系统;检测从照射光学系统施加的激光束的光检测器;以及控制部，在激光光源处的激光束的连续振荡和脉冲振荡。特别地，在从光检测器检测到从照射光学系统施加的激光束的情况下，控制部分使激光束相对于激光光源连续振荡; 而在光检测器未检测到从照射光学系统施加的激光束的情况下，激光束相对于激光光源的脉冲振荡。

10. 发明申请

US20110148002A1 LASER PROCESSING METHOD AND LASER PROCESSING DEVICE 有权
标题翻译：激光加工方法和激光加工装置
公开(公告)号：US20110148002A1
公开(公告)日：2011-06-23
申请号：US13059592
申请日：2009-10-23
申请人： Motoki Kakui , Kazuo Nakamae , Shinobu Tamaoki
发明人： Motoki Kakui , Kazuo Nakamae , Shinobu Tamaoki
IPC分类号： B29C35/08
CPC分类号： H05K3/0035 , B23K26/0622 , B23K26/082 , B23K26/389 , B23K26/40 , B23K2103/172 , B23K2103/42 , B23K2103/50 , H01S3/067
摘要： The present invention relates to a laser processing method and the like which use no wavelength conversion technique by nonlinear optical crystals when selectively removing an insulating layer of a printed board, while employing only one wavelength throughout the entire removal processing. A laser processing apparatus (1), preferably used in the laser processing method, has a MOPA structure and comprises a seed light source (100), a YbDF (110), a bandpass filter (120), a YbDF (130), a bandpass filter (140), a YbDF (150), a YbDF (160), and so forth. The laser processing method according to the present invention is a laser processing method of removing an insulating layer comprised of a resin laminated on a conductor layer by irradiating it with pulsed laser light outputted from the laser processing apparatus (1) and uses laser light having a wavelength at which the light absorbed by the conductor layer is less than 10%, and sets the fluence per one pulse to a fracture damage threshold of the insulating layer or higher.
摘要翻译：本发明涉及在选择性地去除印刷电路板的绝缘层时采用非线性光学晶体的波长转换技术的激光加工方法等，而在整个去除处理中仅使用一个波长。优选用于激光加工方法的激光加工装置（1）具有MOPA结构，包括种子光源（100），YbDF（110），带通滤光器（120），YbDF（130），带通滤波器（140），YbDF（150），YbDF（160）等。根据本发明的激光加工方法是通过用从激光加工设备（1）输出的脉冲激光照射层压在导体层上的由树脂构成的绝缘层的激光加工方法，并使用具有由导体层吸收的光的波长小于10％，并且将每个脉冲的注量设定为绝缘层的断裂损伤阈值或更高。

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