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    • 7. 发明授权
    • Process for exposing a photosensitive resin composition to light
    • 将光敏树脂组合物曝光的方法
    • US5330882A
    • 1994-07-19
    • US709964
    • 1991-06-04
    • Chitoshi KawaguchiSeiji ArimatsuKatsuji KonishiKazunori Kanda
    • Chitoshi KawaguchiSeiji ArimatsuKatsuji KonishiKazunori Kanda
    • G03F7/20G03C5/00
    • G03F7/2022Y10S522/913
    • The present invention provides an improved process by which dissolved oxygen is effectively removed from a photosensitive resin layer of a photosensitive resin plate. The process comprises preliminarily exposing the photosensitive resin to light to quench oxygen dissolved in said photosensitive resin layer before conducting a main exposure. The photosensitive resin layer is prepared from a photosensitive resin composition which comprises:(a) a polymer binder,(b) a radically polymerizable monomer,(c) a sensitizing dye, and(d) a photopolymerization initiator which is excited by a light of a different wave length from a light exciting the sensitizing dye.The preliminary exposure is conducted with a light only exciting the sensitizing dye and the main exposure is conducted with a light exciting the photopolymerization initiator.
    • 本发明提供了一种改进的方法,通过该方法可以有效地从感光性树脂板的感光性树脂层除去溶解氧。 该方法包括在进行主曝光之前,将感光性树脂预先曝光,以使溶解在所述感光性树脂层中的氧气骤冷。 感光性树脂层由感光性树脂组合物制成,该感光性树脂组合物包含:(a)聚合物粘合剂,(b)自由基聚合性单体,(c)敏化染料,(d)光聚合引发剂, 来自激发敏化染料的光的不同波长。 用仅激发敏化染料的光进行初步曝光,并且通过光激发光聚合引发剂进行主曝光。