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1. 发明申请

US20100006215A1 METHOD OF FORMING LIGHT EMITTER AND MOLDING DIE 审中-公开
标题翻译：形成发光体和成型模具的方法
公开(公告)号：US20100006215A1
公开(公告)日：2010-01-14
申请号：US12438335
申请日：2007-12-13
申请人： Kazuki Kawakubo , Shinji Takase
发明人： Kazuki Kawakubo , Shinji Takase
IPC分类号： B29C43/00 , B29D11/00
CPC分类号： B29C43/18 , B29C33/0022 , B29C43/021 , B29C2043/3438 , B29L2011/0016 , H01L33/52 , H01L2224/48091 , H01L2924/00014
摘要： The manufacturing efficiency of a light emitter (product) having a lens member and a light emitting device is efficiently improved. With a molding die for forming a light emitter, a frame before the molding and bonding process, with a required number of light-emitting devices mounted thereon, is set on a setting section provided in an upper die. A required amount of transparent liquid resin material is supplied by a dispenser into each of cavities of cavity blocks provided in a lower die in correspondence to the light-emitting devices, respectively. A molding die is closed so as to elastically press the mouths of the cavities onto the light emission surfaces of the light emitting devices, respectively. Thus, the resin in each cavity is compression-molded into the lens member formed in accordance with the shape of the cavity, and simultaneously, the lens members are bonded to the light emission surfaces of the light emitting devices to obtain a light emitter emitter and accordingly a frame after the molding and bonding process.
摘要翻译：具有透镜构件和发光装置的发光体（制品）的制造效率得到有效提高。利用用于形成发光体的成型模具，将设置有所需数量的发光装置的模制和接合处理前的框架设置在设置在上模中的设置部分上。所需量的透明液体树脂材料通过分配器分别对应于发光装置分别供给到设置在下模中的空腔的每个空腔中。关闭模制模具，以分别将空腔的口部弹性地按压到发光装置的发光表面上。因此，每个空腔中的树脂被压缩模制到根据腔的形状形成的透镜构件中，同时，透镜构件被结合到发光器件的发光表面，以获得发光器发射极和因此在模制和粘合过程之后的框架。

2. 发明申请

US20070138696A1 Manufacturing method of optical electronic components and optical electronic components manufactured using the same 有权
标题翻译：使用其制造的光电子部件和光电子部件的制造方法
公开(公告)号：US20070138696A1
公开(公告)日：2007-06-21
申请号：US11702636
申请日：2007-02-06
申请人： Shinji Takase , Kazuki Kawakubo , Yohei Onishi
发明人： Shinji Takase , Kazuki Kawakubo , Yohei Onishi
IPC分类号： H01L21/56
CPC分类号： B29D11/0074 , B29C31/008 , B29C31/08 , B29C33/68 , B29C37/0075 , B29C39/10 , B29C41/20 , B29C41/36 , B29C41/42 , B29C70/70 , B29L2031/747 , H01L2924/181 , H01L2924/00012
摘要： There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces. Thus, tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.
摘要翻译：提供一种通过使用夹在底部件和中间件之间的包括顶部件，底部件，中间件和脱模膜的模具来密封和模制具有树脂的光学装置的方法。因此，根据规定张紧以覆盖底部件的空腔，当底部件被加热时，脱模膜膨胀并且因此沿着腔的几何形状紧密地接触空腔的整个表面，使得光学装置可以密封在透明的树脂中，形状如想要的

3. 发明授权

US08193558B2 Optical electronic component 有权
标题翻译：光电子元件
公开(公告)号：US08193558B2
公开(公告)日：2012-06-05
申请号：US12210148
申请日：2008-09-12
申请人： Shinji Takase , Kazuki Kawakubo , Yohei Onishi
发明人： Shinji Takase , Kazuki Kawakubo , Yohei Onishi
IPC分类号： H01L29/72
CPC分类号： B29C43/18 , B29C33/68 , B29C43/021 , B29C43/50 , B29C45/14 , B29C2043/5076 , B29D11/00 , B29L2011/00 , B29L2011/0016 , B29L2031/747 , H01L21/566 , H01L24/97 , H01L33/52 , H01L2924/12041 , H01L2924/181 , Y10T428/24479 , H01L2924/00
摘要： There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.
摘要翻译：提供了一种通过使用包括顶部件，底部件，中间件和夹在底部件和中间件之间的脱模膜的模具的模具来密封和模制具有树脂的光学装置的方法，并因此按照规定盖住底部件的空腔，当底部件被加热时，并且脱模膜膨胀并且因此沿着腔的几何形状紧密地接触空腔的整个表面，使得光学装置可以根据需要被密封成透明的树脂树脂。

4. 发明申请

US20050242452A1 Method of resin-sealing and molding an optical device 有权
标题翻译：树脂密封和模制光学装置的方法
公开(公告)号：US20050242452A1
公开(公告)日：2005-11-03
申请号：US11178400
申请日：2005-07-12
申请人： Shinji Takase , Kazuki Kawakubo , Yohei Onishi
发明人： Shinji Takase , Kazuki Kawakubo , Yohei Onishi
IPC分类号： B29C39/10 , B29C33/68 , B29C39/24 , B29C43/18 , B29C43/50 , B29D11/00
CPC分类号： B29C43/18 , B29C33/68 , B29C43/021 , B29C43/50 , B29C45/14 , B29C2043/5076 , B29D11/00 , B29L2011/00 , B29L2011/0016 , B29L2031/747 , H01L21/566 , H01L24/97 , H01L33/52 , H01L2924/12041 , H01L2924/181 , Y10T428/24479 , H01L2924/00
摘要： There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.
摘要翻译：提供了一种通过使用包括顶部件，底部件，中间件和夹在底部件和中间件之间的脱模膜的模具的模具来密封和模制具有树脂的光学装置的方法，并因此按照规定盖住底部件的空腔，当底部件被加热时，并且脱模膜膨胀并且因此沿着腔的几何形状紧密地接触空腔的整个表面，使得光学装置可以根据需要被密封成透明的树脂树脂。

5. 发明授权

US07985357B2 Method of resin-sealing and molding an optical device 有权
标题翻译：树脂密封和模制光学装置的方法
公开(公告)号：US07985357B2
公开(公告)日：2011-07-26
申请号：US11525122
申请日：2006-09-22
申请人： Shinji Takase , Kazuki Kawakubo , Yohei Onishi
发明人： Shinji Takase , Kazuki Kawakubo , Yohei Onishi
IPC分类号： B29C43/04 , B29C43/18
CPC分类号： B29D11/0074 , B29C31/008 , B29C31/08 , B29C33/68 , B29C37/0075 , B29C39/10 , B29C41/20 , B29C41/36 , B29C41/42 , B29C70/70 , B29L2031/747 , H01L2924/181 , H01L2924/00012
摘要： There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.
摘要翻译：提供了一种通过使用包括顶部件，底部件，中间件和夹在底部件和中间件之间的脱模膜的模具的模具来密封和模制具有树脂的光学装置的方法，并因此按照规定盖住底部件的空腔，当底部件被加热时，并且脱模膜膨胀并且因此沿着腔的几何形状紧密地接触空腔的整个表面，使得光学装置可以根据需要被密封成透明的树脂树脂。

6. 发明授权

US08771563B2 Manufacturing method of optical electronic components and optical electronic components manufactured using the same 有权
标题翻译：使用其制造的光电子部件和光电子部件的制造方法
公开(公告)号：US08771563B2
公开(公告)日：2014-07-08
申请号：US11702636
申请日：2007-02-06
申请人： Shinji Takase , Kazuki Kawakubo , Yohei Onishi
发明人： Shinji Takase , Kazuki Kawakubo , Yohei Onishi
IPC分类号： B29C43/18 , B29C43/56
CPC分类号： B29D11/0074 , B29C31/008 , B29C31/08 , B29C33/68 , B29C37/0075 , B29C39/10 , B29C41/20 , B29C41/36 , B29C41/42 , B29C70/70 , B29L2031/747 , H01L2924/181 , H01L2924/00012
摘要： There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces. Thus, tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.
摘要翻译：提供一种通过使用夹在底部件和中间件之间的包括顶部件，底部件，中间件和脱模膜的模具来密封和模制具有树脂的光学装置的方法。因此，根据规定张紧以覆盖底部件的空腔，当底部件被加热时，脱模膜膨胀并且因此沿着腔的几何形状紧密地接触空腔的整个表面，使得光学装置可以密封在透明的树脂中，形状如想要的

7. 发明授权

US08696951B2 Manufacturing method of optical electronic components and optical electronic components manufactured using the same 有权
标题翻译：使用其制造的光电子部件和光电子部件的制造方法
公开(公告)号：US08696951B2
公开(公告)日：2014-04-15
申请号：US11702638
申请日：2007-02-06
申请人： Shinji Takase , Kazuki Kawakubo , Yohei Onishi
发明人： Shinji Takase , Kazuki Kawakubo , Yohei Onishi
IPC分类号： B29C43/18 , B29C43/56
CPC分类号： B29C43/18 , B29C33/68 , B29C43/021 , B29C43/50 , B29C45/14 , B29C2043/5076 , B29D11/00 , B29L2011/00 , B29L2011/0016 , B29L2031/747 , H01L21/566 , H01L24/97 , H01L33/52 , H01L2924/12041 , H01L2924/181 , Y10T428/24479 , H01L2924/00
摘要： There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces, Thus, tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.
摘要翻译：提供了一种通过使用包括顶片，底片，中间片和夹在底部和中间片之间的脱模膜的模具来密封和模制具有树脂的光学装置的方法。因此，按照规定张紧覆盖底部件的腔体，当底部件被加热时，脱模膜膨胀并且因此沿着腔的几何形状紧密地接触空腔的整个表面，使得光学装置可以根据需要被密封成透明的树脂树脂。

8. 发明授权

US07811491B2 Method for manufacturing optical electronic component 有权
标题翻译：光电子部件的制造方法
公开(公告)号：US07811491B2
公开(公告)日：2010-10-12
申请号：US11178400
申请日：2005-07-12
申请人： Shinji Takase , Kazuki Kawakubo , Yohei Onishi
发明人： Shinji Takase , Kazuki Kawakubo , Yohei Onishi
IPC分类号： B29C37/02 , B29C43/04 , B29C43/18 , B29C43/56
CPC分类号： B29C43/18 , B29C33/68 , B29C43/021 , B29C43/50 , B29C45/14 , B29C2043/5076 , B29D11/00 , B29L2011/00 , B29L2011/0016 , B29L2031/747 , H01L21/566 , H01L24/97 , H01L33/52 , H01L2924/12041 , H01L2924/181 , Y10T428/24479 , H01L2924/00
摘要： There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.
摘要翻译：提供了一种通过使用包括顶部件，底部件，中间件和夹在底部件和中间件之间的脱模膜的模具的模具来密封和模制具有树脂的光学装置的方法，并因此按照规定盖住底部件的空腔，当底部件被加热时，并且脱模膜膨胀并且因此沿着腔的几何形状紧密地接触空腔的整个表面，使得光学装置可以根据需要被密封成透明的树脂树脂。

9. 发明申请

US20070013090A1 Method of resin-sealing and molding an optical device 有权
标题翻译：树脂密封和模制光学装置的方法
公开(公告)号：US20070013090A1
公开(公告)日：2007-01-18
申请号：US11525122
申请日：2006-09-22
申请人： Shinji Takase , Kazuki Kawakubo , Yohei Onishi
发明人： Shinji Takase , Kazuki Kawakubo , Yohei Onishi
IPC分类号： B29D11/00
CPC分类号： B29D11/0074 , B29C31/008 , B29C31/08 , B29C33/68 , B29C37/0075 , B29C39/10 , B29C41/20 , B29C41/36 , B29C41/42 , B29C70/70 , B29L2031/747 , H01L2924/181 , H01L2924/00012
摘要： There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.
摘要翻译：提供了一种通过使用包括顶部件，底部件，中间件和夹在底部件和中间件之间的脱模膜的模具的模具来密封和模制具有树脂的光学装置的方法，并因此按照规定盖住底部件的空腔，当底部件被加热时，并且脱模膜膨胀并且因此沿着腔的几何形状紧密地接触空腔的整个表面，使得光学装置可以根据需要被密封成透明的树脂树脂。

10. 发明申请

US20070132135A1 Manufacturing method of optical electronic components and optical electronic components manufactured using the same 有权
标题翻译：使用其制造的光电子部件和光电子部件的制造方法
公开(公告)号：US20070132135A1
公开(公告)日：2007-06-14
申请号：US11702638
申请日：2007-02-06
申请人： Shinji Takase , Kazuki Kawakubo , Yohei Onishi
发明人： Shinji Takase , Kazuki Kawakubo , Yohei Onishi
IPC分类号： B29C45/14
CPC分类号： B29C43/18 , B29C33/68 , B29C43/021 , B29C43/50 , B29C45/14 , B29C2043/5076 , B29D11/00 , B29L2011/00 , B29L2011/0016 , B29L2031/747 , H01L21/566 , H01L24/97 , H01L33/52 , H01L2924/12041 , H01L2924/181 , Y10T428/24479 , H01L2924/00
摘要： There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces, Thus, tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.
摘要翻译：提供了一种通过使用包括顶片，底片，中间片和夹在底部和中间片之间的脱模膜的模具来密封和模制具有树脂的光学装置的方法。因此，按照规定张紧覆盖底部件的腔体，当底部件被加热时，脱模膜膨胀并且因此沿着腔的几何形状紧密地接触空腔的整个表面，使得光学装置可以根据需要被密封成透明的树脂树脂。

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