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    • 6. 发明申请
    • LEAD-FREE SOLDER ALLOY
    • 无铅焊接合金
    • US20100233018A1
    • 2010-09-16
    • US12305794
    • 2007-07-20
    • Seiji YamadaKenichiro Sugimori
    • Seiji YamadaKenichiro Sugimori
    • B23K35/24C22C13/02
    • C22C13/00B23K35/262
    • Provided is an SnCu lead-free solder alloy which eliminates a drawback that an intermetallic compound excessively precipitates and the precipitate serves as nuclei to form dross to thereby cause soldering defects including a needle-like protrusion to occur, thus to satisfy all of the properties required for practical use.A lead-free solder alloy contains 0.1 to 1.5% by weight of Cu, not less than 0.01 and less than 0.05% by weight of Co, 0.05 to 0.5% by weight of Ag and 0.01 to 0.1% by weight of Sb, the remainder being Sn, or further contains 0.001 to 0.008% by weight of Ge, whereby the formation of dross is prevented, and thus the drawback that soldering defects including a needle-like protrusion occur is eliminated.
    • 提供了一种SnCu无铅焊料合金,其消除了金属间化合物过度沉淀的缺点,并且沉淀物用作形成浮渣的核,从而引起包括针状突起的焊接缺陷,从而满足所有所需的所有性能 供实际使用。 无铅焊料合金含有0.1〜1.5重量%的Cu,不小于0.01重量%,小于0.05重量%的Co,0.05〜0.5重量%的Ag和0.01〜0.1重量%的Sb,余量 为Sn,或进一步含有0.001〜0.008重量%的Ge,由此防止浮渣的形成,因此消除了包括针状突起发生的焊接缺陷的缺点。