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1. 发明申请

US20130075587A1 SOLID STATE IMAGING DEVICE, PORTABLE INFORMATION TERMINAL DEVICE AND METHOD FOR MANUFACTURING SOLID STATE IMAGING DEVICE 有权
标题翻译：固态成像装置，便携式信息终端装置和制造固态成像装置的方法
公开(公告)号：US20130075587A1
公开(公告)日：2013-03-28
申请号：US13416036
申请日：2012-03-09
申请人： Kazuhiro SUZUKI , Risako Ueno , Honam Kwon , Mitsuyoshi Kobayashi , Hideyuki Funaki
发明人： Kazuhiro SUZUKI , Risako Ueno , Honam Kwon , Mitsuyoshi Kobayashi , Hideyuki Funaki
IPC分类号： H01L27/146 , H01L31/18
CPC分类号： H01L27/14618 , H01L24/32 , H01L27/14627 , H01L27/14685 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： According to one embodiment, a solid state imaging device includes a sensor substrate having a plurality of pixels formed on an upper face, a microlens array substrate having a plurality of microlenses formed and a connection post with one end bonded to a region between the microlenses on the microlens array substrate and with the other end bonded to the upper face.
摘要翻译：根据一个实施例，固态成像装置包括具有形成在上表面上的多个像素的传感器基板，形成有多个微透镜的微透镜阵列基板和一端连接到微透镜之间的区域的连接柱微透镜阵列基板并且另一端结合到上表面。

2. 发明授权

US08686340B2 Solid imaging device and portable information terminal device having plural pixels being shielded and not shielded from light 有权
标题翻译：固体成像装置和便携式信息终端装置，其具有屏蔽并且不被光屏蔽的多个像素
公开(公告)号：US08686340B2
公开(公告)日：2014-04-01
申请号：US13361321
申请日：2012-01-30
申请人： Risako Ueno , Hideyuki Funaki , Kazuhiro Suzuki , Mitsuyoshi Kobayashi , Honam Kwon
发明人： Risako Ueno , Hideyuki Funaki , Kazuhiro Suzuki , Mitsuyoshi Kobayashi , Honam Kwon
IPC分类号： H01L27/00
CPC分类号： H01L27/14623 , H01L27/14632 , H01L27/14634
摘要： According to one embodiment, a solid imaging device includes an imaging substrate, a light-shielding member and a AD conversion circuits. The imaging substrate is two-dimensionally arranged with a plurality of pixels. The plurality of pixels have a top face formed with an optoelectronic conversion element for converting incident light into an electric charge and storing it and a back face opposite to the top faces. The imaging substrate is formed with a top face by the top face of the plurality of pixels and formed with a back face by the back face of the plurality of pixels. The light-shielding member is provided on the top face side of the imaging substrate. The AD conversion circuits is formed on the back face of the pixels shielded from the light.
摘要翻译：根据一个实施例，固体成像装置包括成像基板，遮光部件和AD转换电路。成像基板二维排列有多个像素。多个像素具有形成有光电转换元件的顶面，用于将入射光转换成电荷并将其存储，并且与顶面相反的背面。成像基板由多个像素的顶面形成有顶面，并且由多个像素的背面形成有背面。遮光构件设置在成像基板的顶面侧。 AD转换电路形成在屏蔽光的像素的背面上。

3. 发明授权

US08742527B2 Solid state imaging device, solid state imaging element, portable information terminal device and method for manufacturing the solid state imaging element 有权
标题翻译：固态成像装置，固态成像元件，便携式信息终端装置以及固态成像元件的制造方法
公开(公告)号：US08742527B2
公开(公告)日：2014-06-03
申请号：US13416290
申请日：2012-03-09
申请人： Kazuhiro Suzuki , Risako Ueno , Honam Kwon , Mitsuyoshi Kobayashi , Hideyuki Funaki
发明人： Kazuhiro Suzuki , Risako Ueno , Honam Kwon , Mitsuyoshi Kobayashi , Hideyuki Funaki
IPC分类号： H01L21/00 , H01L31/0232
CPC分类号： H01L27/14605 , H01L24/32 , H01L27/14618 , H01L27/14625 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： According to one embodiment, a solid state imaging device includes a sensor substrate curved such that an upper face having a plurality of pixels formed is recessed and an imaging lens provided on the upper face side.
摘要翻译：根据一个实施例，固态成像装置包括弯曲的传感器基板，使得形成有多个像素的上表面凹陷，并且设置在上表面侧的成像透镜。

4. 发明授权

US09136290B2 Solid state imaging device, portable information terminal device and method for manufacturing solid state imaging device 有权
标题翻译：固态成像装置，便携式信息终端装置以及制造固态成像装置的方法
公开(公告)号：US09136290B2
公开(公告)日：2015-09-15
申请号：US13416036
申请日：2012-03-09
申请人： Kazuhiro Suzuki , Risako Ueno , Honam Kwon , Mitsuyoshi Kobayashi , Hideyuki Funaki
发明人： Kazuhiro Suzuki , Risako Ueno , Honam Kwon , Mitsuyoshi Kobayashi , Hideyuki Funaki
IPC分类号： H01L27/146
CPC分类号： H01L27/14618 , H01L24/32 , H01L27/14627 , H01L27/14685 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： According to one embodiment, a solid state imaging device includes a sensor substrate having a plurality of pixels formed on an upper face, a microlens array substrate having a plurality of microlenses formed and a connection post with one end bonded to a region between the microlenses on the microlens array substrate and with the other end bonded to the upper face.
摘要翻译：根据一个实施例，固态成像装置包括具有形成在上表面上的多个像素的传感器基板，形成有多个微透镜的微透镜阵列基板和一端连接到微透镜之间的区域的连接柱微透镜阵列基板并且另一端结合到上表面。

5. 发明授权

US08937274B2 Solid-state imaging device and portable information terminal having a proportion of W pixels increases toward an outer periphery of each pixel block 有权
标题翻译：具有W像素的比例的固态成像装置和便携式信息终端朝向每个像素块的外周增加
公开(公告)号：US08937274B2
公开(公告)日：2015-01-20
申请号：US13713304
申请日：2012-12-13
申请人： Risako Ueno , Hiroto Honda , Mitsuyoshi Kobayashi , Kazuhiro Suzuki , Honam Kwon , Hideyuki Funaki
发明人： Risako Ueno , Hiroto Honda , Mitsuyoshi Kobayashi , Kazuhiro Suzuki , Honam Kwon , Hideyuki Funaki
IPC分类号： H01L27/00 , H01L27/146
CPC分类号： H01L27/146 , H01L27/14605 , H01L27/14625 , H01L27/14627 , H01L27/14645
摘要： A solid-state imaging device according to an embodiment includes: an imaging element including a semiconductor substrate and a plurality of pixel blocks, each of the pixel blocks including at least two of R pixels, G pixels, B pixels, and W pixels; a first optical system configured to form an image of an object on an imaging plane; and a second optical system including a microlens array having a plurality of microlenses provided for the respective pixels blocks, the second optical system being located between the imaging element and the first optical system, the second optical system being configured to reduce and re-image the image formed on the imaging plane onto each of the pixel blocks. A proportion of the W pixels to be provided increases in a direction from a center of each pixel block toward an outer periphery thereof.
摘要翻译：根据实施例的固态成像装置包括：成像元件，包括半导体衬底和多个像素块，每个像素块包括R像素，G像素，B像素和W像素中的至少两个; 第一光学系统，被配置为在成像平面上形成物体的图像; 以及第二光学系统，其包括具有为各个像素块设置的多个微透镜的微透镜阵列，所述第二光学系统位于所述成像元件和所述第一光学系统之间，所述第二光学系统被配置为减小并重新成像在成像平面上形成的每个像素块上的图像。要提供的W像素的比例在从每个像素块的中心朝向其外周的方向上增加。

6. 发明申请

US20130075849A1 SOLID STATE IMAGING DEVICE, SOLID STATE IMAGING ELEMENT, PORTABLE INFORMATION TERMINAL DEVICE AND METHOD FOR MANUFACTURING THE SOLID STATE IMAGING ELEMENT 有权
标题翻译：固态成像装置，固态成像元件，便携式信息终端装置及制造固态成像元件的方法
公开(公告)号：US20130075849A1
公开(公告)日：2013-03-28
申请号：US13416290
申请日：2012-03-09
申请人： Kazuhiro SUZUKI , Risako Ueno , Honam Kwon , Mitsuyoshi Kobayashi , Hideyuki Funaki
发明人： Kazuhiro SUZUKI , Risako Ueno , Honam Kwon , Mitsuyoshi Kobayashi , Hideyuki Funaki
IPC分类号： H01L27/146 , H01L31/18
CPC分类号： H01L27/14605 , H01L24/32 , H01L27/14618 , H01L27/14625 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： According to one embodiment, a solid state imaging device includes a sensor substrate curved such that an upper face having a plurality of pixels formed is recessed and an imaging lens provided on the upper face side.
摘要翻译：根据一个实施例，固态成像装置包括弯曲的传感器基板，使得形成有多个像素的上表面凹陷，并且设置在上表面侧的成像透镜。

7. 发明申请

US20130075586A1 SOLID IMAGING DEVICE AND PORTABLE INFORMATION TERMINAL DEVICE 有权
标题翻译：固体成像装置和便携式信息终端装置
公开(公告)号：US20130075586A1
公开(公告)日：2013-03-28
申请号：US13361321
申请日：2012-01-30
申请人： Risako UENO , Hideyuki Funaki , Kazuhiro Suzuki , Mitsuyoshi Kobayashi , Honam Kwon
发明人： Risako UENO , Hideyuki Funaki , Kazuhiro Suzuki , Mitsuyoshi Kobayashi , Honam Kwon
IPC分类号： H01L27/148 , H01L27/146
CPC分类号： H01L27/14623 , H01L27/14632 , H01L27/14634
摘要： According to one embodiment, a solid imaging device includes an imaging substrate, a light-shielding member and a AD conversion circuits. The imaging substrate is two-dimensionally arranged with a plurality of pixels. The plurality of pixels have a top face formed with an optoelectronic conversion element for converting incident light into an electric charge and storing it and a back face opposite to the top faces. The imaging substrate is formed with a top face by the top face of the plurality of pixels and formed with a back face by the back face of the plurality of pixels. The light-shielding member is provided on the top face side of the imaging substrate. The AD conversion circuits is formed on the back face of the pixels shielded from the light.
摘要翻译：根据一个实施例，固体成像装置包括成像基板，遮光部件和AD转换电路。成像基板二维排列有多个像素。多个像素具有形成有光电转换元件的顶面，用于将入射光转换成电荷并将其存储，并且与顶面相反的背面。成像基板由多个像素的顶面形成有顶面，并且由多个像素的背面形成有背面。遮光构件设置在成像基板的顶面侧。 AD转换电路形成在屏蔽光的像素的背面上。

8. 发明申请

US20130242161A1 SOLID-STATE IMAGING DEVICE AND PORTABLE INFORMATION TERMINAL 审中-公开
标题翻译：固态成像装置和便携式信息终端
公开(公告)号：US20130242161A1
公开(公告)日：2013-09-19
申请号：US13714960
申请日：2012-12-14
申请人： Mitsuyoshi Kobayashi , Risako Ueno , Kazuhiro Suzuki , Hiroto Honda , Hideyuki Funaki
发明人： Mitsuyoshi Kobayashi , Risako Ueno , Kazuhiro Suzuki , Hiroto Honda , Hideyuki Funaki
IPC分类号： H04N5/225
CPC分类号： H04N5/2254 , H04N5/2171
摘要： A solid-state imaging device according to an embodiment includes: an imaging element including a plurality of pixel blocks each containing a plurality of pixels; a first optical system forming an image of an object on an imaging plane; and a second optical system including a microlens array, the microlens array including a light transmissive substrate, a plurality of first microlenses formed on the light transmissive substrate, and a plurality of second microlenses formed around the first microlenses, a focal length of the first microlenses being substantially equal to a focal length of the second microlenses, an area of the first microlenses in contact with the light transmissive substrate being larger than an area of the second microlenses in contact with the light transmissive substrate, the second optical system being configured to reduce and reconstruct the image formed on the imaging plane on the pixel blocks via the microlens array.
摘要翻译：根据实施例的固态成像装置包括：成像元件，其包括多个像素块，每个像素块包含多个像素; 第一光学系统，其在成像平面上形成物体的图像; 以及包括微透镜阵列的第二光学系统，所述微透镜阵列包括透光衬底，形成在所述透光衬底上的多个第一微透镜以及围绕所述第一微透镜形成的多个第二微透镜，所述第一微透镜的焦距基本上等于第二微透镜的焦距，与透光基板接触的第一微透镜的面积大于与透光基板接触的第二微透镜的面积，第二光学系统被配置为减小并且通过微透镜阵列重建在像素块上的成像平面上形成的图像。

9. 发明申请

US20130075585A1 SOLID IMAGING DEVICE 审中-公开
标题翻译：固体成像装置
公开(公告)号：US20130075585A1
公开(公告)日：2013-03-28
申请号：US13361293
申请日：2012-01-30
申请人： Mitsuyoshi Kobayashi , Hideyuki Funaki , Risako Ueno , Kazuhiro Suzuki
发明人： Mitsuyoshi Kobayashi , Hideyuki Funaki , Risako Ueno , Kazuhiro Suzuki
IPC分类号： H01L27/146
CPC分类号： G01J1/0411 , G01J1/0242 , G01J1/0429 , G01J1/4228 , G01J4/04 , G01N21/21 , G02B5/3025 , G02B27/0075 , H01L27/14627 , H01L27/14629
摘要： According to one embodiment, a solid imaging device includes an imaging substrate, an imaging lens, a microlens array substrate and a polarizing plate array substrate. The imaging substrate has a plurality of pixels formed on an upper side thereof. The imaging lens is provided above the imaging substrate. The optical axis in the imaging lens intersects with the upper side of the imaging substrate. The microlens array substrate is provided between the imaging substrate and the imaging lens. A surface in the microlens array substrate has a plurality of microlenses arranged two-dimensionally. The surface of the microlens array intersects with the optical axis. The polarizing plate array substrate is provided between the imaging substrate and the imaging lens. The plurality of kinds of polarizing plates in the polarizing plate array substrate having polarization axes in mutually different directions are arranged two dimensionally.
摘要翻译：根据一个实施例，固体成像装置包括成像基板，成像透镜，微透镜阵列基板和偏振板阵列基板。成像基板在其上侧形成有多个像素。成像透镜设置在成像基板的上方。成像透镜中的光轴与成像基板的上侧相交。微透镜阵列基板设置在成像基板和成像透镜之间。微透镜阵列基板中的表面具有二维布置的多个微透镜。微透镜阵列的表面与光轴相交。偏振板阵列基板设置在成像基板和成像透镜之间。偏振板阵列基板中的偏振板在相互不同的方向上具有偏振轴的多种偏振片被二维排列。

10. 发明授权

US09048157B2 Solid-state imaging device and portable information terminal 有权
标题翻译：固态成像装置和便携式信息终端
公开(公告)号：US09048157B2
公开(公告)日：2015-06-02
申请号：US13221061
申请日：2011-08-30
申请人： Risako Ueno , Hideyuki Funaki , Mitsuyoshi Kobayashi
发明人： Risako Ueno , Hideyuki Funaki , Mitsuyoshi Kobayashi
IPC分类号： H04N3/14 , H04N5/225 , H01L27/146
CPC分类号： G06T7/0065 , G02B3/0037 , H01L27/14627 , H04N5/23229 , H04N9/045 , H04N2209/042
摘要： A solid-state imaging device according to an embodiment includes: an imaging element formed on a semiconductor substrate, and comprising an imaging region including a plurality of pixel blocks each including a plurality of pixels; a first optical system forming an image of an object on an imaging plane; and a second optical system comprising a microlens array including a plurality of microlenses each corresponding to one of the pixel blocks, and reducing and re-forming the image to be formed on the imaging plane on the pixel blocks corresponding to the respective microlenses. The imaging plane of the first optical system is located further away from the first optical system than the imaging element when the object is located at an infinite distance.
摘要翻译：根据实施例的固态成像装置包括：成像元件，形成在半导体衬底上，并且包括：成像区域，包括多个像素块，每个像素块包括多个像素; 第一光学系统，其在成像平面上形成物体的图像; 以及第二光学系统，其包括微透镜阵列，所述微透镜阵列包括多个微透镜，每个微透镜各自对应于所述像素块之一，并且在对应于所述各个微透镜的像素块上减小并重新形成将在所述成像平面上形成的图像。当物体位于无限距离时，第一光学系统的成像平面位于比成像元件更远离第一光学系统的位置。

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