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    • 1. 发明授权
    • Semiconductor storage device and production method thereof
    • 半导体存储装置及其制造方法
    • US06498753B2
    • 2002-12-24
    • US09944792
    • 2001-08-31
    • Kazuhiko SanadaKenji SaitouKiyokazu IshigeHitoshi Nakamura
    • Kazuhiko SanadaKenji SaitouKiyokazu IshigeHitoshi Nakamura
    • G11C1604
    • G11C16/16Y10S438/942Y10S438/945
    • The present invention enables to complete a data erase of memory cells of a group in a semiconductor storage device where a data erase is uniformly performed to memory cells of a group until all the cell threshold values become below a reference and memory cells having a cell threshold value below a lower limit are supplied with an electric charge. When a production error occurs in such a way that some memory cells in a predetermined position of a group have a lower erase speed, the semiconductor device is formed in such a way that these memory cells have an erase speed higher than an ideal value. When some memory cells of a group have a lower erase speed, an excessive erase is performed in most memory cells of the group requiring electric charge supply, which increase the erase time as a whole.
    • 本发明能够完成对半导体存储装置中的组的存储单元的数据擦除,其中对组的存储单元均匀地执行数据擦除,直到所有单元阈值变为低于参考值,并且存储单元具有单元阈值 提供低于下限值的电荷。 当以使得组中预定位置的一些存储单元具有较低擦除速度的方式发生制造误差时,以使得这些存储单元具有高于理想值的擦除速度的方式形成半导体器件。 当组中的一些存储器单元具有较低的擦除速度时,在需要电荷供应的组的大多数存储器单元中执行过度擦除,这增加了整个擦除时间。
    • 2. 发明授权
    • Semiconductor storage device and production method thereof
    • 半导体存储装置及其制造方法
    • US06330191B2
    • 2001-12-11
    • US09725633
    • 2000-11-29
    • Kazuhiko SanadaKenji SaitouKiyokazu IshigeHitoshi Nakamura
    • Kazuhiko SanadaKenji SaitouKiyokazu IshigeHitoshi Nakamura
    • G11C1604
    • G11C16/16Y10S438/942Y10S438/945
    • The present invention enables to complete a data erase of memory cells of a group in a semiconductor storage device where a data erase is uniformly performed to memory cells of a group until all the cell threshold values become below a reference and memory cells having a cell threshold value below a lower limit are supplied with an electric charge. When a production error occurs in such a way that some memory cells in a predetermined position of a group have a lower erase speed, the semiconductor device is formed in such a way that these memory cells have an erase speed higher than an ideal value. When some memory cells of a group have a lower erase speed, an excessive erase is performed in most memory cells of the group requiring electric charge supply, which increase the erase time as a whole. However, when only some memory cells of a group have a higher erase speed, an excessive erase requiring electric charge supply occurs only in some memories and accordingly, it is possible to rapidly complete the data erase in the memory cells of the group.
    • 本发明能够完成对半导体存储装置中的组的存储单元的数据擦除,其中对组的存储单元均匀地执行数据擦除,直到所有单元阈值变为低于参考值,并且存储单元具有单元阈值 提供低于下限值的电荷。 当以使得组中预定位置的一些存储单元具有较低擦除速度的方式发生制造误差时,以使得这些存储单元具有高于理想值的擦除速度的方式形成半导体器件。 当组中的一些存储器单元具有较低的擦除速度时,在需要电荷供应的组的大多数存储器单元中执行过度擦除,这增加了整个擦除时间。 然而,当组中只有一些存储单元具有较高的擦除速度时,仅在一些存储器中发生需要电荷供给的过度擦除,因此可以迅速地完成该组的存储单元中的数据擦除。
    • 3. 发明授权
    • Semiconductor storage device and production method thereof
    • 半导体存储装置及其制造方法
    • US06538927B1
    • 2003-03-25
    • US10183701
    • 2002-06-26
    • Kazuhiko SanadaKenji SaitouKiyokazu IshigeHitoshi Nakamura
    • Kazuhiko SanadaKenji SaitouKiyokazu IshigeHitoshi Nakamura
    • H01L21339
    • G11C16/16Y10S438/942Y10S438/945
    • The present invention enables to complete a data erase of memory cells of a group in a semiconductor storage device where a data erase is uniformly performed to memory cells of a group until all the cell threshold values become below a reference and memory cells having a cell threshold value below a lower limit are supplied with an electric charge. When a production error occurs in such a way that some memory cells in a predetermined position of a group have a lover erase speed, the semiconductor device is formed in such a way that these memory cells have an erase speed higher than an ideal value. When some memory cells of a group have a lower erase speed, an excessive erase is performed in most memory cells of the group requiring electric charge supply, which increase the erase time as a whole. However, when only some memory cells of a group have a higher erase speed, an excessive erase requiring electric charge supply occurs only in some memories and accordingly, it is possible to rapidly complete the data.
    • 本发明能够完成对半导体存储装置中的组的存储单元的数据擦除,其中对组的存储单元均匀地执行数据擦除,直到所有单元阈值变为低于参考值,并且存储单元具有单元阈值 提供低于下限值的电荷。 当以这样的方式发生制造错误时,组中预定位置的某些存储单元具有情人擦除速度,所以半导体器件形成为使得这些存储单元具有高于理想值的擦除速度。 当组中的一些存储器单元具有较低的擦除速度时,在需要电荷供应的组的大多数存储器单元中执行过度擦除,这增加了整个擦除时间。 然而,当组中仅一些存储单元具有较高的擦除速度时,仅在某些存储器中发生需要电荷供应的过度擦除,因此可以快速完成数据。
    • 8. 发明授权
    • Method of manufacturing a semiconductor device with a shallow trench isolation structure
    • 制造具有浅沟槽隔离结构的半导体器件的方法
    • US07449393B2
    • 2008-11-11
    • US11090839
    • 2005-03-25
    • Kenji SaitouKenichi Hidaka
    • Kenji SaitouKenichi Hidaka
    • H01L21/76
    • H01L27/11521H01L21/76224H01L27/115
    • In a method of manufacturing a semiconductor device with a shallow trench isolation structure, trenches are formed to extend into a semiconductor substrate. Subsequently, a first insulating film is formed to fill the trenches and to cover a whole surface of the semiconductor substrate, and then a first chemical mechanical polishing (CMP) method is carried out to remove the first insulating film such that the first insulating film is left only in the trenches. Subsequently, a second insulating film is formed to fill the trenches and to cover a whole surface of the semiconductor substrate, and a second CMP method is carried out to remove the second insulating film such that the second insulating film is left only in the trenches.
    • 在制造具有浅沟槽隔离结构的半导体器件的方法中,形成沟槽延伸到半导体衬底中。 随后,形成第一绝缘膜以填充沟槽并覆盖半导体衬底的整个表面,然后进行第一化学机械抛光(CMP)方法以去除第一绝缘膜,使得第一绝缘膜为 只留在战壕里。 随后,形成第二绝缘膜以填充沟槽并覆盖半导体衬底的整个表面,并且执行第二CMP方法以去除第二绝缘膜,使得第二绝缘膜仅留在沟槽中。