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1. 发明申请

US20130252019A1 Copper-Clad Laminate and Method for Manufacturing Same 审中-公开
标题翻译：铜包层压板及其制造方法
公开(公告)号：US20130252019A1
公开(公告)日：2013-09-26
申请号：US13989839
申请日：2011-12-26
申请人： Kazuhiko Sakaguchi , Hajime Inazumi , Hisakazu Yachi
发明人： Kazuhiko Sakaguchi , Hajime Inazumi , Hisakazu Yachi
IPC分类号： H01B7/40 , C23C18/16
CPC分类号： H01B7/40 , B32B15/20 , B32B27/16 , B32B2310/14 , C08J7/123 , C08J2367/03 , C23C18/1664 , C25D7/00 , Y10T428/12556 , Y10T428/24355 , Y10T428/31678
摘要： Provided is a copper-clad laminate comprising a metal conductor layer formed by dry plating and/or wet plating on a surface obtained by subjecting a surface of a liquid crystal polymer film to plasma treatment in an oxygen atmosphere or a nitrogen atmosphere at a gas pressure of 2.6 to 15 Pa. Further provided is a copper-clad laminate comprising a liquid crystal polymer film having a surface roughness after the plasma treatment of 0.15 μm or less in terms of arithmetic mean roughness Ra and 0.20 μm or less in terms of root-mean-square roughness Rq. Further provided is a method for manufacturing a copper-clad laminate, wherein a metal conductor layer is formed by dry plating and/or wet plating after subjecting a surface of a liquid crystal polymer film to plasma treatment in an oxygen atmosphere or a nitrogen atmosphere at a gas pressure of 2.6 to 15 Pa.
摘要翻译：提供一种覆铜层压板，其包括通过在氧气氛或氮气氛中以气体压力对液晶聚合物膜的表面进行等离子体处理而获得的表面上通过干式电镀和/或湿式电镀形成的金属导体层 2.6〜15Pa。还提供了一种覆铜层压板，其包含在等离子体处理后的表面粗糙度为0.15μm以下的液晶聚合物膜，其算术平均粗糙度Ra为0.20μm以下，均方粗糙度Rq。还提供了一种制造覆铜层压板的方法，其中通过在氧气氛或氮气氛中对液晶聚合物膜的表面进行等离子体处理之后通过干电镀和/或湿法电镀形成金属导体层气压为2.6〜15Pa。

2. 发明申请

US20140023881A1 Liquid Crystal Polymer Film Based Copper-Clad Laminate and Method for Producing Same 审中-公开
标题翻译：液晶聚合物膜基铜包覆层及其制造方法
公开(公告)号：US20140023881A1
公开(公告)日：2014-01-23
申请号：US14000318
申请日：2012-02-15
申请人： Kazuhiko Sakaguchi , Hajime Inazumi , Hisakazu Yachi
发明人： Kazuhiko Sakaguchi , Hajime Inazumi , Hisakazu Yachi
IPC分类号： B32B15/08 , B32B15/20 , C09K19/38
CPC分类号： B32B15/08 , B32B7/12 , B32B15/20 , B32B2307/202 , B32B2457/202 , C08J7/123 , C08J2367/03 , C09K19/38 , C09K2219/03 , H05K1/0346 , H05K3/022 , H05K3/381 , H05K3/388 , H05K2201/0141 , H05K2203/095 , Y10T428/12535 , Y10T428/31678
摘要： Provided is a liquid crystal polymer film based copper-clad laminate characterized in that a surface of one side or each of both sides of a liquid crystal polymer film has a nitrogen atom content of 10 at % or more, and a metal conductor layer formed by dry plating and/or wet painting is provided on the surface of the liquid crystal polymer film having the nitrogen atom content of 10 at % or more. The liquid crystal polymer film based copper-clad laminate is characterized by having arithmetic average roughness Ra of 0.15 μm or less and a root-mean-square roughness Rq of 0.20 μm or less as surface roughness of the liquid crystal polymer film. Also provided is a method for producing a liquid crystal polymer film based copper-clad laminate characterized by performing plasma processing on the surface of the liquid crystal polymer film under a nitrogen atmosphere at a gas pressure of 2.6 to 15 Pa, followed by forming the metal conductor layer by dry plating and/or wet plating.
摘要翻译：本发明提供一种液晶聚合物膜系覆铜层压板，其特征在于，液晶聚合物膜的一面或两面的表面的氮原子含量为10原子％以上，金属导体层由在氮原子含量为10原子％以上的液晶聚合物膜的表面上设置有干电镀和/或湿法涂布。液晶聚合物膜基覆铜层压板的特征在于，作为液晶聚合物膜的表面粗糙度，算术平均粗糙度Ra为0.15μm以下，均方根粗糙度Rq为0.20μm以下。还提供了一种用于制备液晶聚合物膜基覆铜层压板的方法，其特征在于在氮气气氛下在气压为2.6至15Pa的条件下，在液晶聚合物膜的表面上进行等离子体处理，然后形成金属导体层通过干电镀和/或湿电镀。

3. 发明申请

US20140011047A1 Two-Layered Copper-Clad Laminate Material, and Method for Producing Same 审中-公开
标题翻译：两层铜包覆层压材料及其制造方法
公开(公告)号：US20140011047A1
公开(公告)日：2014-01-09
申请号：US13983786
申请日：2012-01-25
申请人： Hajime Inazumi , Kazuhiko Sakaguchi , Shinichi Sasaki
发明人： Hajime Inazumi , Kazuhiko Sakaguchi , Shinichi Sasaki
IPC分类号： H05K1/03 , C25D7/00 , C23C14/20
CPC分类号： H05K1/0346 , C23C14/022 , C23C14/025 , C23C14/20 , C23C14/205 , C23C28/00 , C25D7/00 , Y10T428/12569 , Y10T428/24975
摘要： A two-layered copper-clad laminate material, in which one surface or both surfaces of a polyimide film having a thickness of 12.5 to 50 μm is subjected to a modification treatment by means of a glow discharge plasma treatment in an oxygen gas atmosphere, and a copper layer having a thickness of 1 to 5 μm is formed by means of sputtering or electroplating on one surface or both surfaces of the polyimide film after the modification treatment; characterized in that the integrated intensity ratio of a C1S peak at 287 to 290 eV to a C1S peak at 283 to 287 eV, obtained by analyzing the photoelectron spectroscopy (XPS) spectra of the surface of the polyimide film after the plasma treatment, is within the range of 0.03 to 0.11. The present invention aims at discovering; as a consequence of performing surface characterization by subjecting the PI film surface to XPS analysis before and after the plasma treatment, and of evaluating the dissolution properties and adhesive strength of the PI film before and after the plasma treatment; a two-layered copper-clad laminate material that is ideal to be processed during a wet PI etching step, and a production method for said two-layered copper-clad laminate material.
摘要翻译：通过在氧气气氛中的辉光放电等离子体处理对厚度为12.5〜50μm的聚酰亚胺膜的一面或两面进行改性处理的双层覆铜层叠材料，在改性处理之后，通过溅射或电镀在聚酰亚胺膜的一个表面或两个表面上形成厚度为1至5μm的铜层; 其特征在于，通过分析等离子体处理后聚酰亚胺膜表面的光电子能谱（XPS）光谱获得的287〜290eV的C1S峰与283〜287eV的C1S峰的积分强度比在范围为0.03〜0.11。本发明旨在发现; 作为通过在等离子体处理之前和之后对PI膜表面进行XPS分析并且评估PI膜在等离子体处理之前和之后的溶解性能和粘合强度进行表面表征的结果的结果。在湿式PI蚀刻步骤中理想的加工的双层覆铜层压材料以及所述两层覆铜层压材料的制造方法。

4. 发明申请

US20130256006A1 Method for Forming Circuit on Flexible Laminate Substrate 审中-公开
标题翻译：柔性层压基板上形成电路的方法
公开(公告)号：US20130256006A1
公开(公告)日：2013-10-03
申请号：US13884650
申请日：2011-11-08
申请人： Kazuhiko Sakaguchi , Hajime Inazumi
发明人： Kazuhiko Sakaguchi , Hajime Inazumi
IPC分类号： H05K3/06 , H05K1/09
CPC分类号： H05K3/06 , C23F1/02 , C23F1/14 , C23F1/16 , C23F1/44 , H05K1/0393 , H05K1/09 , H05K3/388 , H05K2201/0154 , H05K2201/0355 , Y10T29/49128
摘要： A method for forming a circuit on a flexible laminate substrate, wherein when a circuit is formed using an adhesive-free flexible laminate having a polyimide film that serves as a flexible laminate substrate at least one surface of which is plasma-treated, a tie-coat layer A formed on the polyimide film, a metal conductor layer B formed on the tie-coat layer, and a nickel-copper alloy layer as an alloy layer C on the metal conductor layer, a photoresist is applied on the alloy layer C formed on the metal conductor layer, the photoresist is exposed and developed, the sputter layer C, the metal conductor layer B, and the alloy layer C are removed by etching using the same etching solution so as to retain a circuit portion, and the photoresist of the circuit portion is further removed so as to form the circuit.
摘要翻译：一种在柔性层压基板上形成电路的方法，其中当使用不含粘合剂的柔性层压体形成电路时，该层压板具有聚酰亚胺膜，该聚酰亚胺膜用作至少一个表面被等离子体处理的柔性层压基板，形成在聚酰亚胺膜上的涂层A，在接合涂层上形成的金属导体层B和在金属导体层上作为合金层C的镍 - 铜合金层，在形成的合金层C上施加光致抗蚀剂在金属导体层上，曝光和显影光致抗蚀剂，通过使用相同的蚀刻溶液进行蚀刻来去除溅射层C，金属导体层B和合金层C，以便保持电路部分，并且光致抗蚀剂电路部分被进一步去除以形成电路。

5. 发明申请

US20130001186A1 METHOD OF FORMING CIRCUIT ON FLEXIBLE LAMINATE SUBSTRATE 审中-公开
标题翻译：在柔性层压基板上形成电路的方法
公开(公告)号：US20130001186A1
公开(公告)日：2013-01-03
申请号：US13577493
申请日：2011-02-04
申请人： Kazuhiko Sakaguchi , Hajime Inazumi
发明人： Kazuhiko Sakaguchi , Hajime Inazumi
IPC分类号： H05K3/06
CPC分类号： H05K3/062 , C23F1/02 , C23F1/14 , C23F1/18 , C23F1/26 , C23F1/44 , H05K1/0393 , H05K3/381 , H05K3/388 , H05K2201/0154 , H05K2203/095
摘要： Disclosed is a method of forming a circuit on a flexible laminate substrate. When forming a circuit using an adhesiveless flexible laminate which includes a polyimide film as the flexible laminate substrate in which at least one surface thereof is subject to plasma treatment, a tie-coat layer A formed on the polyimide film, a metal conductor layer B formed on the tie-coat layer, and a layer C which has the same components as the tie-coat layer that was formed on the metal conductor layer, the following method is used. The photoresist is coated on the layer C which has the same components as the tie-coat layer that was formed on the metal conductor layer, the photoresist is exposed and developed, the layer C other than the circuit forming parts thereof is selectively removed in advance via pre-etching, the conductor layer B is thereafter removed by supplemental etching with leaving the circuit portion, and the photoresist of the circuit portion is further removed so as to form the circuit. By forming a tie-coat layer or a metal or alloy that is equivalent to the tie-coat layer on the metal conductor layer of the adhesiveless flexible laminate, simultaneously achieved are the inhibition of side etching, which interferes with the achievement of finer pitches of circuit wiring, and the improvement of linearity of the wiring.
摘要翻译：公开了一种在柔性层压基板上形成电路的方法。当使用包括聚酰亚胺膜作为其至少一个表面进行等离子体处理的柔性层压基板的无粘合剂柔性层压体形成电路时，形成在聚酰亚胺膜上的粘结层A，形成的金属导体层B 在连接层上形成的层C和与金属导体层上形成的结合层相同的层C，使用以下方法。光致抗蚀剂被涂覆在具有与形成在金属导体层上的结合层相同成分的层C上，光致抗蚀剂被曝光和显影，除了其电路形成部分之外的层C被预先选择性地去除通过预蚀刻，然后通过补充蚀刻除去导体层B，留下电路部分，并且进一步去除电路部分的光致抗蚀剂以形成电路。通过形成与无粘合剂柔性层压体的金属导体层上的粘结层相当的粘结层或金属或合金，同时实现的侧蚀刻的抑制，这妨碍了更好的间距电路布线，线路线性的提高。

6. 发明申请

US20120034475A1 Metal-Coated Polyimide Resin Substrate with Excellent Thermal Aging Resistance Properties 审中-公开
标题翻译：金属涂层聚酰亚胺树脂基材具有优异的耐热老化性能
公开(公告)号：US20120034475A1
公开(公告)日：2012-02-09
申请号：US13148831
申请日：2010-02-17
申请人： Taku Yoshida , Hajime Inazumi
发明人： Taku Yoshida , Hajime Inazumi
IPC分类号： B32B15/08
CPC分类号： B32B15/20 , B32B15/08 , B32B27/281 , B32B2255/205 , B32B2307/202 , B32B2307/546 , B32B2307/732 , C25D5/34 , H05K1/0346 , H05K3/381 , H05K3/388 , H05K2201/0154 , Y10T428/31681
摘要： [Object] To provide a metal-coated polyimide resin substrate that does not deteriorate the initial adhesion between the metal-coated polyimide resin film and the metal layer and has high adhesion after aging at 150° C. for 168 hours.[Solution] A metal-coated polyimide resin substrate in which a barrier layer is formed by a dry process after performing surface modification to one surface or both surfaces of a polyimide resin film by a dry process, a seed layer is thereafter formed by a wet process or a dry process, and a conductive film is formed on a surface layer thereof by a wet process; wherein, at the peeling surface on the conductive film layer side after the metal-coated polyimide resin substrate is subject to a 90-degree peel test, the thickness of a mixed layer of polyimide residue and barrier metal layer residue according to in-depth profiling with a time-of-flight secondary ion mass spectrometer (TOF-SIMS) is 0.70 nm or less based on Si sputter rate conversion, and peel strength retention after an aging test at 150° C. for 168 hours (peel strength after aging at 150° C. for 168 hours/initial peel strength) is 50% or higher.
摘要翻译：本发明提供一种金属包覆的聚酰亚胺树脂基板，其不会使金属包覆的聚酰亚胺树脂膜与金属层之间的初始粘合性劣化，并且在150℃下老化168小时后具有高粘附性。 [解决方案]通过干法对聚酰亚胺树脂膜的一面或两面进行表面改性后，通过干法形成阻挡层的金属涂布的聚酰亚胺树脂基板，然后通过湿法形成种子层工艺或干法，并且通过湿法在其表面层上形成导电膜; 其中，在金属涂覆的聚酰亚胺树脂基板进行90度剥离试验之后的导电膜层侧的剥离面上，根据深度图案，聚酰亚胺残留物和阻隔金属层残留物的混合层的厚度使用飞行时间二次离子质谱仪（TOF-SIMS）为基于Si溅射速率转换为0.70nm以下，150℃下老化试验后的剥离强度保持168小时（老化后的剥离强度 150℃，168小时/初始剥离强度）为50％以上。

7. 发明申请

US20140017513A1 Two-Layered Copper-Clad Laminate Material, and Method for Producing Same 审中-公开
标题翻译：两层铜包覆层压材料及其制造方法
公开(公告)号：US20140017513A1
公开(公告)日：2014-01-16
申请号：US13984175
申请日：2012-01-25
申请人： Hajime Inazumi , Shinichi Sasaki
发明人： Hajime Inazumi , Shinichi Sasaki
IPC分类号： C23C28/02
CPC分类号： C23C28/021 , B32B38/0008 , B32B2038/0092 , B32B2309/105 , B32B2311/12 , B32B2379/08 , C23C14/022 , C23C14/025 , C23C14/205 , H05K3/022 , H05K3/381 , H05K2201/0154 , H05K2203/095 , Y10T428/12778 , Y10T428/24975
摘要： A two-layered copper-clad laminate material in which a copper layer having a thickness of 1 to 5 μm is formed by means of sputtering or electroplating on one surface or both surfaces of a polyimide film having a thickness of 12.5 to 50 μm after a plasma treatment is performed in a nitrogen gas atmosphere, the two-layered copper-clad laminate material being characterized in that the dissolution of the aforementioned polyimide film with an etching liquid is delayed compared with a polyimide film that is not subjected to the plasma treatment, the aforementioned dissolution being delayed as a consequence of modifying the surface of the polyimide film by incorporating nitrogen into the polyimide film by means of the plasma treatment in the nitrogen gas atmosphere.
摘要翻译：通过溅射或电镀在厚度为12.5〜50μm的聚酰亚胺膜的一个表面或两面上形成厚度为1〜5μm的铜层的双层覆铜层压材料等离子体处理在氮气气氛中进行，双层覆铜层压材料的特征在于，与不进行等离子体处理的聚酰亚胺膜相比，上述聚酰亚胺膜与蚀刻液的溶解延迟，由于通过在氮气气氛中的等离子体处理将氮掺入到聚酰亚胺膜中而使聚酰亚胺膜的表面改性，所以上述溶解被延迟。

8. 发明授权

US08487191B2 Flexible laminate and flexible electronic circuit board formed by using the same 失效
标题翻译：柔性层压板和柔性电子电路板通过使用它们组成
公开(公告)号：US08487191B2
公开(公告)日：2013-07-16
申请号：US13141730
申请日：2009-12-22
申请人： Nobuhito Makino , Hajime Inazumi , Taku Yoshida
发明人： Nobuhito Makino , Hajime Inazumi , Taku Yoshida
IPC分类号： H05K1/00 , B32B15/08
CPC分类号： B32B15/08 , B32B7/12 , B32B15/20 , B32B27/16 , B32B27/281 , B32B2307/202 , B32B2307/538 , B32B2307/546 , B32B2307/732 , H05K1/0346 , H05K3/388 , H05K2201/0154 , H05K2203/095 , H05K2203/1545 , Y10T428/12569
摘要： An adhesive-free flexible laminate formed from a polyimide film in which at least one surface has been plasma treated, a tie-coat layer formed on the surface of the plasma-treated polyimide film, a metal seed layer made of either copper or copper alloy and which is formed on the tie-coat layer, and a metal conductive layer made of either copper or copper alloy and which is formed on the metal seed layer, wherein the atomic percent of Cu inclusion in the tie-coat layer is 0.5 at % or less. Consequently, provided is a flexible laminate capable of effectively inhibiting the deterioration of the peel strength upon producing a flexible laminate (in particular a two-layer metalizing laminate).
摘要翻译：由聚酰亚胺膜形成的无粘合剂柔性层压体，其中至少一个表面经过等离子体处理，形成在等离子体处理的聚酰亚胺膜的表面上的粘结层，由铜或铜合金制成的金属籽晶层并且在所述连接层上形成有由铜或铜合金构成的金属导电层，所述金属导电层形成在所述金属种子层上，其中所述连接层中的Cu夹杂物的原子百分比为0.5原子％或更少。因此，提供了一种柔性层压体，其能够有效地抑制柔性层压体（特别是两层金属化层压体）的剥离强度的劣化。

9. 发明申请

US20120012367A1 Flexible Laminate and Flexible Electronic Circuit Board Formed by using the same 失效
标题翻译：柔性层压板和柔性电子电路板通过使用它们形成
公开(公告)号：US20120012367A1
公开(公告)日：2012-01-19
申请号：US13141730
申请日：2009-12-22
申请人： Nobuhito Makino , Hajime Inazumi , Taku Yoshida
发明人： Nobuhito Makino , Hajime Inazumi , Taku Yoshida
IPC分类号： B32B15/08 , H05K1/00
CPC分类号： B32B15/08 , B32B7/12 , B32B15/20 , B32B27/16 , B32B27/281 , B32B2307/202 , B32B2307/538 , B32B2307/546 , B32B2307/732 , H05K1/0346 , H05K3/388 , H05K2201/0154 , H05K2203/095 , H05K2203/1545 , Y10T428/12569
摘要： An adhesive-free flexible laminate formed from a polyimide film in which at least one surface has been plasma treated, a tie-coat layer formed on the surface of the plasma-treated polyimide film, a metal seed layer made of either copper or copper alloy and which is formed on the tie-coat layer, and a metal conductive layer made of either copper or copper alloy and which is formed on the metal seed layer, wherein the atomic percent of Cu inclusion in the tie-coat layer is 0.5 at % or less. Consequently, provided is a flexible laminate capable of effectively inhibiting the deterioration of the peel strength upon producing a flexible laminate (in particular a two-layer metalizing laminate).
摘要翻译：由聚酰亚胺膜形成的无粘合剂柔性层压体，其中至少一个表面经过等离子体处理，形成在等离子体处理的聚酰亚胺膜的表面上的粘结层，由铜或铜合金制成的金属籽晶层并且在所述连接层上形成有由铜或铜合金构成的金属导电层，所述金属导电层形成在所述金属种子层上，其中所述连接层中的Cu夹杂物的原子百分比为0.5原子％或更少。因此，提供了一种柔性层压体，其能够有效地抑制柔性层压体（特别是两层金属化层压体）的剥离强度的劣化。

10. 发明申请

US20110003169A1 Non-Adhesive Flexible Laminate 审中-公开
标题翻译：非粘合柔性层压板
公开(公告)号：US20110003169A1
公开(公告)日：2011-01-06
申请号：US12865885
申请日：2008-12-25
申请人： Nobuhito Makino , Akito Hokura , Hajime Inazumi
发明人： Nobuhito Makino , Akito Hokura , Hajime Inazumi
IPC分类号： B32B15/08
CPC分类号： H05K3/388 , H05K1/0346 , H05K3/381 , H05K2201/0154 , H05K2203/095 , Y10T428/12569
摘要： Provided is a non-adhesive flexible laminate comprising a polyimide film at least one surface of which has been plasma-treated, a tie-coat layer formed on the plasma-treated surface, a metal seed layer formed on the tie-coat layer, and a metal conductor layer formed on the metal seed layer, wherein a ratio ρp/ρt of actual density ρp to theoretical density ρt of the tie-coat layer satisfies ρp/ρt>0.6. The invention aims to improve the adhesion between the metal layer and the polyimide film of the non-adhesive flexible laminate (in particular a two-layered metalizing laminate).
摘要翻译：提供了一种不粘性柔性层压体，其包括至少一个表面经过等离子体处理的聚酰亚胺膜，形成在等离子体处理表面上的粘结层，形成在粘结层上的金属种子层，以及形成在金属种子层上的金属导体层，其中实心密度与理论密度的比值与结合层的理论密度之比满足r≥0.6。本发明旨在改善非粘性柔性层压材料（特别是两层金属层压板）的金属层与聚酰亚胺膜之间的粘附性。

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