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1. 发明授权

US06403959B1 Infrared detector element, and infrared sensor unit and infrared detecting device using it 失效
标题翻译：红外线检测元件，红外线传感器单元及红外线检测装置
公开(公告)号：US06403959B1
公开(公告)日：2002-06-11
申请号：US09402969
申请日：1999-11-22
申请人： Kazuhiko Fujikawa , Takeshi Masutani , Tsutomu Nakanishi , Shinji Umeda , Kazuki Komaki , Katsumasa Miki , Koji Nomura
发明人： Kazuhiko Fujikawa , Takeshi Masutani , Tsutomu Nakanishi , Shinji Umeda , Kazuki Komaki , Katsumasa Miki , Koji Nomura
IPC分类号： G01J102
CPC分类号： G01J5/04 , G01J5/0022 , G01J5/0025 , G01J5/0285 , G01J5/045 , G01J5/046 , G01J5/08 , G01J5/0806 , G01J5/0846 , G01J5/0853 , G01J5/0875 , G01J5/089 , G01J5/10 , G01J5/34
摘要： The present invention relates to an infrared detector element to detect infrared rays by means of a pyroelectric material, and an infrared sensor unit and an infrared detecting device using the infrared detector element and has an object of realizing an omnidirectional infrared detector element that can gain an output against an object to be detected moving in whatever directions. In order to accomplish this object, the present invention proposes a setup comprising a pair of first electrodes (12, 13), which have a function of absorbing infrared rays, are close to trapezoidal in shape, respectively, and are disposed on one of the surfaces of a pyroelectric material (11) with electrical connections made in such a way that the first electrodes are opposite to each other in polarity, and a pair of second electrodes (14, 15) disposed on the other surface of the pyroelectric material (11) and electrically connected with each other, in which the lower side of the close to trapezoidal shape of the first electrodes (12, 13) of one hand is aligned in the same direction as the lower side of the close to trapezoidal shape of the second electrodes (14, 15) of the other hand, thereby producing an effect of gaining an output against an object to be detected making a movement from whatever directions.
摘要翻译：本发明涉及一种利用热电材料检测红外线的红外线检测元件，以及使用该红外线检测元件的红外线传感器单元和红外线检测装置，其目的在于，实现能够获得红外线检测元件的全向红外线检测元件针对被检测物体的输出在任何方向上移动。为了实现该目的，本发明提出一种包括具有吸收红外线功能的一对第一电极（12,13）分别接近梯形的设置，并且设置在其中一个具有以使得第一电极极性彼此相对的方式制造的电连接的热电材料（11）的表面和设置在热电材料（11）的另一表面上的一对第二电极（14,15））并且彼此电连接，其中一只手的第一电极（12,13）接近梯形形状的下侧在与第二电极（12,13）的接近梯形形状的下侧相同的方向上对准另一方面的电极（14,15），从而产生相对于从任何方向移动的待检测物体的输出的效果。

2. 发明授权

US06395575B1 Method of manufacturing sensor and resistor element 失效
标题翻译：制造传感器和电阻元件的方法
公开(公告)号：US06395575B1
公开(公告)日：2002-05-28
申请号：US09463144
申请日：2000-01-20
申请人： Shinji Umeda , Koji Nomura , Akihiko Ibata , Hiroshi Fujii , Takeshi Masutani
发明人： Shinji Umeda , Koji Nomura , Akihiko Ibata , Hiroshi Fujii , Takeshi Masutani
IPC分类号： H01L2100
CPC分类号： G01D5/16 , H01L31/101 , H01L31/18
摘要： A sensor in which a field effect transistor element 3 having a gate electrode 6 on its rear side is electrically connected onto a resistive element 2 having a top surface electrode and a bottom surface electrode in such a way that the gate electrode 6 and a portion of the top surface electrode of the resistive element 2 coincides, and a grounding electrode 12 on a substrate is electrically connected with the bottom surface electrode of the resistive element 2 so that they coincides.
摘要翻译：其中具有在其后侧具有栅极电极6的场效应晶体管元件3的传感器电连接到具有顶表面电极和底表面电极的电阻元件2上，使得栅电极6和一部分电阻元件2的顶表面电极重合，并且衬底上的接地电极12与电阻元件2的底表面电极电连接使得它们重合。

3. 发明授权

US5850688A Method of manufacturing electronic component 失效
标题翻译：制造电子元器件的方法
公开(公告)号：US5850688A
公开(公告)日：1998-12-22
申请号：US820546
申请日：1997-03-19
申请人： Daizo Ando , Tadashi Nakamura , Shinji Umeda , Kunihiko Oishi
发明人： Daizo Ando , Tadashi Nakamura , Shinji Umeda , Kunihiko Oishi
IPC分类号： H03H9/02 , H03H3/007 , H03H3/02 , H03H3/08 , H03H9/05 , H03H9/08 , H03H9/10 , H03H9/13 , H03H9/25 , H05K3/30
CPC分类号： H03H9/059 , H03H9/1071 , Y10T29/4913 , Y10T29/49144
摘要： An electronic element which is free of many of the impurities that tend to adversely affect its operation. The electronic element is hermetically sealed in a space formed by a framework having a first and second plate directly joined to its sides. Directly joining the first and second plates to the framework prevents splashes of adhesive and soldering material from effecting the operation of the electronic element.
摘要翻译：不含易于对其操作产生不利影响的许多杂质的电子元件。电子元件气密地密封在由具有直接连接到其侧面的第一和第二板的框架形成的空间中。将第一和第二板直接连接到框架可防止粘合剂和焊接材料飞溅，从而影响电子元件的操作。

4. 发明授权

US5425833A Semiconductor chip removal process and apparatus 失效
标题翻译：半导体芯片去除工艺及装置
公开(公告)号：US5425833A
公开(公告)日：1995-06-20
申请号：US151156
申请日：1993-11-12
申请人： Hiroaki Fujimoto , Shinji Umeda , Shin-itsu Takehashi
发明人： Hiroaki Fujimoto , Shinji Umeda , Shin-itsu Takehashi
IPC分类号： H01L21/58 , H01L21/60 , B23P19/04
CPC分类号： H01L24/85 , H01L24/29 , H01L24/32 , H01L24/799 , H01L24/83 , H01L24/98 , H01L2224/2919 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48455 , H01L2224/48465 , H01L2224/73265 , H01L2224/78301 , H01L2224/78302 , H01L2224/78313 , H01L2224/83192 , H01L2224/8385 , H01L2224/85181 , H01L2224/92247 , H01L24/45 , H01L24/78 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/181 , H01L2924/20752 , H01L2924/20753 , Y10S156/932 , Y10T156/1983 , Y10T29/49721 , Y10T29/53274
摘要： The present invention discloses a semiconductor chip removal method of removing a semiconductor chip having thereon a chip electrode from a board having thereon a board electrode wherein the semiconductor chip is bonded to the board with a resin and these chip and board electrodes are connected together electrically by a wire. This semiconductor chip removal method comprises the following steps of: (a) cutting the bonding wire into two pieces by a cutter that presses its cutting edge against the base of the bonding wire on the board electrode's side; (b) separating the semiconductor chip from the board by a chip remover that forces the semiconductor chip sideways, with the adhesive strength of the resin weakened by the application of heat thereto; and (c) removing the semiconductor chip together with a piece of the bonding wire left on the chip electrode's side.
摘要翻译：本发明公开了一种半导体芯片去除方法，从其上具有板电极的板上去除其上具有芯片电极的半导体芯片，其中半导体芯片用树脂结合到板上，并且这些芯片和基板电极通过电连接在一起，由电线该半导体芯片去除方法包括以下步骤：（a）通过将切割刃压靠在基板电极侧的接合线的基部的切割器将接合线切割成两片; （b）通过芯片去除器将半导体芯片从板上分离出来，该芯片去除器通过对半导体芯片施加热量而使半导体芯片的粘合强度降低; 和（c）将半导体芯片与留在芯片电极侧的接合线一起去除。

5. 发明授权

US5644478A Electronic component and its manufacturing method 失效
标题翻译：电子元器件及其制造方法
公开(公告)号：US5644478A
公开(公告)日：1997-07-01
申请号：US381655
申请日：1995-01-31
申请人： Daizo Ando , Tadashi Nakamura , Shinji Umeda , Kunihiko Oishi
发明人： Daizo Ando , Tadashi Nakamura , Shinji Umeda , Kunihiko Oishi
IPC分类号： H03H9/02 , H03H3/007 , H03H3/02 , H03H3/08 , H03H9/05 , H03H9/08 , H03H9/10 , H03H9/13 , H03H9/25 , H02B1/01
CPC分类号： H03H9/059 , H03H9/1071 , Y10T29/4913 , Y10T29/49144
摘要： An electronic element which is free of many of the impurities that tend to adversely affect its operation. The electronic element is hermetically sealed in a space formed by a framework having a first and second plate directly joined to its sides. Directly joining the first and second plates to the framework prevents splashes of adhesive and soldering material from effecting the operation of the electronic element.
摘要翻译：不含易于对其操作产生不利影响的许多杂质的电子元件。电子元件气密地密封在由具有直接连接到其侧面的第一和第二板的框架形成的空间中。将第一和第二板直接连接到框架可防止粘合剂和焊接材料飞溅，从而影响电子元件的操作。

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