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1. 发明申请

US20090184413A1 INSULATIVE WIRING BOARD, SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD FOR PRODUCING THE INSULATIVE WIRING BOARD 审中-公开
标题翻译：绝缘导线板，使用其的半导体封装以及用于制造绝缘导线板的方法
公开(公告)号：US20090184413A1
公开(公告)日：2009-07-23
申请号：US12212089
申请日：2008-09-17
申请人： Kazuaki TATSUMI , Yoshiki SOTA
发明人： Kazuaki TATSUMI , Yoshiki SOTA
IPC分类号： H01L23/498 , H05K1/05 , H01L21/50
CPC分类号： H05K3/3452 , H01L23/49827 , H01L23/49838 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32057 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/15151 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/3511 , H05K1/112 , H05K3/0094 , H05K3/427 , H05K2201/0959 , H05K2201/0989 , H05K2201/10734 , H05K2203/0585 , H05K2203/1178 , H01L2924/00014 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： The insulative wiring board of the present invention, with its both surfaces being covered with solder resist, includes at least one via hole in a semiconductor chip-mounting area penetrating the insulative wiring board, wherein conductor layers are electrically connected to each other via said at least one via hole. Further, the mounting area is covered with the solder resist, excluding said at least one via hole that penetrates the insulative wiring board. Therefore, it is possible to achieve an insulative wiring board that prevents defects caused by expansion occurred due to heating of moisture absorbed by the board, as well as reducing an area where a wiring cannot be provided.
摘要翻译：本发明的绝缘布线基板，其两面被阻焊剂覆盖，包括穿过绝缘布线板的半导体芯片安装区域中的至少一个通路孔，其中导体层经由所述导电层彼此电连接至少一个通孔。此外，除了穿过绝缘布线板的所述至少一个通孔之外，用阻焊剂覆盖安装区域。因此，可以实现防止由于板吸收的水分的加热而发生的膨胀引起的缺陷的绝缘布线板以及减少不能提供布线的区域。

2. 发明申请

US20110064984A1 SOLAR BATTERY MODULE SUBSTRATE AND SOLAR BATTERY MODULE 审中-公开
标题翻译：太阳能电池模块基板和太阳能电池模块
公开(公告)号：US20110064984A1
公开(公告)日：2011-03-17
申请号：US12882386
申请日：2010-09-15
申请人： Kazuaki TATSUMI , Kohji MIYATA , Hiroyuki NAKANISHI , Masahiro OKITA , Masato YOKOBAYASHI
发明人： Kazuaki TATSUMI , Kohji MIYATA , Hiroyuki NAKANISHI , Masahiro OKITA , Masato YOKOBAYASHI
IPC分类号： H01M6/30
CPC分类号： H01L31/0516 , H01L31/02013 , Y02E10/50
摘要： A solar battery module substrate includes an insulating substrate on which a conductive pattern and an insulating protective film are formed, the conductive pattern including: cathode mounting terminals each of which is to be connected with a cathode of a solar battery cell; anode mounting terminals each of which is to be connected with an anode of the solar battery cell; and first module wiring, the first module wiring connecting a cathode mounting terminal to be connected with a cathode of one solar battery cell with an anode mounting terminal to be connected with an anode of another solar battery cell connected in series with said one solar battery cell, the insulating protective film having at least one opening for exposing the cathode mounting terminal and the anode mounting terminal, and the opening being positioned inside a portion of the solar battery module substrate on which portion the solar battery cell is to be projected.
摘要翻译：太阳能电池模块基板包括绝缘基板，其上形成有导电图案和绝缘保护膜，所述导电图案包括：阴极安装端子，每个阴极安装端子将与太阳能电池单元的阴极连接; 每个阳极安装端子将与太阳能电池单元的阳极连接; 和第一模块布线，第一模块布线将要与一个太阳能电池单元的阴极连接的阴极安装端子与具有与所述一个太阳能电池单元串联连接的另一个太阳能电池单元的阳极连接的阳极安装端子连接所述绝缘保护膜具有至少一个开口，用于暴露所述阴极安装端子和所述阳极安装端子，并且所述开口位于所述太阳能电池模块基板的将要投射所述太阳能电池单元的部分的一部分的内部。

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