会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 8. 发明授权
    • Highly thermally conductive resin molded article
    • 高导热性树脂成型品
    • US08394489B2
    • 2013-03-12
    • US12922686
    • 2009-02-23
    • Kazuaki MatsumotoYasushi Kakehashi
    • Kazuaki MatsumotoYasushi Kakehashi
    • B32B27/00B29C45/00
    • H01L23/295B29C45/0013B29K2995/0013C08L77/00C09K5/14H01L2924/0002H01L2924/00
    • An object of the present invention is to industrially easily mold a molded article which is excellent in thermal conductivity, electric insulation property, low density, and an injection moldability and has a thermal conduction anisotropy. The present invention relates to a highly thermally conductive resin molded article having a thermal diffusion anisotropy, the highly thermally conductive resin molded article comprising a resin composition, the resin composition containing at least resin (A) and plate-like hexagonal boron nitride powder (B) in a (A)/(B) volume ratio falling within a range of 90/10 to 30/70, the resin (A) including a thermoplastic polyester resin and/or a thermoplastic polyamide resin, the highly thermally conductive resin molded article having a thickness of not more than 1.3 mm in a part of or all over a three-dimensional shape of the highly thermally conductive resin molded article, a thermal diffusivity measured in a plane direction of the highly thermally conductive resin molded article, being (i) two or more times higher than a thermal diffusivity measured in a thickness direction of the highly thermally conductive resin molded article and (ii) not less than 0.5 mm2/sec.
    • 本发明的目的是在工业上容易地模制导热性,电绝缘性,低密度和注模成型性优异并且具有导热各向异性的成型体。 本发明涉及具有热扩散各向异性的高导热性树脂成形体,高导热性树脂成型体含有树脂组合物,该树脂组合物至少含有树脂(A)和板状六方氮化硼粉末(B )的(A)/(B)体积比在90/10〜30/70的范围内,包含热塑性聚酯树脂和/或热塑性聚酰胺树脂的树脂(A),高导热性树脂成型品 在高导热性树脂成型品的三维形状的一部分或全部具有不大于1.3mm的厚度,在高导热性树脂成型体的平面方向上测量的热扩散率为(i )比在高导热性树脂成形体的厚度方向测定的热扩散率高两倍以上,(ii)不小于0.5mm 2 /秒。