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    • 2. 发明授权
    • Input device and method of manufacturing input device
    • 输入装置及输入装置制造方法
    • US08928849B2
    • 2015-01-06
    • US13294457
    • 2011-11-11
    • Takenobu Horino
    • Takenobu Horino
    • G02F1/1345H01H1/10H01R13/62H05K1/00H01H11/06G06F3/044
    • G02F1/13452G06F3/044G06F2203/04103H01H11/06H05K2201/10128Y10T29/49124Y10T29/49126
    • A method of manufacturing an input device includes a step of bonding a translucent first optical adhesive layer to one surface of a first transparent base so that a part of first lead electrodes is exposed to the outside; a step of disposing a FPC so that a predetermined gap is formed between the FPC and the first optical adhesive layer in plan view, and electrically connecting the FPC to the first lead electrodes exposed to one surface of the first transparent base; a step of bonding a surface member, which forms an input surface, to the first transparent base with the first optical adhesive layer interposed therebetween; and a step of sealing the exposed lead electrodes by injecting a resin into a space between the first transparent base and the surface member facing each other.
    • 一种制造输入装置的方法包括将半透明的第一光学粘合剂层粘合到第一透明基底的一个表面以使得第一引线电极的一部分暴露于外部的步骤; 在FPC和第一光学粘合剂层之间在平面图中设置FPC使得形成预定间隙的步骤,并且将FPC电连接到暴露于第一透明基底的一个表面的第一引线电极; 将形成有输入面的表面构件与第一透明基底接合的步骤,其间插入第一光学粘合剂层; 以及通过将树脂注入到彼此面对的第一透明基底和表面构件之间的空间中来密封暴露的引线电极的步骤。