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    • 1. 发明授权
    • Photodetector for receiving an index signal of a beam-index cathode-ray
tube
    • 用于接收光束索引阴极射线管的索引信号的光检测器
    • US4894531A
    • 1990-01-16
    • US106847
    • 1987-10-13
    • Katsumi TeradaTetsuya Enomoto
    • Katsumi TeradaTetsuya Enomoto
    • G02B27/00H01J29/34H01J29/89H04N9/24
    • H04N9/24H01J29/89
    • A photodetector including a planar light guide of a polygonal shape in which organic phosphor is dispersed in a transparent support material, and a pair of photoelectric conversion elements such that light having a wavelength range for exciting the organic phosphor is introduced into the light guide and light generated from the organic phosphor upon the excitation is guided to the photoelectric conversion elements sensitive to a wavelength of the light generated from the organic phosphor. The light guide is formed, at opposite end portions of its one side, with a pair of light emitting surfaces and the photoelectric conversion elements are, respectively, provided at the light emitting end surfaces such that a light receiving surface of each of the photoelectric conversion elements confronts each of the light emitting end surfaces.
    • 一种光电检测器,包括多边形形状的平面光导,其中有机荧光体分散在透明支撑材料中,以及一对光电转换元件,使得具有用于激发有机磷光体的波长范围的光被引入光导和光 在激发时从有机荧光体产生的光被导入对从有机荧光体产生的光的波长敏感的光电转换元件。 光导在其一侧的相对端部形成有一对发光面,并且光电转换元件分别设置在发光端面,使得光电转换中的每一个的光接收表面 元件面对每个发光端面。
    • 2. 发明申请
    • MOUNTING APPARATUS AND MOUNTING METHOD
    • 安装设备和安装方法
    • US20120015458A1
    • 2012-01-19
    • US13260232
    • 2010-03-18
    • Takayoshi AkamatsuKatsumi TeradaHajime Hirata
    • Takayoshi AkamatsuKatsumi TeradaHajime Hirata
    • H01L21/58B23P19/00
    • H05K13/021H01L2224/16225H01L2224/75H05K13/0452Y10T29/53178
    • Provided is a mounting apparatus which mounts a chip component on a circuit pattern on a circuit board having a plurality of circuit patterns formed thereon. The mounting apparatus is provided with a plurality of bonding tools each of which mounts the chip component on each of the circuit patterns on the circuit board. Each bonding tool is provided with, within a region on the circuit board where the chip component is to be mounted, an exclusive mounting region where only each bonding tool can mount the chip component, and a common mounting region where both the bonding tool and the adjacent bonding tool can mount the chip component. A mounting method is also provided. The mounting tact time of the chip components can be shortened even in case where a plurality of circuit patterns are formed on the circuit board and a failure circuit pattern is included among the circuit patterns which have been formed.
    • 提供了一种将芯片部件安装在具有形成在其上的多个电路图案的电路板上的电路图案上的安装装置。 安装装置设置有多个焊接工具,每个焊接工具将芯片部件安装在电路板上的每个电路图案上。 每个接合工具在电路板上要安装芯片部件的区域内设置专用安装区域,其中只有每个焊接工具可以安装芯片部件,以及公共安装区域,其中焊接工具和 相邻的焊接工具可以安装芯片组件。 还提供了一种安装方法。 即使在电路板上形成多个电路图案并且在形成的电路图案中包括故障电路图案的情况下,也可以缩短芯片组件的安装节拍时间。
    • 7. 发明授权
    • Mounting system
    • 安装系统
    • US07621969B2
    • 2009-11-24
    • US11887212
    • 2006-03-13
    • Mutsumi MasumotoKatsumi Terada
    • Mutsumi MasumotoKatsumi Terada
    • H01L21/00
    • H01L21/67109H01L21/563H01L21/67144H01L24/75H01L24/81H01L2224/75H01L2924/01004H01L2924/01005H01L2924/01006H01L2924/01033H01L2924/01075H01L2924/14H01L2924/15788Y10T29/41H01L2924/00
    • A mounting system is provided with a substrate loader section, a chip mounting section, and a substrate unloader section for sequentially taking out substrates whereupon chips are mounted. The mounting system is characterized in that the substrate loader section is provided with an oven capable of heat insulating a substrate together with a substrate magazine capable of containing a plurality of substrates, a stage heater for heating/heat insulating a substrate is provided, respectively, at a substrate conveying portion from a substrate waiting stage for the chip mounting section to the chip mounting section, at the chip mounting section, and at a substrate conveying portion from the chip mounting section to the substrate unloader section, and the substrate unloader section is provided with an oven capable of heat insulating a substrate together with a substrate magazine capable of containing a plurality of substrates whereupon chips are mounted. The substrate can be sustained at a desirable temperature over the substantially entire mounting process having a series of steps, and in particular, occurrence of problems ascribed to moisture absorption can be suppressed or prevented.
    • 安装系统设置有基板装载部分,芯片安装部分和基板卸载部分,用于顺序取出安装芯片的基板。 安装系统的特征在于,基板装载部分设置有能够将基板与能够容纳多个基板的基板隔套一起隔热的烘箱,分别设置用于加热/隔热基板的台加热器, 在从芯片安装部的基板等待台到芯片安装部,芯片安装部以及从芯片安装部到基板卸载部的基板输送部的基板输送部,基板卸载部是 提供了能够将基板与能够容纳多个基板并因此安装芯片的基板隔套一起烘烤的炉。 可以在具有一系列步骤的基本上整个安装过程中将基材维持在期望的温度,并且特别地,可以抑制或防止归因于吸湿的问题的发生。