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    • 2. 发明申请
    • Connector terminal fabrication process and connector terminal
    • 连接器端子制造工艺和连接器端子
    • US20060172624A1
    • 2006-08-03
    • US11334740
    • 2006-01-19
    • Katsumasa MatsuokaYoshiaki KatoHarehide Sasaki
    • Katsumasa MatsuokaYoshiaki KatoHarehide Sasaki
    • H01R13/02
    • H01R43/16H01R12/725H01R13/03H01R43/0221H01R43/20Y10S439/931
    • An upper tier terminal is provided with a fitting portion and a board attachment portion. When the upper tier terminal is being fabricated, a first wire member which is a component of the fitting portion and a second wire member which is a component of the board attachment portion, whole peripheral surfaces of which have been subjected to a plating treatment beforehand, are employed. End portions of the first wire member and the second wire member are mutually superposed, and the first wire member and the second wire member are joined. Thus, the fitting portion is formed and the board attachment portion is formed. Hence, a surface of the upper tier terminal is structured by a plating layer at the peripheral surface of the first wire member and a plating layer at the peripheral surface of the second wire member. Consequently, a post-plating treatment can be rendered unnecessary.
    • 上层终端设置有配合部和板附接部。 当制造上层终端时,作为装配部分的一部分的第一线构件和作为板安装部分的一部分的第二线构件,其整个表面已经预先进行了电镀处理, 被雇用。 第一线构件和第二线构件的端部相互重叠,并且第一线构件和第二线构件接合。 因此,形成安装部,形成板安装部。 因此,上层终端的表面由第一线构件的周面的镀层和第二线构件的周面的镀层构成。 因此,可以不需要电镀后处理。
    • 4. 发明授权
    • Connector terminal fabrication process and connector terminal
    • 连接器端子制造工艺和连接器端子
    • US07341462B2
    • 2008-03-11
    • US11334740
    • 2006-01-19
    • Katsumasa MatsuokaYoshiaki KatoHarehide Sasaki
    • Katsumasa MatsuokaYoshiaki KatoHarehide Sasaki
    • H01R12/00
    • H01R43/16H01R12/725H01R13/03H01R43/0221H01R43/20Y10S439/931
    • An upper tier terminal is provided with a fitting portion and a board attachment portion. When the upper tier terminal is being fabricated, a first wire member which is a component of the fitting portion and a second wire member which is a component of the board attachment portion, whole peripheral surfaces of which have been subjected to a plating treatment beforehand, are employed. End portions of the first wire member and the second wire member are mutually superposed, and the first wire member and the second wire member are joined. Thus, the fitting portion is formed and the board attachment portion is formed. Hence, a surface of the upper tier terminal is structured by a plating layer at the peripheral surface of the first wire member and a plating layer at the peripheral surface of the second wire member. Consequently, a post-plating treatment can be rendered unnecessary.
    • 上层终端设置有配合部和板附接部。 当制造上层终端时,作为装配部分的一部分的第一线构件和作为板安装部分的一部分的第二线构件,其整个表面已经预先进行了电镀处理, 被雇用。 第一线构件和第二线构件的端部相互重叠,并且第一线构件和第二线构件接合。 因此,形成安装部,形成板安装部。 因此,上层终端的表面由第一线构件的周面的镀层和第二线构件的周面的镀层构成。 因此,可以不需要电镀后处理。