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1. 发明授权

US4510179A Electrode on heat-resisting and isolating substrate and the manufacturing process for it 失效
标题翻译：电极在耐热隔离衬底及其制造工艺上
公开(公告)号：US4510179A
公开(公告)日：1985-04-09
申请号：US509594
申请日：1983-06-30
申请人： Katsuhiko Honjo , Hiromitsu Taki , Noriya Sato
发明人： Katsuhiko Honjo , Hiromitsu Taki , Noriya Sato
IPC分类号： H01G4/008 , H01L21/48 , H05K1/09 , C23C3/02
CPC分类号： H05K1/092 , H01G4/0085 , H01L21/4867
摘要： This invention provides an electrode on a heat-resisting and isolating substrate which is low-priced and has a stable character and the manufacturing process therefor. A paste which comprises 0.05 to 40 weight % of a metal material containing silver component of 0.5 to 100 weight % and the remaining weight % of an organic vehicle, is formed on the substrate, and is heated at temperatures of 250.degree. to 900.degree. C. and consequently a metallic particle layer of 0.05 to 2 microns in thickness is formed on the substrate, and then an electrode of nickel and copper of 0.1 to 20 microns in thickness is built up on it by electroless plating.
摘要翻译：本发明提供一种低价格且具有稳定特性的耐热隔离基板上的电极及其制造方法。在基材上形成含有0.05〜40重量％的银成分为0.5〜100重量％的金属材料和有机载体的剩余重量％，并在250〜900℃的温度下加热并且因此在基板上形成厚度为0.05至2微米的金属颗粒层，然后通过无电镀在其上形成厚度为0.1-20微米的镍和铜的电极。

2. 发明授权

US4559279A Electrode on heat-resisting and isolating substrate 失效
标题翻译：电极在耐热隔离衬底上
公开(公告)号：US4559279A
公开(公告)日：1985-12-17
申请号：US697893
申请日：1985-02-01
申请人： Katsuhiko Honjo , Hiromitsu Taki , Noriya Sato
发明人： Katsuhiko Honjo , Hiromitsu Taki , Noriya Sato
IPC分类号： H01G4/008 , H01L21/48 , H05K1/09 , C23C3/02
CPC分类号： H05K1/092 , H01G4/0085 , H01L21/4867 , Y10T428/12611 , Y10T428/1275 , Y10T428/12861 , Y10T428/12868 , Y10T428/12882 , Y10T428/12896
摘要： This invention provides an electrode on a heat-resisting and isolating substrate which is low-priced and has a stable character and the manufacturing process therefor. A paste which comprises 0.05 to 40 weight % of a metal material containing silver component of 0.5 to 100 weight % the remaining weight % of an organic vehicle, is formed on the substrate, and is heated at temperatures of 250.degree. to 900.degree. C. and consequently a metallic particle layer of 0.05 to 2 microns in thickness is formed on the substrate, and then an electrode of nickel and copper of 0.1 to 20 microns in thickness is built up on it by electroless plating.
摘要翻译：本发明提供一种低价格且具有稳定特性的耐热隔离基板上的电极及其制造方法。在基材上形成含有0.05〜40重量％的含有银成分0.5〜100重量％的有机载体的剩余重量％的金属材料，并在250〜900℃的温度下加热因此在基板上形成厚度为0.05至2微米的金属颗粒层，然后通过无电镀在其上形成厚度为0.1-20微米的镍和铜的电极。

3. 发明授权

US4002786A Method for electroless copper plating 失效
标题翻译：化学镀铜方法
公开(公告)号：US4002786A
公开(公告)日：1977-01-11
申请号：US569176
申请日：1975-04-18
申请人： Hyogo Hirohata , Masahiro Oita , Katsuhiko Honjo
发明人： Hyogo Hirohata , Masahiro Oita , Katsuhiko Honjo
IPC分类号： C23C18/40 , C23C3/02
CPC分类号： C23C18/405
摘要： This invention provides a method for electroless copper plating comprising: providing an electroless copper plating bath composition which comprises 0.005 to 0.3 mole per liter of a water soluble copper compound, 0.005 to 0.6 mole per liter of a cupric complexing agent, 0.02 to 3.0 mole per liter of formaldehyde, 0.01 to 1000 milligram per liter of additive agent selected from the group consisting of 2,2'-dipyridyl, 2,9-dimethyl-1,10-phenanthroline and 2-(2-phridyl)-benzimidazole, and alkaline compound to hold the pH of said aqueous solution 10.5 to 14 and immersing a material having catalytic action at the surface into said electroless copper plating bath composition kept at a temperature of 70.degree. to 90.degree. C whereby copper film with a high mechanical strength is deposited on said material.
摘要翻译：本发明提供了一种无电镀铜方法，其包括：提供一种化学镀铜浴组合物，其包含0.005至0.3摩尔/升水溶性铜化合物，0.005至0.6摩尔/升铜络合剂，每摩尔0.02-3.0摩尔升甲醛，0.01-1000毫克/升选自2,2'-二吡啶基，2,9-二甲基-1,10-菲咯啉和2-（2-短链烯基） - 苯并咪唑的添加剂和碱性化合物以保持所述水溶液的pH值为10.5至14并将具有催化作用的材料浸入所述化学镀铜浴组合物中，所述化学镀铜浴组合物保持在70至90℃的温度，由此沉积具有高机械强度的铜膜在所述材料上。

4. 发明授权

US4400214A Conductive paste 失效
标题翻译：导电胶
公开(公告)号：US4400214A
公开(公告)日：1983-08-23
申请号：US376213
申请日：1982-05-07
申请人： Yasuhiro Ogawa , Sankichi Shida , Katsuhiko Honjo , Tsunehiko Todoroki
发明人： Yasuhiro Ogawa , Sankichi Shida , Katsuhiko Honjo , Tsunehiko Todoroki
IPC分类号： C22C32/00 , H01H1/025 , H05K1/09 , C09D5/24
CPC分类号： C22C32/0089 , H01H1/025 , H05K1/092
摘要： Disclosed herein is a conductive paste useful for making conductors, including microcircuit conductors, and terminations for capacitors, resistors and piezo-electric transducer elements. The paste comprises an inert liquid vehicle having a metal powder and a glass powder both dispersed therein and is printed and fired in the conventional manner on dielectric substrates. The metal powder comprises an alloy powder, each particle comprising Cu, Al, and at least one of Zn and Ag. The first film of the paste is practically resistant to corrosion and practically conductive and the paste can be produced economically.
摘要翻译：这里公开了一种用于制造包括微电路导体以及用于电容器，电阻器和压电换能器元件的端子的导体的导电浆料。糊状物包含惰性液体载体，其具有分散在其中的金属粉末和玻璃粉末，并以常规方式在电介质基底上印刷和烧制。金属粉末包含合金粉末，每个颗粒包含Cu，Al以及Zn和Ag中的至少一种。这种糊状物的第一层实际上具有耐腐蚀性和实际导电性，并且可以经济地生产糊状物。

5. 发明授权

US3975076A Receptacle for printed circuit board 失效
标题翻译：印刷电路板插座
公开(公告)号：US3975076A
公开(公告)日：1976-08-17
申请号：US403445
申请日：1973-10-04
申请人： Sankichi Shida , Koji Hashimoto , Hyogo Hirohata , Katsuhiko Honjo
发明人： Sankichi Shida , Koji Hashimoto , Hyogo Hirohata , Katsuhiko Honjo
IPC分类号： H01H1/04 , H01R13/02 , H01R13/03 , H01R13/115 , H01R13/40 , H05K1/07 , H01R13/64
CPC分类号： H01R13/03 , H01R12/716 , H01R12/721
摘要： A connector which has bellows type contacts of spring metal and a holder which has a bottom, a longitudinal slot for receiving a circuit panel, a cavity for housing the bellows type contact, a hollow formed at upper portion of the cavity and partition wall for separating the adjacent contacts. The bellows type contact consists of a lower end portion, an attached portion, a first bent portion, a second bent portion, a straight portion, a third bent portion and an upper end portion. The straight portion is the portion contacting the panel circuit. The contact has a spring substrate which consists of phosphor bronze, a contact metal of tin or tin-lead alloy, and a layer of copper between the substrate and the contact metal. With the improved shape and material of the contact, there is provided better contact performance even for a contact of tin or tin-lead alloy which is very cheap compared to the conventional gold contact and it is thus advantageous for use in consumer type electric equipment.
摘要翻译：具有弹簧金属的波纹管型触点的连接器和具有底部的保持器，用于容纳电路板的纵向槽，用于容纳波纹管型触头的空腔，形成在空腔上部的中空部分和分隔壁相邻的接触。波纹管型触点由下端部，安装部，第一弯曲部，第二弯曲部，直线部，第三弯曲部和上端部构成。直线部分是接触面板电路的部分。接触件具有由磷青铜，锡或锡铅合金的接触金属以及衬底和接触金属之间的铜层组成的弹簧衬底。随着接触的形状和材料的改进，即使对于与常规金接触相比非常便宜的锡或锡铅合金的接触也提供了更好的接触性能，因此有利于在消费型电气设备中使用。

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