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    • 2. 发明申请
    • NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE
    • 非易失性半导体存储器件
    • US20080258205A1
    • 2008-10-23
    • US12103697
    • 2008-04-15
    • Tetsuya ISHIMARUYasuhiro SHIMAMOTOKan YASUI
    • Tetsuya ISHIMARUYasuhiro SHIMAMOTOKan YASUI
    • H01L29/792
    • H01L29/792G11C16/14H01L29/40117H01L29/42344H01L29/66833
    • An erase current of a non-volatile semiconductor memory device is decreased. A memory cell of the non-volatile semiconductor memory device comprises a source region and a drain region formed in a semiconductor substrate. Over a portion of the semiconductor substrate between the source region and the drain region, a select gate electrode is formed via a gate dielectric film. On a side wall of the select gate electrode, a memory gate electrode is formed via a bottom silicon oxide film and a charge-trapping silicon oxynitride film. In the memory cell configured as above, erase operation is performed as follows. By applying a positive voltage to the memory gate electrode, holes are injected from the memory gate electrode into the silicon oxynitride film to decrease a threshold voltage in a program state to a certain level. Thereafter, hot holes generated by a band-to-band tunneling phenomenon are injected into the silicon oxynitride film and the erase operation is completed.
    • 非易失性半导体存储器件的擦除电流减小。 非易失性半导体存储器件的存储单元包括形成在半导体衬底中的源极区域和漏极区域。 在源极区域和漏极区域之间的半导体衬底的一部分上,通过栅极电介质膜形成选择栅电极。 在选择栅电极的侧壁上,经由底部氧化硅膜和电荷俘获氮氧化硅膜形成存储栅电极。 在如上配置的存储单元中,擦除操作如下进行。 通过向存储栅电极施加正电压,将空穴从存储栅电极注入到氧氮化硅膜中,以将程序状态的阈值电压降低到一定水平。 此后,通过带 - 带隧道现象产生的热孔被注入到氧氮化硅膜中,并且擦除操作完成。