专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US10904472B2 Transmission system 有权
公开(公告)号：US10904472B2
公开(公告)日：2021-01-26
申请号：US15066107
申请日：2016-03-10
申请人： Kabushiki Kaisha Toshiba
发明人： Kensuke Aoki , Katsumi Hisano , Tomonao Takamatsu , Ryosuke Yagi
IPC分类号： H04N5/38 , F28D15/00 , F28D20/02 , H05K7/20 , F28D21/00
摘要： According to an embodiment, system includes transmitter, pump, controller, tank and thermal storage. Pump circulates water through the transmitter. Controller drives the pump, circulates the water while the transmitter is operating, and stops the circulation of the water at a time of a stop of the transmitter. Tank stores the water circulated through the transmitter, and supplies the water to the pump. Thermal storage is provided on a surface of the tank, and stores waste heat of the exothermic part of the transmitter, which was taken in the water via the tank. Thermal storage changes in phase if a temperature of the water in the tank lowers to a predetermined temperature or below, and heats the water by latent heat which occurs.

2. 发明授权

US10845127B2 Cooling device 有权
公开(公告)号：US10845127B2
公开(公告)日：2020-11-24
申请号：US15695468
申请日：2017-09-05
申请人： Kabushiki Kaisha Toshiba , Toshiba Infrastructure Systems & Solutions Corporation
发明人： Kensuke Aoki , Takuya Hongo
IPC分类号： F28D15/02 , H01L23/427 , H05K7/20 , F25B23/00
CPC分类号： F28D15/0266 , F28D15/02 , F28D15/025 , H01L23/427 , H05K7/20672 , F25B23/006 , F28F2250/06 , F28F2265/14
摘要： A cooling device of an embodiment includes an evaporator, a condenser, a first connection pipe, a second connection pipe, and a third connection pipe. A refrigerant is vaporized in the evaporator by heat generated by a heating element. The condenser is located above the evaporator, and configured to condense the vaporized refrigerant by exchanging heat with an external fluid. The first connection pipe guides the refrigerant vaporized by the evaporator to the condenser. The second connection pipe guides the refrigerant condensed by the condenser to the evaporator. The third connection pipe connects a portion of the first connection pipe and a portion of the second connection pipe. A connection position between the third connection pipe and the first connection pipe is higher than a maximum liquid level height of the refrigerant in the second connection pipe during an operation.

3. 发明申请

US20170363365A1 COOLING DEVICE 审中-公开
公开(公告)号：US20170363365A1
公开(公告)日：2017-12-21
申请号：US15695468
申请日：2017-09-05
申请人： Kabushiki Kaisha Toshiba , Toshiba Infrastructure Systems & Solutions Corporation
发明人： Kensuke Aoki , Takuya Hongo
IPC分类号： F28D15/02 , F25B23/00
CPC分类号： F28D15/0266 , F25B23/006 , F28D15/02 , F28D15/025 , F28F2250/06 , F28F2265/14 , H01L23/427 , H05K7/20672
摘要： A cooling device of an embodiment includes an evaporator, a condenser, a first connection pipe, a second connection pipe, and a third connection pipe. A refrigerant is vaporized in the evaporator by heat generated by a heating element. The condenser is located above the evaporator, and configured to condense the vaporized refrigerant by exchanging heat with an external fluid. The first connection pipe guides the refrigerant vaporized by the evaporator to the condenser. The second connection pipe guides the refrigerant condensed by the condenser to the evaporator. The third connection pipe connects a portion of the first connection pipe and a portion of the second connection pipe. A connection position between the third connection pipe and the first connection pipe is higher than a maximum liquid level height of the refrigerant in the second connection pipe during an operation.

4. 发明申请

US20150118065A1 PUMP UNIT 审中-公开
标题翻译：泵单元
公开(公告)号：US20150118065A1
公开(公告)日：2015-04-30
申请号：US14593277
申请日：2015-01-09
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Kensuke Aoki
IPC分类号： G05D7/01 , G05D23/20
CPC分类号： G05D7/01 , F04B15/00 , F04B23/04 , F04B23/06 , F04D13/12 , F04D15/0022 , G05D7/0682 , G05D23/2039
摘要： According to one embodiment, a pump unit provided for piping which feeds a liquid at a preset unit flow rate includes (n+1) pumps and a constant flow valve. The (n+1) pumps are arranged in series and set to pressurize the liquid so as to achieve the unit flow rate when n pumps are arranged in series. The constant flow valve is installed downstream of the (n+1) pumps. The constant flow valve feeds the fluid at the unit flow rate by giving first resistance to the fluid when the fluid is pressurized by n pumps of the (n+1) pumps. The constant flow valve feeds the fluid at the unit flow rate by giving second resistance larger than the first resistance to the fluid when the fluid is pressurized by the (n+1) pumps.
摘要翻译：根据一个实施例，提供用于以预设单位流量供给液体的管道的泵单元包括（n + 1）个泵和恒定流量阀。第（n + 1）个泵串联设置，对液体进行加压，以便当n个泵串联布置时达到单位流量。恒流阀安装在（n + 1）个泵的下游。当流体被（n + 1）个泵的n个泵加压时，恒定流量阀以单位流速向流体供给第一阻力。当流体被第（n + 1）个泵加压时，恒流阀以单位流速给流体提供大于流体的第一阻力的第二阻力。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式