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1. 发明申请

US20170186738A1 SEMICONDUCTOR MODULE 审中-公开
公开(公告)号：US20170186738A1
公开(公告)日：2017-06-29
申请号：US15460568
申请日：2017-03-16
申请人： Kabushiki Kaisha Toshiba
发明人： Naohisa OKUMURA , Daijo CHIDA , Hiroaki KISHI , Isao OGAWA , Masaru KOSEKI
IPC分类号： H01L25/16 , H01L25/00 , H01L23/00 , H01L31/14 , H01L31/16
CPC分类号： H01L25/167 , H01L24/48 , H01L24/49 , H01L25/50 , H01L31/14 , H01L31/16 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399
摘要： According to one embodiment, a semiconductor module includes a first semiconductor element, a second semiconductor element, a first light emitting element and a second light emitting element. The first semiconductor element is provided with a first light receiving circuit and a first output circuit. The second semiconductor element is provided with a second light receiving circuit and a second output circuit. The first light emitting element is electrically connected to the second output circuit and mounted on the first semiconductor element such that first light emitted from the first light emitting element is received by the first light receiving circuit. The second light emitting element is electrically connected to the first output circuit and mounted on the second semiconductor element such that second light emitted from the second light emitting element is received by the second light receiving circuit.

2. 发明申请

US20140054614A1 SEMICONDUCTOR DEVICE HAVING OPTICALLY-COUPLED ELEMENT 审中-公开
标题翻译：具有光耦合元件的半导体器件
公开(公告)号：US20140054614A1
公开(公告)日：2014-02-27
申请号：US13778844
申请日：2013-02-27
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Hidetomo TANAKA , Isao OGAWA , Yuta KUGIYAMA , Hiroaki OOHIRA
IPC分类号： H01L31/16
CPC分类号： H01L31/16 , H01L31/167
摘要： According to one embodiment, a semiconductor device includes a light-emitting element, a light-receiving element, a primary side lead electrically connected to the light-emitting element, a secondary side lead electrically connected to the light-receiving element and a molded body. The molded body includes an internal resin, an external resin and a light shielding layer. The internal resin covers a portion fixed with the light-emitting element of the primary side lead and a portion fixed with the light-receiving element of the secondary side lead. The external resin covers the internal resin, and shields external light to which the light-receiving element is sensitive. The light shielding layer is provided at a position closer to the second surface than any of the light-emitting element, the light-receiving element, the primary side lead, and the secondary side lead, and shielding the external light.
摘要翻译：根据一个实施例，半导体器件包括发光元件，光接收元件，与发光元件电连接的初级侧引线，电连接到光接收元件的次级侧引线和成型体。成型体包括内部树脂，外部树脂和遮光层。内部树脂覆盖固定有初级侧引线的发光元件的部分和与次级侧引线的光接收元件固定的部分。外部树脂覆盖内部树脂，并且遮蔽受光元件敏感的外部光。光屏蔽层设置在比发光元件，受光元件，初级侧引线和次级侧引线中的任何一个更靠近第二表面的位置，并屏蔽外部光。

3. 发明申请

US20160268240A1 SEMICONDUCTOR MODULE 有权
标题翻译：半导体模块
公开(公告)号：US20160268240A1
公开(公告)日：2016-09-15
申请号：US15061397
申请日：2016-03-04
申请人： Kabushiki Kaisha Toshiba
发明人： Naohisa OKUMURA , Daijo CHIDA , Hiroaki KISHI , Isao OGAWA , Masaru KOSEKI
IPC分类号： H01L25/16
CPC分类号： H01L25/167 , H01L24/48 , H01L24/49 , H01L25/50 , H01L31/14 , H01L31/16 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399
摘要： According to one embodiment, a semiconductor module includes a first semiconductor element, a second semiconductor element, a first light emitting element and a second light emitting element. The first semiconductor element is provided with a first light receiving circuit and a first output circuit. The second semiconductor element is provided with a second light receiving circuit and a second output circuit. The first light emitting element is electrically connected to the second output circuit and mounted on the first semiconductor element such that first light emitted from the first light emitting element is received by the first light receiving circuit. The second light emitting element is electrically connected to the first output circuit and mounted on the second semiconductor element such that second light emitted from the second light emitting element is received by the second light receiving circuit.
摘要翻译：根据一个实施例，半导体模块包括第一半导体元件，第二半导体元件，第一发光元件和第二发光元件。第一半导体元件设置有第一光接收电路和第一输出电路。第二半导体元件设置有第二光接收电路和第二输出电路。第一发光元件电连接到第二输出电路并安装在第一半导体元件上，使得从第一发光元件发射的第一光被第一光接收电路接收。第二发光元件电连接到第一输出电路并且安装在第二半导体元件上，使得从第二发光元件发射的第二光被第二光接收电路接收。

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