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1. 发明授权

US08445099B2 Polyimide film 有权
标题翻译：聚酰亚胺膜
公开(公告)号：US08445099B2
公开(公告)日：2013-05-21
申请号：US12952474
申请日：2010-11-23
申请人： Kouichi Sawasaki , Masahiro Oguni
发明人： Kouichi Sawasaki , Masahiro Oguni
IPC分类号： B32B27/00 , B29C55/14
CPC分类号： B29C55/143 , B29C55/065 , B29K2079/08 , C08G73/1042 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08J5/18 , C08J2379/08 , C08L79/08
摘要： The present invention is directed to a polyimide film with a uniform orientation angle in the transverse direction of the film. A polyimide film characterized by the fact that the width of the fabricated film is ≧1.5 m, 2 points positioned inside by 200 mm from both ends of the width of the fabricated film are selected on a linear line in the vertical direction to the machine direction (MD) of the film, 1 point within center part ±200 mm, and 2 optional points are further selected on a linear line that includes said 2 points within the range of the linear line that connects said 2 points, and the orientation angle (θ) is within a range of 90°±23° in at least all of these 8 points.
摘要翻译：本发明涉及一种在膜的横向具有均匀取向角的聚酰亚胺膜。一种聚酰亚胺膜，其特征在于制造膜的宽度>1.5μm，从制造膜宽度的两端位于内侧200mm的2个点在与机器的垂直方向上的线性线上选择在包括连接所述2点的线性线的范围内的所述2点的线性线上进一步选择膜的方向（MD），中心部±200mm内的1点和2个可选点，并且取向角（θ）在90°±23°的范围内，至少在这8个点中。

2. 发明申请

US20090017286A1 COPPER CLAD LAMINATE 审中-公开
标题翻译：铜箔层压板
公开(公告)号：US20090017286A1
公开(公告)日：2009-01-15
申请号：US12171545
申请日：2008-07-11
申请人： Meguru Maeda , Masahiro Oguni , Kouichi Sawasaki
发明人： Meguru Maeda , Masahiro Oguni , Kouichi Sawasaki
IPC分类号： B32B15/08
CPC分类号： H05K1/0346 , B32B15/088 , B32B15/20 , B32B2264/10 , B32B2307/734 , B32B2457/08 , H05K1/0373 , H05K2201/0154 , H05K2201/0209 , H05K2201/0266 , Y10T428/25
摘要： A copper clad laminate that is suited to use in high-performance flexible printed circuit boards, which meets both dimensional change and heat resistance requisites, has a small percent dimensional change after etching, and has properties that are applicable to AOI, and which further has excellent slickness (slip) and adhesion is provided. A copper clad laminate that uses a polyimide film that primarily uses paraphenylenediamine and 4,4′-diaminodiphenylether as diamine ingredients, and pyromellitic dianhydride and 3,3′,4,4′-biphenyltetracarboxylic dianhydride as acid dianhydride ingredients, which further has slip caused by producing surface protrusions by adding inorganic particles. One copper foil is adhered to one side of the polyimide film using an adhesive; and a second copper layer is directly adhered to the second side of the polyimide film.
摘要翻译：适用于满足尺寸变化和耐热要求的高性能柔性印刷电路板的覆铜层压板在蚀刻后具有小的百分比尺寸变化，并且具有适用于AOI的特性，并且还具有提供优异的光滑（滑动）和附着力。使用主要使用对苯二胺和4,4'-二氨基二苯基醚作为二胺成分的聚酰亚胺薄膜和均苯四甲酸二酐和3,3'，4,4'-联苯四羧酸二酐作为酸二酐成分的覆铜层压板，其进一步具有滑动性通过添加无机颗粒产生表面突起。使用粘合剂将一个铜箔粘附到聚酰亚胺膜的一侧; 并且第二铜层直接粘附到聚酰亚胺膜的第二侧。

3. 发明申请

US20110293910A1 POLYIMIDE FILM 有权
标题翻译：聚酰亚胺膜
公开(公告)号：US20110293910A1
公开(公告)日：2011-12-01
申请号：US12952474
申请日：2010-11-23
申请人： KOUICHI SAWASAKI , Masahiro Oguni
发明人： KOUICHI SAWASAKI , Masahiro Oguni
IPC分类号： B32B27/00 , B29C55/14
CPC分类号： B29C55/143 , B29C55/065 , B29K2079/08 , C08G73/1042 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08J5/18 , C08J2379/08 , C08L79/08
摘要： The present invention is directed to a polyimide film with a uniform orientation angle in the transverse direction of the film. A polyimide film characterized by the fact that the width of the fabricated film is ≧1.5 m, 2 points positioned inside by 200 mm from both ends of the width of the fabricated film are selected on a linear line in the vertical direction to the machine direction (MD) of the film, 1 point within center part ±200 mm, and 2 optional points are further selected on a linear line that includes said 2 points within the range of the linear line that connects said 2 points, and the orientation angle (θ) is within a range of 90°±23° in at least all of these 8 points.
摘要翻译：本发明涉及一种在膜的横向具有均匀取向角的聚酰亚胺膜。一种聚酰亚胺膜，其特征在于，制造膜的宽度为≥1.5μm，从制造膜宽度的两端向内侧200mm的2个点在与机器方向垂直的直线上线性地选择（MD），中心部分±200mm内的1点，以及在连接所述2点的直线的范围内包括所述2点的直线上的2个可选点，以及取向角在这8个点中至少全部为90°±23°的范围内。

4. 发明授权

US07534361B2 Methods for making laminated member for circuit board, making circuit board and laminating flexible film 失效
标题翻译：制造电路板层叠件的方法，制作电路板和层压柔性膜
公开(公告)号：US07534361B2
公开(公告)日：2009-05-19
申请号：US11474427
申请日：2006-06-26
申请人： Takayoshi Akamatsu , Futoshi Okuyama , Nobuyuki Kuroki , Hiroshi Enomoto , Tetsuya Hayashi , Yoshio Matsuda , Yoichi Shinba , Masahiro Oguni
发明人： Takayoshi Akamatsu , Futoshi Okuyama , Nobuyuki Kuroki , Hiroshi Enomoto , Tetsuya Hayashi , Yoshio Matsuda , Yoichi Shinba , Masahiro Oguni
IPC分类号： H01B13/00
CPC分类号： B32B38/18 , B32B37/025 , B32B2037/109 , B32B2038/1891 , B32B2379/08 , B32B2457/08 , H05K1/0393 , H05K3/007 , H05K2203/0152 , H05K2203/0156 , H05K2203/016 , H05K2203/066 , H05K2203/068 , H05K2203/1572 , Y10S428/901 , Y10T428/24917
摘要： The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.
摘要翻译：电路基板技术领域本发明涉及具备极细电路图案的柔性膜，电路基板用层叠体以及生产率优异的电路板用叠层体的方法。本发明的电路板包括柔性膜和由设置在柔性膜上的金属构成的电路图案，电路图案的尺寸变化率在±0.01％以内。本发明的电路基板用层叠体的特征在于，具有加强板，自粘式，可移除有机层，柔性膜，以及由依次层压的金属构成的电路图案。

5. 发明授权

US07105221B2 Circuit board, laminated member for circuit board, and method for making laminated member for circuit board 失效
标题翻译：电路板，电路基板用层叠体及电路基板用层叠体的制造方法
公开(公告)号：US07105221B2
公开(公告)日：2006-09-12
申请号：US10450415
申请日：2002-07-17
申请人： Takayoshi Akamatsu , Futoshi Okuyama , Nobuyuki Kuroki , Hiroshi Enomoto , Tetsuya Hayashi , Yoshio Matsuda , Yoichi Shinba , Masahiro Oguni
发明人： Takayoshi Akamatsu , Futoshi Okuyama , Nobuyuki Kuroki , Hiroshi Enomoto , Tetsuya Hayashi , Yoshio Matsuda , Yoichi Shinba , Masahiro Oguni
IPC分类号： B32B3/00 , H05K1/16
CPC分类号： B32B38/18 , B32B37/025 , B32B2037/109 , B32B2038/1891 , B32B2379/08 , B32B2457/08 , H05K1/0393 , H05K3/007 , H05K2203/0152 , H05K2203/0156 , H05K2203/016 , H05K2203/066 , H05K2203/068 , H05K2203/1572 , Y10S428/901 , Y10T428/24917
摘要： The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.
摘要翻译：电路基板技术领域本发明涉及具备极细电路图案的柔性膜，电路基板用层叠体以及生产率优异的电路板用叠层体的方法。本发明的电路板包括柔性膜和由设置在柔性膜上的金属构成的电路图案，电路图案的尺寸变化率在±0.01％以内。本发明的电路基板用层叠体的特征在于，具有加强板，自粘型，可移除有机层，柔性膜，以及由依次层叠的金属构成的电路图案。

6. 发明申请

US20060237133A1 Methods for making laminated member for circuit board, making circuit board and laminating flexible film 失效
公开(公告)号：US20060237133A1
公开(公告)日：2006-10-26
申请号：US11474427
申请日：2006-06-26
申请人： Takayoshi Akamatsu , Futoshi Okuyama , Nobuyuki Kuroki , Hiroshi Enomoto , Tetsuya Hayashi , Yoshio Matsuda , Yoichi Shinba , Masahiro Oguni
发明人： Takayoshi Akamatsu , Futoshi Okuyama , Nobuyuki Kuroki , Hiroshi Enomoto , Tetsuya Hayashi , Yoshio Matsuda , Yoichi Shinba , Masahiro Oguni
IPC分类号： C09J7/00
CPC分类号： B32B38/18 , B32B37/025 , B32B2037/109 , B32B2038/1891 , B32B2379/08 , B32B2457/08 , H05K1/0393 , H05K3/007 , H05K2203/0152 , H05K2203/0156 , H05K2203/016 , H05K2203/066 , H05K2203/068 , H05K2203/1572 , Y10S428/901 , Y10T428/24917
摘要： The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

7. 发明授权

US6106997A Plate for waterless lithographic 失效
标题翻译：无水平版印版
公开(公告)号：US6106997A
公开(公告)日：2000-08-22
申请号：US11793
申请日：1998-03-06
申请人： Masahiro Oguni , Ken Kawamura , Keiko Sugikawa
发明人： Masahiro Oguni , Ken Kawamura , Keiko Sugikawa
IPC分类号： G03F7/004 , B41N1/14 , G03F7/00 , G03F7/027 , G03F7/038 , G03F7/075 , G03F7/11 , G03F7/30
CPC分类号： G03F7/027 , G03F7/0752
摘要： Provided is a non-processed plate for waterless lithographic printing plates, which comprises a photosensitive layer, an ink-repellent layer and a protective layer as laminated in that order on a support and in which the photosensitive layer contains a polymerizable compound as obtained by reacting a glycidyl ether of a polyalcohol, such as hexitol or pentitol, with acrylic acid and/or methacrylic acid. The plate has good image reproducibility and good storage stability. Processing the plate gives waterless lithographic printing plates having good printing durability.
摘要翻译： PCT No.PCT / JP97 / 02085 Sec。 371日期1998年3月6日 102（e）1998年3月6日PCT PCT 1997年6月17日PCT公布。公开号WO97 / 49005 日期1997年12月24日提供了一种无水平版印刷版的未经处理的板，其包括在载体上依次层压感光层，拒油层和保护层，其中感光层含有可聚合的通过多元醇的缩水甘油醚如己糖醇或戊糖醇与丙烯酸和/或甲基丙烯酸反应得到的化合物。该板具有良好的图像再现性和良好的储存稳定性。加工板材具有良好的印刷耐久性的无水平版印刷版。

8. 发明授权

US5866294A Water-less quinonediazide lithographic raw plate 失效
标题翻译：无水醌二叠氮版平版印刷版
公开(公告)号：US5866294A
公开(公告)日：1999-02-02
申请号：US847938
申请日：1997-04-28
申请人： Masahiro Oguni , Kazuki Goto , Mitsuru Suezawa , Shun-ichi Yanagida , Norimasa Ikeda
发明人： Masahiro Oguni , Kazuki Goto , Mitsuru Suezawa , Shun-ichi Yanagida , Norimasa Ikeda
IPC分类号： G03F7/022 , G03F7/023 , G03F7/075 , G03F7/23
CPC分类号： G03F7/022 , G03F7/023 , G03F7/0752
摘要： The present invention is a water-less lithographic printing plate, in which a photosensitive layer and a silicone rubber layer are laminated in this order on a substrate, characterized in that the photosensitive layer contains the reaction product between a compound with at least one each of phenolic hydroxyl groups and non-phenolic hydroxyl groups and a quinonediazide compound, or contains both the reaction product between a compound with at least one of phenolic hydroxyl groups and a quinonediazide compound, and the reaction product between a compound with at least one of non-phenolic hydroxyl groups and a quinonediazide compound.The water-less lithographic raw plate of the present invention is excellent in image reproducibility and printing durability, and so can be favorably and economically advantageously used also in the commercial web offset printing and the newspaper web offset printing where high printing durability is required.
摘要翻译：本发明是一种无水平版印刷版，其中感光层和硅橡胶层依次层叠在基板上，其特征在于感光层含有化合物与至少一种酚羟基和非酚羟基和醌二叠氮化合物，或含有酚羟基与醌二叠氮化合物中的至少一种的化合物之间的反应产物，以及化合物与至少一种非环氧化合物之间的反应产物，酚羟基和醌二叠氮化合物。本发明的无水平版印刷版原版图像再现性和印刷耐久性优异，因此在商业卷筒胶版印刷和需要高印刷耐久性的报纸幅胶版印刷中也可有利地和经济地有利地使用。

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