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    • 9. 发明授权
    • Capacitive micro-machined transducer and method of manufacturing the same
    • 电容式微加工传感器及其制造方法
    • US09231496B2
    • 2016-01-05
    • US14369341
    • 2013-01-18
    • KONINKLIJKE PHILIPS N.V.
    • Peter DirksenRuediger MauczokKoray KarakayaJohan Hendrik KlootwijkBout MarcelisMarcel Mulder
    • H02N1/00B06B1/02B81C1/00B81B3/00H02N1/08
    • H02N1/006B06B1/0292B81B3/00B81B2203/0127B81C1/00158B81C1/00373H02N1/08
    • The present invention relates to a method of manufacturing a capacitive micro-machined transducer (100), in particular a CMUT, the method comprising depositing a first electrode layer (10) on a substrate (1), depositing a first dielectric film (20) on the first electrode layer (10), depositing a sacrificial layer (30) on the first dielectric film (20), the sacrificial layer (30) being removable for forming a cavity (35) of the transducer, depositing a second dielectric film (40) on the sacrificial layer (30), and depositing a second electrode layer (50) on the second dielectric film (40), wherein the first dielectric film (20) and/or the second dielectric film (40) comprises a first layer comprising an oxide, a second layer comprising a high-k material, and a third layer comprising an oxide, and wherein the depositing steps are performed by Atomic Layer Deposition. The present invention further relates to a capacitive micro-machined transducer (100), in particular a CMUT, manufactured by such method.
    • 本发明涉及一种制造电容微加工的换能器(100),特别是CMUT的方法,该方法包括在衬底(1)上沉积第一电极层(10),沉积第一电介质膜(20) 在所述第一电极层(10)上,在所述第一介电膜(20)上沉积牺牲层(30),所述牺牲层(30)可去除以形成所述换能器的空腔(35),沉积第二电介质膜 40),并且在所述第二电介质膜(40)上沉积第二电极层(50),其中所述第一电介质膜(20)和/或所述第二电介质膜(40)包括第一层 包括氧化物,包含高k材料的第二层和包含氧化物的第三层,并且其中所述沉积步骤通过原子层沉积进行。 本发明还涉及通过这种方法制造的电容式微加工的换能器(100),特别是CMUT。