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1. 发明授权

US10527951B2 Compound imaging metrology targets 有权
公开(公告)号：US10527951B2
公开(公告)日：2020-01-07
申请号：US15057723
申请日：2016-03-01
申请人： KLA-TENCOR CORPORATION
发明人： Raviv Yohanan , Eran Amit , Mark Ghinovker , Tal Itzkovich , Nuriel Amir
IPC分类号： G03F7/20
摘要： Imaging metrology targets and methods are provided, which combine one-dimensional (1D) elements designed to provide 1D imaging metrology signals along at least two measurement directions and two-dimensional (2D) elements designed to provide at least one 2D imaging metrology overlay signal. The target area of the 1D elements may enclose the 2D elements or the target areas of the 1D and 2D elements may be partially or fully congruent. The compound targets are small, possibly multilayered, and may be designed to be process compatible (e.g., by segmentation of the elements, interspaces between elements and element backgrounds) and possibly be produced in die. Two dimensional elements may be designed to be periodic to provide additional one dimensional metrology signals.

2. 发明授权

US10203200B2 Analyzing root causes of process variation in scatterometry metrology 有权
公开(公告)号：US10203200B2
公开(公告)日：2019-02-12
申请号：US15329618
申请日：2016-11-01
申请人： KLA-Tencor Corporation
发明人： Tal Marciano , Michael E. Adel , Mark Ghinovker , Barak Bringoltz , Dana Klein , Tal Itzkovich , Vidya Ramanathan , Janay Camp
IPC分类号： G06F11/00 , G01B11/27 , G03F7/20 , H01L21/66
摘要： Method, metrology modules and RCA tool are provided, which use the behavior of resonance region(s) in measurement landscapes to evaluate and characterize process variation with respect to symmetric and asymmetric factors, and provide root cause analysis of the process variation with respect to process steps. Simulations of modeled stacks with different layer thicknesses and process variation factors may be used to enhance the analysis and provide improved target designs, improved algorithms and correctables for metrology measurements. Specific targets that exhibit sensitive resonance regions may be utilize to enhance the evaluation of process variation.

3. 发明申请

US20180157784A1 Process Compatibility Improvement by Fill Factor Modulation 审中-公开
公开(公告)号：US20180157784A1
公开(公告)日：2018-06-07
申请号：US15502950
申请日：2016-11-04
申请人： KLA-Tencor Corporation
发明人： Vladimir Levinski , Eitan Hajaj , Tal Itzkovich , Sharon Aharon , Michael E. Adel , Yuri Paskover , Daria Negri , Yuval Lubashevsky , Amnon Manassen , Myungjun Lee , Mark D. Smith
IPC分类号： G06F17/50 , G03F7/20
摘要： Metrology targets and target design methods are provided, in which target elements are defined by replacing elements from a periodic pattern having a pitch p, by assist elements having at least one geometric difference from the replaced elements, to form a composite periodic structure that maintains the pitch p as a single pitch. Constructing targets within the bounds of compatibility with advanced multiple patterning techniques improves the fidelity of the targets and fill factor modulation enables adjustment of the targets to produce sufficient metrology sensitivity for extracting the overlay while achieving process compatibility of the targets.

4. 发明申请

US20180023950A1 Analyzing Root Causes of Process Variation in Scatterometry Metrology 审中-公开
公开(公告)号：US20180023950A1
公开(公告)日：2018-01-25
申请号：US15329618
申请日：2016-11-01
申请人： KLA-Tencor Corporation
发明人： Tal Marciano , Michael E. Adel , Mark Ghinovker , Barak Bringoltz , Dana Klein , Tal Itzkovich , Vidya Ramanathan , Janay Camp
IPC分类号： G01B11/27
CPC分类号： G01B11/272 , G03F7/70616 , G03F7/70633 , H01L22/12 , H01L22/20
摘要： Method, metrology modules and RCA tool are provided, which use the behavior of resonance region(s) in measurement landscapes to evaluate and characterize process variation with respect to symmetric and asymmetric factors, and provide root cause analysis of the process variation with respect to process steps. Simulations of modeled stacks with different layer thicknesses and process variation factors may be used to enhance the analysis and provide improved target designs, improved algorithms and correctables for metrology measurements. Specific targets that exhibit sensitive resonance regions may be utilize to enhance the evaluation of process variation.

5. 发明申请

US20160290796A1 Feed Forward of Metrology Data in a Metrology System 有权
标题翻译：计量系统中计量数据的前馈
公开(公告)号：US20160290796A1
公开(公告)日：2016-10-06
申请号：US15090389
申请日：2016-04-04
申请人： KLA-Tencor Corporation
发明人： Ady Levy , Daniel Kandel , Michael E. Adel , Leonid Poslavsky , John Robinson , Tal Marciano , Barak Bringoltz , Tzahi Grunzweig , Dana Klein , Tal Itzkovich , Nadav Carmel , Nuriel Amir , Vidya Ramanathan , Janay Camp , Mark Wagner
IPC分类号： G01B11/27 , G01N21/21
CPC分类号： G01B11/272 , G01N21/211 , G01N21/31 , G01N21/41 , G01N21/4738 , G01N21/4788 , G01N21/6489 , G01N21/9501 , G01N2021/213 , G03F7/705 , G03F7/70525 , G03F7/70533 , G03F7/70616
摘要： A metrology performance analysis system includes a metrology tool including one or more detectors and a controller communicatively coupled to the one or more detectors. The controller is configured to receive one or more metrology data sets associated with a metrology target from the metrology tool in which the one or more metrology data sets include one or more measured metrology metrics and the one or more measured metrology metrics indicate deviations from nominal values. The controller is further configured to determine relationships between the deviations from the nominal values and one or more selected semiconductor process variations, and determine one or more root causes of the deviations from the nominal values based on the relationships between values of the one or more metrology metrics and the one or more selected semiconductor process variations.
摘要翻译：计量性能分析系统包括包括一个或多个检测器的计量工具和通信地耦合到所述一个或多个检测器的控制器。所述控制器被配置为从所述计量工具接收与度量目标相关联的一个或多个度量数据集，其中所述一个或多个测量数据集包括一个或多个测量的度量度量，并且所述一个或多个测量的度量度量指示与标称值的偏差。控制器还被配置为确定与标称值和一个或多个所选择的半导体工艺变化的偏差之间的关系，并且基于一个或多个测量值的值之间的关系确定偏离标称值的一个或多个根本原因度量和一个或多个所选择的半导体工艺变化。

6. 发明申请

US20140375984A1 HYBRID IMAGING AND SCATTEROMETRY TARGETS 有权
标题翻译：混合成像和分析目标
公开(公告)号：US20140375984A1
公开(公告)日：2014-12-25
申请号：US14338023
申请日：2014-07-22
申请人： KLA-Tencor Corporation
发明人： DongSub Choi , Tal Itzkovich , David Tien
IPC分类号： G01N21/95
CPC分类号： G01N21/9501 , G01N21/93 , G01N21/956 , G03F7/70633 , G03F7/70683
摘要： Metrology targets, design files, and design and production methods thereof are provided. The metrology targets are hybrid in that they comprise at least one imaging target structure configured to be measurable by imaging and at least one scatterometry target structure configured to be measurable by scatterometry. Thus, the hybrid targets may be measured by imaging and scatterometry simultaneously or alternatingly and/or the measurement techniques may be optimized with respect to wafer regions and other spatial parameters, as well as with respect to temporal process parameters. The hybrid targets may be used to monitor process parameters, for example via comparative overlay measurements and/or high resolution measurements.
摘要翻译：提供了计量目标，设计文件及其设计和制作方法。度量目标是混合的，因为它们包括被配置为可通过成像测量的至少一个成像目标结构和被配置为可通过散射测量来测量的至少一个散射测量目标结构。因此，可以通过成像和散射测量同时或交替地测量混合目标，和/或可以相对于晶片区域和其他空间参数以及关于时间过程参数优化测量技术。混合目标可以用于监测过程参数，例如通过比较覆盖测量和/或高分辨率测量。

7. 发明授权

US10579768B2 Process compatibility improvement by fill factor modulation 有权
公开(公告)号：US10579768B2
公开(公告)日：2020-03-03
申请号：US15502950
申请日：2016-11-04
申请人： KLA-Tencor Corporation
发明人： Vladimir Levinski , Eitan Hajaj , Tal Itzkovich , Sharon Aharon , Michael E. Adel , Yuri Paskover , Daria Negri , Yuval Lubashevsky , Amnon Manassen , Myungjun Lee , Mark D. Smith
IPC分类号： G06F17/50 , H01L21/027 , G03F7/20
摘要： Metrology targets and target design methods are provided, in which target elements are defined by replacing elements from a periodic pattern having a pitch p, by assist elements having at least one geometric difference from the replaced elements, to form a composite periodic structure that maintains the pitch p as a single pitch. Constructing targets within the bounds of compatibility with advanced multiple patterning techniques improves the fidelity of the targets and fill factor modulation enables adjustment of the targets to produce sufficient metrology sensitivity for extracting the overlay while achieving process compatibility of the targets.

8. 发明授权

US10303835B2 Method and apparatus for direct self assembly in target design and production 有权
公开(公告)号：US10303835B2
公开(公告)日：2019-05-28
申请号：US14710201
申请日：2015-05-12
申请人： KLA-TENCOR CORPORATION
发明人： Eran Amit , Raviv Yohanan , Tal Itzkovich , Nuriel Amir , Roie Volkovich , Dongsub Choi
IPC分类号： B32B3/10 , G06F17/50 , G01N21/93 , G01N21/956 , H01L21/3105 , H01L21/311 , G03F7/00
摘要： Target designs methods and targets are provided, in which at least some of the differentiation between target elements and their background is carried out by segmenting either of them. Directed self-assembly (DSA) processes are used to generate fine segmentation, and various characteristics of the polymer lines and their guiding lines are used to differentiate target elements from their background. Target designs and design principles are disclosed in relation to the DSA process, as well as optimization of the DSA process to yield high metrology measurement accuracy in face of production inaccuracies. Furthermore, designs and methods are provided for enhancing and using ordered regions of a DSA-produced polymer surface as target elements and as hard masks for production processes. The targets and methods may be configured to enable metrology measurements using polarized light to distinguish target elements or DSA features.

9. 发明授权

US09903711B2 Feed forward of metrology data in a metrology system 有权
公开(公告)号：US09903711B2
公开(公告)日：2018-02-27
申请号：US15090389
申请日：2016-04-04
申请人： KLA-Tencor Corporation
发明人： Ady Levy , Daniel Kandel , Michael E. Adel , Leonid Poslavsky , John Robinson , Tal Marciano , Barak Bringoltz , Tzahi Grunzweig , Dana Klein , Tal Itzkovich , Nadav Carmel , Nuriel Amir , Vidya Ramanathan , Janay Camp , Mark Wagner
IPC分类号： G01B11/14 , G01B11/27 , G01N21/95 , G03F7/20 , G01N21/21 , G01N21/31 , G01N21/41 , G01N21/47 , G01N21/64
CPC分类号： G01B11/272 , G01N21/211 , G01N21/31 , G01N21/41 , G01N21/4738 , G01N21/4788 , G01N21/6489 , G01N21/9501 , G01N2021/213 , G03F7/705 , G03F7/70525 , G03F7/70533 , G03F7/70616
摘要： A metrology performance analysis system includes a metrology tool including one or more detectors and a controller communicatively coupled to the one or more detectors. The controller is configured to receive one or more metrology data sets associated with a metrology target from the metrology tool in which the one or more metrology data sets include one or more measured metrology metrics and the one or more measured metrology metrics indicate deviations from nominal values. The controller is further configured to determine relationships between the deviations from the nominal values and one or more selected semiconductor process variations, and determine one or more root causes of the deviations from the nominal values based on the relationships between values of the one or more metrology metrics and the one or more selected semiconductor process variations.

10. 发明授权

US09476838B2 Hybrid imaging and scatterometry targets 有权
标题翻译：混合成像和散射目标
公开(公告)号：US09476838B2
公开(公告)日：2016-10-25
申请号：US14338023
申请日：2014-07-22
申请人： KLA-Tencor Corporation
发明人： DongSub Choi , Tal Itzkovich , David Tien
IPC分类号： G01N21/00 , G01N21/95 , G01N21/93 , G01N21/956 , G03F7/20
CPC分类号： G01N21/9501 , G01N21/93 , G01N21/956 , G03F7/70633 , G03F7/70683
摘要： Metrology targets, design files, and design and production methods thereof are provided. The metrology targets are hybrid in that they comprise at least one imaging target structure configured to be measurable by imaging and at least one scatterometry target structure configured to be measurable by scatterometry. Thus, the hybrid targets may be measured by imaging and scatterometry simultaneously or alternatingly and/or the measurement techniques may be optimized with respect to wafer regions and other spatial parameters, as well as with respect to temporal process parameters. The hybrid targets may be used to monitor process parameters, for example via comparative overlay measurements and/or high resolution measurements.
摘要翻译：提供了计量目标，设计文件及其设计和制作方法。度量目标是混合的，因为它们包括被配置为可通过成像测量的至少一个成像目标结构和被配置为可通过散射测量来测量的至少一个散射测量目标结构。因此，可以通过成像和散射测量同时或交替地测量混合目标，和/或可以相对于晶片区域和其他空间参数以及关于时间过程参数优化测量技术。混合目标可以用于监测过程参数，例如通过比较覆盖测量和/或高分辨率测量。

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