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1. 发明授权

US09915622B2 Wafer inspection 有权
公开(公告)号：US09915622B2
公开(公告)日：2018-03-13
申请号：US14838194
申请日：2015-08-27
申请人： KLA-Tencor Corporation
发明人： Anatoly Romanovsky , Ivan Maleev , Daniel Kavaldjiev , Yury Yuditsky , Dirk Woll , Stephen Biellak , Mehdi Vaez-Iravani , Guoheng Zhao
IPC分类号： G01N21/95 , G01N21/47 , G01N21/88 , G01N21/956
CPC分类号： G01N21/9501 , G01N21/47 , G01N21/8806 , G01N21/8851 , G01N21/956
摘要： Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to direct pulses of light to an area on a wafer; a scanning subsystem configured to scan the pulses of light across the wafer; a collection subsystem configured to image pulses of light scattered from the area on the wafer to a sensor, wherein the sensor is configured to integrate a number of the pulses of scattered light that is fewer than a number of the pulses of scattered light that can be imaged on the entire area of the sensor, and wherein the sensor is configured to generate output responsive to the integrated pulses of scattered light; and a computer subsystem configured to detect defects on the wafer using the output generated by the sensor.

2. 发明授权

US09587936B2 Scanning inspection system with angular correction 有权
标题翻译：带角度校正的扫描检查系统
公开(公告)号：US09587936B2
公开(公告)日：2017-03-07
申请号：US13826790
申请日：2013-03-14
申请人： KLA-Tencor Corporation
发明人： Yury Yuditsky , Alexander Slobodov , Anatoly Romanovsky
IPC分类号： G01B21/04 , G01N21/95 , G03F1/84
CPC分类号： G01B21/045 , G01N21/9501 , G03F1/84
摘要： A wafer is moved under an inspection spot by a rotary inspection system. The system rotates the wafer about an axis of rotation and translates the wafer along a linear trajectory. When the inspection spot is not aligned with the trajectory of the axis of rotation, an angular error is introduced in the representation of the position of the inspection spot with respect to the wafer by the rotary encoder. The angular error is corrected based on an angular error correction value. The angular error correction value is determined based on the distance between the inspection spot and the trajectory of the axis of rotation, the radial distance between the axis of rotation and the inspection spot at a first instance of a particular angular position, and a second radial distance between the axis of rotation and the inspection location at a second instance of the angular position.
摘要翻译：通过旋转检查系统将晶片在检查点下移动。系统围绕旋转轴旋转晶片，并沿着线性轨迹平移晶片。当检查点不与旋转轴线的轨迹对准时，通过旋转编码器在检查点相对于晶片的位置的表示中引入角度误差。基于角度误差校正值校正角度误差。角度误差校正值基于检查点与旋转轴线的轨迹之间的距离，旋转轴线与特定角度位置的第一阶段的检查点之间的径向距离和第二径向在角位置的第二个实例处，旋转轴线与检查位置之间的距离。

3. 发明申请

US20160334516A1 System and Method for Reducing Radiation-Induced False Counts in an Inspection System 有权
标题翻译：在检测系统中减少辐射诱发的错误计数的系统和方法
公开(公告)号：US20160334516A1
公开(公告)日：2016-11-17
申请号：US14946563
申请日：2015-11-19
申请人： KLA-Tencor Corporation
发明人： Ximan Jiang , Anatoly Romanovsky , Christian Wolters , Stephen Biellak
IPC分类号： G01T1/208 , G01T1/24
CPC分类号： G01T1/24 , G01N21/9501
摘要： An inspection system with radiation-induced false count mitigation includes an illumination source configured to illuminate a sample, a detector assembly comprising an illumination sensor configured to detect illumination from the sample, and one or more radiation sensors configured to detect particle radiation, and control circuitry communicatively coupled to the detector. The control circuitry is configured to perform the steps of determining a set of radiation detection events based on one or more radiation signals received from the radiation sensors, determining a set of imaging events based on the illumination signal received from the illumination sensor, comparing the set of radiation detection events to the set of imaging events to generate a set of coincidence events, wherein the set of coincidence events comprises simultaneous imaging and radiation detection events, and excluding the set of coincidence events from the set of imaging events to generate a set of identified defect sites.
摘要翻译：具有辐射诱导的假计数减轻的检查系统包括被配置为照亮样本的照明源，检测器组件，包括被配置为检测来自样品的照明的照明传感器，以及被配置为检测粒子辐射的一个或多个辐射传感器，以及控制电路通信地耦合到检测器。控制电路被配置为执行以下步骤：基于从辐射传感器接收的一个或多个辐射信号来确定一组辐射检测事件，基于从照明传感器接收的照明信号确定一组成像事件，将该组的辐射检测事件发生到所述一组成像事件以产生一组重合事件，其中所述一致事件包括同时成像和辐射检测事件，并且从所述一组成像事件中排除所述一致事件组合以产生一组发现缺陷点。

4. 发明授权

US10488348B2 Wafer inspection 有权
公开(公告)号：US10488348B2
公开(公告)日：2019-11-26
申请号：US15882946
申请日：2018-01-29
申请人： KLA-Tencor Corporation
发明人： Anatoly Romanovsky , Ivan Maleev , Daniel Kavaldjiev , Yury Yuditsky , Dirk Woll , Stephen Biellak , Mehdi Vaez-Iravani , Guoheng Zhao
IPC分类号： G01N21/95 , G01N21/88 , G01N21/47 , G01N21/956
CPC分类号： G01N21/9501 , G01N21/47 , G01N21/8806 , G01N21/8851 , G01N21/956
摘要： Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to direct pulses of light to an area on a wafer; a scanning subsystem configured to scan the pulses of light across the wafer; a collection subsystem configured to image pulses of light scattered from the area on the wafer to a sensor, wherein the sensor is configured to integrate a number of the pulses of scattered light that is fewer than a number of the pulses of scattered light that can be imaged on the entire area of the sensor, and wherein the sensor is configured to generate output responsive to the integrated pulses of scattered light; and a computer subsystem configured to detect defects on the wafer using the output generated by the sensor.

5. 发明授权

US10241217B2 System and method for reducing radiation-induced false counts in an inspection system 有权
公开(公告)号：US10241217B2
公开(公告)日：2019-03-26
申请号：US15795028
申请日：2017-10-26
申请人： KLA-Tencor Corporation
发明人： Ximan Jiang , Anatoly Romanovsky , Christian Wolters , Stephen Biellak , Mous Tatarkhanov
IPC分类号： G01T1/24 , G01N21/95
摘要： An inspection system with radiation-induced false count mitigation includes a radiation count controller coupled to one or more radiation sensors positioned proximate to an illumination sensor oriented to detect illumination from a sample. The radiation count controller may identify a set of radiation detection events based on radiation signals received from the radiation sensors during operation of the illumination sensor. The inspection system may further include an inspection controller to identify a set of illumination detection events based on an illumination signal, identify one or more features on the sample based on the set of illumination detection events, receive the set of radiation detection events from the radiation count controller, compare the set of radiation detection events to the set of illumination detection events to identify a set of coincidence events, and refine the one or more identified features on the sample based on the set of coincidence events.

6. 发明申请

US20180045837A1 System and Method for Reducing Radiation-Induced False Counts in an Inspection System 审中-公开
公开(公告)号：US20180045837A1
公开(公告)日：2018-02-15
申请号：US15795028
申请日：2017-10-26
申请人： KLA-Tencor Corporation
发明人： Ximan Jiang , Anatoly Romanovsky , Christian Wolters , Stephen Biellak , Mous Tatarkhanov
IPC分类号： G01T1/24 , G01N21/95
CPC分类号： G01T1/24 , G01N21/9501
摘要： An inspection system with radiation-induced false count mitigation includes a radiation count controller coupled to one or more radiation sensors positioned proximate to an illumination sensor oriented to detect illumination from a sample. The radiation count controller may identify a set of radiation detection events based on radiation signals received from the radiation sensors during operation of the illumination sensor. The inspection system may further include an inspection controller to identify a set of illumination detection events based on an illumination signal, identify one or more features on the sample based on the set of illumination detection events, receive the set of radiation detection events from the radiation count controller, compare the set of radiation detection events to the set of illumination detection events to identify a set of coincidence events, and refine the one or more identified features on the sample based on the set of coincidence events.

7. 发明申请

US20140071437A1 Monitoring Incident Beam Position in a Wafer Inspection System 有权
标题翻译：监测晶圆检测系统中的入射光束位置
公开(公告)号：US20140071437A1
公开(公告)日：2014-03-13
申请号：US13794030
申请日：2013-03-11
申请人： KLA-Tencor Corporation
发明人： Juergen Reich , Aleksey Petrenko , Richard Fong , Bret Whiteside , Jien Cao , Christian Wolters , Anatoly Romanovsky , Daniel Kavaldjiev
IPC分类号： G01J1/42
CPC分类号： G01J1/4257 , G01N21/9501 , H01L21/67259 , H01L21/681
摘要： Methods, systems, and structures for monitoring incident beam position in a wafer inspection system are provided. One structure includes a feature formed in a chuck configured to support a wafer during inspection by the wafer inspection system. The chuck rotates the wafer in a theta direction and simultaneously translates the wafer in a radial direction during the inspection. An axis through the center of the feature is aligned with a radius of the chuck such that a position of the axis relative to an incident beam of the wafer inspection system indicates changes in the incident beam position in the theta direction.
摘要翻译：提供了用于监测晶片检测系统中的入射光束位置的方法，系统和结构。一种结构包括形成在卡盘中的特征，其构造成在晶片检查系统检查期间支撑晶片。卡盘在θ方向旋转晶片，同时在检查期间沿径向方向平移晶片。穿过特征中心的轴与卡盘的半径对准，使得轴相对于晶片检查系统的入射光束的位置指示在θ方向上的入射光束位置的变化。

8. 发明申请

US20180164228A1 Wafer Inspection 审中-公开
公开(公告)号：US20180164228A1
公开(公告)日：2018-06-14
申请号：US15882946
申请日：2018-01-29
申请人： KLA-Tencor Corporation
发明人： Anatoly Romanovsky , Ivan Maleev , Daniel Kavaldjiev , Yury Yuditsky , Dirk Woll , Stephen Biellak , Mehdi Vaez-Iravani , Guoheng Zhao
IPC分类号： G01N21/95 , G01N21/47 , G01N21/956 , G01N21/88
CPC分类号： G01N21/9501 , G01N21/47 , G01N21/8806 , G01N21/8851 , G01N21/956
摘要： Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to direct pulses of light to an area on a wafer; a scanning subsystem configured to scan the pulses of light across the wafer; a collection subsystem configured to image pulses of light scattered from the area on the wafer to a sensor, wherein the sensor is configured to integrate a number of the pulses of scattered light that is fewer than a number of the pulses of scattered light that can be imaged on the entire area of the sensor, and wherein the sensor is configured to generate output responsive to the integrated pulses of scattered light; and a computer subsystem configured to detect defects on the wafer using the output generated by the sensor.

9. 发明授权

US09891177B2 TDI sensor in a darkfield system 有权
公开(公告)号：US09891177B2
公开(公告)日：2018-02-13
申请号：US14506321
申请日：2014-10-03
申请人： KLA-Tencor Corporation
发明人： Jijen Vazhaeparambil , Guoheng Zhao , Daniel Kavaldjiev , Anatoly Romanovsky , Ivan Maleev , Christian Wolters , Stephen Biellak , Bret Whiteside , Donald Pettibone , Yung-Ho Alex Chuang , David W. Shortt
IPC分类号： G01N21/88 , G01N21/95 , G06T7/00 , G01N21/956
CPC分类号： G01N21/8851 , G01N21/9501 , G01N21/956 , G01N2021/8887 , G01N2021/8896 , G01N2201/06113 , G01N2201/103 , G01N2201/12 , G06T7/0004 , G06T2207/10004 , G06T2207/30148
摘要： A wafer scanning system includes imaging collection optics to reduce the effective spot size. Smaller spot size decreases the number of photons scattered by the surface proportionally to the area of the spot. Air scatter is also reduced. TDI is used to produce a wafer image based on a plurality of image signals integrated over the direction of linear motion of the wafer. An illumination system floods the wafer with light, and the task of creating the spot is allocated to the imaging collection optics.

10. 发明授权

US09810619B2 Method and system for simultaneous tilt and height control of a substrate surface in an inspection system 有权
公开(公告)号：US09810619B2
公开(公告)日：2017-11-07
申请号：US14022305
申请日：2013-09-10
申请人： KLA-Tencor Corporation
发明人： Zhongping Cai , Jingyi Xiong , Tyler Trytko , Alexander Slobodov , Paul Doyle , Anatoly Romanovsky
IPC分类号： G01N21/01 , G01N21/956 , G01B5/00
CPC分类号： G01N21/01 , G01B5/0004 , G01N21/956
摘要： A system for substrate tilt and focus control in an inspection system includes a dynamically actuatable substrate stage assembly including a substrate stage for securing a substrate; a tilt-height detection system including: a height detection sub-system and a tilt detection sub-system. The system further includes a first actuator configured to selectably actuate the substrate along a direction perpendicular to the surface of the substrate at a location of the substrate stage assembly; and an additional actuator configured to selectably actuate the substrate along a direction substantially perpendicular to the surface of the substrate at an additional location of the substrate stage assembly; and a MIMO tilt-focus controller communicatively coupled to the height detection sub-system, the tilt detection sub-system, the first actuator and the additional actuator.

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