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    • 8. 发明申请
    • THICK FILM CONDUCTOR CASE COMPOSITIONS FOR LTCC TAPE
    • 薄膜导体盒LTCC胶带组合物
    • US20080029202A1
    • 2008-02-07
    • US11873866
    • 2007-10-17
    • YUELI WANGCHRISTOPHER NEEDESPATRICIA OLLIVIER
    • YUELI WANGCHRISTOPHER NEEDESPATRICIA OLLIVIER
    • C03B29/00
    • H05K1/092B22F2998/00C22C13/00H01L21/4857H01L23/49894H01L2924/0002H01L2924/09701H05K1/0306H05K3/4611H05K3/4629Y10T428/24917Y10T428/24926B22F1/0074H01L2924/00
    • Methods of forming a multilayer circuit comprising: a) forming a patterned array of vias in a plurality of layers of green tape; b) filling the vias in one or more of the green tape layers from (a); c) printing over at least one surface of the green tape layers from step (b) with at least one patterned layer of a thick film composition consisting essentially of: i) electrically conductive powder; ii) an inorganic binder wherein the inorganic binder is selected from TiO2 and any compounds that can generate TiO2 during firing and any one of the following compounds: Sb2O3, Co3O4, PbO, Fe2O3, SnO2, MnO, CuO and mixtures thereof; and iii) an organic medium,  wherein the total inorganic binder is in the range of 0.6 wt. % to about 2 wt. % of the total composition. d) laminating the printed green tape layers from step (d) to form an assemblage comprising a plurality of unfired interconnected functional layers separated by unfired green tape; and e) cofiring the assemblage from step (d).
    • 形成多层电路的方法包括:a)在多层生胶带中形成图案化的通路阵列; b)在(a)中的一个或多个生胶带层中填充通孔; c)在步骤(b)的生胶带层的至少一个表面上印刷至少一个图案化的厚膜组合物层,所述厚膜组合物主要由以下组成:i)导电粉末; ii)无机粘合剂,其中所述无机粘合剂选自TiO 2和任何在焙烧期间可产生TiO 2的化合物和任何以下化合物:Sb < 2 O 3,3 O 3,4 O 3,PbO 3,Fe 2 O 3,3 SnO 2,MnO,CuO及其混合物; 和iii)有机介质,其中总无机粘合剂的范围为0.6wt。 %至约2wt。 占组合物总数的百分比。 d)从步骤(d)层压印刷的生胶带层以形成包括由未烧绿色带分隔的多个未烧结的互连功能层的组合件; 和e)从步骤(d)共同燃烧组合物。
    • 9. 发明申请
    • CONDUCTIVE METAL PASTE FOR A METAL-WRAP-THROUGH SILICON SOLAR CELL
    • 用于金属缠绕硅太阳能电池的导电金属浆料
    • US20120234384A1
    • 2012-09-20
    • US13403059
    • 2012-02-23
    • ALAN FREDERICK CARROLLYUELI WANG
    • ALAN FREDERICK CARROLLYUELI WANG
    • H01L31/0224H01B1/22
    • H01L31/02245H01B1/22Y02E10/50
    • A conductive metal via paste comprising particulate conductive metal, a reactant that reacts at temperatures of 600° C. to 900° C. with at least one of the group consisting of Si, SiO2 and SiNx to form an insulating glass, and an organic vehicle is particularly useful in providing the metallization of the holes in the silicon wafers of MWT solar cells. The result is a metallic electrically conductive via between the collector lines on the front side and the emitter electrode on the back-side of the solar cell. The paste can also be used to form the collector lines on the front-side of the solar cell and the emitter electrode on the back-side of the solar cell. Also disclosed are metal-wrap-through silicon solar cells comprising the fired conductive metal paste.
    • 一种导电金属通孔糊,其包含颗粒状导电金属,在600℃至900℃的温度下与Si,SiO 2和SiN x中的至少一个反应以形成绝缘玻璃的反应物,以及有机载体 在提供MWT太阳能电池的硅晶片中的孔的金属化方面特别有用。 结果是在前侧的集电极线与太阳能电池背面的发射极之间的金属导电通孔。 该糊料也可用于在太阳能电池的正面和太阳能电池背面上的发射电极上形成集电极线。 还公开了包含烧结的导电金属浆料的金属包裹硅太阳能电池。