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USRE46004E1 Light-emitting chip device with high thermal conductivity 有权
标题翻译：具有高导热性的发光芯片器件
公开(公告)号：USRE46004E1
公开(公告)日：2016-05-17
申请号：US14121840
申请日：2014-10-23
申请人： KABUSHIKI KAISHA TOSHIBA , NATIONAL CHUNG HSING UNIVERSITY
发明人： Ray-Hua Horng , Dong-Sing Wuu , Shao-Hua Huang , Chuang-Yu Hsieh , Chao-Kun Lin
IPC分类号： H01L29/22 , H01L33/22
CPC分类号： H01L33/22 , H01L29/22 , H01L33/0079 , H01L33/44
摘要： This invention provides a light-emitting chip device with high thermal conductivity, which includes an epitaxial chip, an electrode disposed on a top surface of the epitaxial chip and a U-shaped electrode base cooperating with the electrode to provide electric energy to the epitaxial chip for generating light by electric-optical effect. The epitaxial chip includes a substrate and an epitaxial-layer structure with a roughening top surface and a roughening bottom surface for improving light extracted out of the epitaxial chip. A thermal conductive transparent reflective layer is formed between the substrate and the epitaxial-layer structure. The electrode base surrounds the substrate, the transparent reflective layer and a first cladding layer of the epitaxial-layer structure to facilitate the dissipation of the internal waste heat generated when the epitaxial chip emitting light. A method for manufacturing the chip device of the present invention is provided.
摘要翻译：本发明提供一种具有高导热性的发光芯片器件，其包括外延芯片，设置在外延芯片的顶表面上的电极和与电极配合的U形电极基底，以向外延芯片提供电能用于通过电光效应产生光。外延芯片包括具有粗糙化顶表面和粗糙化底表面的衬底和外延层结构，用于改善从外延芯片中提取的光。在衬底和外延层结构之间形成导热透明反射层。电极基体围绕基板，透明反射层和外延层结构的第一包层，以便于当外延芯片发光时产生的内部废热的耗散。提供了本发明的芯片装置的制造方法。

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