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    • 3. 发明申请
    • THIN FILM TRANSISTOR
    • 薄膜晶体管
    • US20150123116A1
    • 2015-05-07
    • US14399378
    • 2013-06-06
    • KABUSHIKI KAISHA KOBE SEIKO SHO (Kobe Steel, Ltd.)
    • Hiroshi GotoAya MikiTomoya KishiKenta HiroseShinya MoritaToshihiro Kugimiya
    • H01L29/786H01L29/24
    • H01L29/78693C23C14/08H01L21/02554H01L21/02565H01L21/02631H01L27/1225H01L29/24H01L29/78606H01L29/78696
    • Provided is a thin film transistor having an oxide semiconductor layer that has high mobility, excellent stress resistance, and good wet etching property. The thin film transistor comprises at least, a gate electrode, a gate insulating film, an oxide semiconductor layer, source-drain electrode and a passivation film, in this order on a substrate. The oxide semiconductor layer is a laminate comprising a first oxide semiconductor layer (IGZTO) and a second oxide semiconductor layer (IZTO). The second oxide semiconductor layer is formed on the gate insulating film, and the first oxide semiconductor layer is formed between the second oxide semiconductor layer and the passivation film. The contents of respective metal elements relative to the total amount of all the metal elements other than oxygen in the first oxide semiconductor layer are as follows; Ga: 5% or more; In: 25% or less (excluding 0%); Zn: 35 to 65%; and Sn: 8 to 30%.
    • 提供了具有高迁移率,优异的耐应力和良好的湿蚀刻性能的氧化物半导体层的薄膜晶体管。 薄膜晶体管至少包括栅电极,栅极绝缘膜,氧化物半导体层,源 - 漏电极和钝化膜。 氧化物半导体层是包括第一氧化物半导体层(IGZTO)和第二氧化物半导体层(IZTO)的层压体。 第二氧化物半导体层形成在栅极绝缘膜上,第一氧化物半导体层形成在第二氧化物半导体层和钝化膜之间。 各金属元素相对于第一氧化物半导体层中除氧以外的全部金属元素的总量的含量如下: Ga:5%以上; 在:25%以下(不包括0%); Zn:35〜65% 和Sn:8〜30%。
    • 4. 发明申请
    • THIN FILM TRANSISTOR AND DISPLAY DEVICE
    • 薄膜晶体管和显示器件
    • US20150171221A1
    • 2015-06-18
    • US14416927
    • 2013-08-30
    • Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    • Aya MikiShinya MoritaHiroshi GotoToshihiro KugimiyaHiroaki TaoKenta Hirose
    • H01L29/786
    • Provided is a thin film transistor comprising an oxide semiconductor thin film layer and has a threshold voltage that does not change much due to light, a bias stress or the like, thereby exhibiting excellent stress stability. A thin film transistor of the present invention is provided with: a gate electrode; an oxide semiconductor layer that is used as a channel layer; and a gate insulator film that is arranged between the gate electrode and the channel layer. The oxide semiconductor layer is configured of at least one metal element that is selected from the group consisting of In, Ga, Zn and Sn (excluding the cases where the oxide semiconductor layer is constituted of metal elements Sn, and at least one of In and Zn). The hydrogen concentration in the gate insulator film, which is in direct contact with the oxide semiconductor layer, is controlled to 4 atomic % or less.
    • 提供了一种薄膜晶体管,其包括氧化物半导体薄膜层,并且具有由于光,偏压应力等而不会变化太大的阈值电压,从而表现出优异的应力稳定性。 本发明的薄膜晶体管设有:栅电极; 用作沟道层的氧化物半导体层; 以及布置在栅电极和沟道层之间的栅极绝缘膜。 氧化物半导体层由选自In,Ga,Zn和Sn中的至少一种金属元素构成(除了氧化物半导体层由金属元素Sn构成的情况以及In和 Zn)。 与氧化物半导体层直接接触的栅极绝缘膜的氢浓度被控制在4原子%以下。
    • 9. 发明申请
    • THIN FILM TRANSISTOR AND DISPLAY DEVICE
    • 薄膜晶体管和显示器件
    • US20150091000A1
    • 2015-04-02
    • US14387496
    • 2013-05-08
    • Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    • Shinya MoritaAya MikiHiroaki TaoToshihiro Kugimiya
    • H01L27/12H01L29/786
    • H01L27/1225H01L29/78606H01L29/7869H01L29/78693H01L29/78696
    • Provided is an oxide-semiconductor-based thin film transistor having satisfactory switching characteristics and stress resistance. Change in threshold voltage through stress application is suppressed in the thin film transistor. The thin film transistor of excellent stability comprises a substrate and, formed thereon, at least a gate electrode, a gate insulating film, oxide semiconductor layers, a source-drain electrode, and a passivation film for protecting the gate insulating film, and oxide semiconductor layers, wherein the oxide semiconductor layers are laminated layers comprising a second oxide semiconductor layer consisting of In, Zn, Sn, and O and a first oxide semiconductor layer consisting of In, Ga, Zn, and O. The second oxide semiconductor layer is formed on the gate insulating film. The first oxide semiconductor layer is interposed between the second oxide semiconductor layer and the passivation film.
    • 提供了具有令人满意的开关特性和耐应力的氧化物半导体薄膜晶体管。 在薄膜晶体管中抑制了通过应力施加的阈值电压的变化。 具有优异稳定性的薄膜晶体管包括基板,并且在其上形成至少栅电极,栅极绝缘膜,氧化物半导体层,源 - 漏电极和用于保护栅极绝缘膜的钝化膜,以及氧化物半导体 层,其中氧化物半导体层是包括由In,Zn,Sn和O组成的第二氧化物半导体层和由In,Ga,Zn和O组成的第一氧化物半导体层的层叠层。形成第二氧化物半导体层 在栅极绝缘膜上。 第一氧化物半导体层介于第二氧化物半导体层和钝化膜之间。
    • 10. 发明申请
    • THIN FILM TRANSISTOR
    • 薄膜晶体管
    • US20150076488A1
    • 2015-03-19
    • US14391104
    • 2013-06-06
    • KABUSHIKI KAISHA KOBE SEIKO SHO (Kobe Steel,Ltd.)
    • Tomoya KishiKenta HiroseShinya MoritaToshihiro Kugimiya
    • H01L29/786H01L29/26H01L27/12
    • H01L29/7869H01L21/02554H01L21/02565H01L21/02631H01L27/1225H01L29/26
    • Provided is a thin film transistor having an oxide semiconductor layer that has high mobility, excellent stress resistance, and good wet etching property. The thin film transistor comprises at least, a gate electrode, a gate insulating film, an oxide semiconductor layer, source-drain electrode and a passivation film, in this order on a substrate. The oxide semiconductor layer is a laminate comprising a first oxide semiconductor layer (IGZTO) and a second oxide semiconductor layer (IGZO). The second oxide semiconductor layer is formed on the gate insulating film, and the first oxide semiconductor layer is formed between the second oxide semiconductor layer and the passivation film. The contents of respective metal elements relative to the total amount of all the metal elements other than oxygen in the first oxide semiconductor layer are as follows; In: 25% or less (excluding 0%); Ga: 5% or more; Zn: 30.0 to 60.0%; and Sn: 8 to 30%.
    • 提供了具有高迁移率,优异的耐应力和良好的湿蚀刻性能的氧化物半导体层的薄膜晶体管。 薄膜晶体管至少包括栅电极,栅极绝缘膜,氧化物半导体层,源 - 漏电极和钝化膜。 氧化物半导体层是包括第一氧化物半导体层(IGZTO)和第二氧化物半导体层(IGZO)的层压体。 第二氧化物半导体层形成在栅极绝缘膜上,第一氧化物半导体层形成在第二氧化物半导体层和钝化膜之间。 各金属元素相对于第一氧化物半导体层中除氧以外的全部金属元素的总量的含量如下: 在:25%以下(不包括0%); Ga:5%以上; Zn:30.0〜60.0% 和Sn:8〜30%。