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1. 发明申请

US20060134448A1 Plated structures or components 失效
标题翻译：电镀结构或部件
公开(公告)号：US20060134448A1
公开(公告)日：2006-06-22
申请号：US11014357
申请日：2004-12-16
申请人： Jurgen Daniel , Brent Krusor , Alexandra Rodkin , John Fitch
发明人： Jurgen Daniel , Brent Krusor , Alexandra Rodkin , John Fitch
IPC分类号： B32B3/10 , B21D28/00
CPC分类号： B81C1/00111 , B81B2201/0257 , B81B2201/058 , C23C18/1605 , C25D5/022 , Y10S428/935 , Y10T428/12361 , Y10T428/12375 , Y10T428/12382 , Y10T428/12389
摘要： Various structures or components can include plated surfaces or other parts. For example, an article can include a base and a plated part with a limit artifact that results from plating adjacent a non-plateable surface; the limit artifact can be disposed away from the base. Exemplary limit artifacts include lack of protrusions, smooth upper surfaces, and curved surfaces, where a curved surface can transition between a smooth upper surface and an irregular side surface. Exemplary plated structures can be tube-shaped or cup-shaped, with an opening at a top end and, around the opening, a lip with a limit artifact. Wall-like structures can similarly have limit artifacts at their top end. If plating on a mold's side surface, the non-plateable surface can be the lower surface of an overhanging polymer disk or structure positioned on the mold. Plated tubes and wall-like structures can be employed in microfluidic structures.
摘要翻译：各种结构或部件可以包括电镀表面或其它部件。例如，制品可以包括基部和具有极限伪影的电镀部分，其由邻近不可平板表面的电镀产生; 极限伪影可以远离基座放置。示例性极限瑕疵包括缺少突起，平滑的上表面和弯曲表面，其中弯曲表面可以在光滑的上表面和不规则的侧表面之间转变。示例性的镀覆结构可以是管状或杯形，在顶端具有开口，并且在开口周围具有极限伪影的唇部。壁状结构在其顶端可以类似地具有极限伪影。如果在模具的侧表面上进行电镀，则不平板表面可以是位于模具上的突出聚合物盘或结构的下表面。电镀管和壁状结构可用于微流体结构。

2. 发明授权

US07288327B2 Plated structures or components 失效
标题翻译：电镀结构或部件
公开(公告)号：US07288327B2
公开(公告)日：2007-10-30
申请号：US11014357
申请日：2004-12-16
申请人： Jurgen Daniel , Brent S. Krusor , Alexandra Rodkin , John S Fitch
发明人： Jurgen Daniel , Brent S. Krusor , Alexandra Rodkin , John S Fitch
IPC分类号： B32B3/02 , B32B3/30 , C25D1/08 , C25D5/02 , C25D5/16
CPC分类号： B81C1/00111 , B81B2201/0257 , B81B2201/058 , C23C18/1605 , C25D5/022 , Y10S428/935 , Y10T428/12361 , Y10T428/12375 , Y10T428/12382 , Y10T428/12389
摘要： Various structures or components can include plated surfaces or other parts. For example, an article can include a base and a plated part with a limit artifact that results from plating adjacent a non-plateable surface; the limit artifact can be disposed away from the base. Exemplary limit artifacts include lack of protrusions, smooth upper surfaces, and curved surfaces, where a curved surface can transition between a smooth upper surface and an irregular side surface. Exemplary plated structures can be tube-shaped or cup-shaped, with an opening at a top end and, around the opening, a lip with a limit artifact. Wall-like structures can similarly have limit artifacts at their top end. If plating on a mold's side surface, the non-plateable surface can be the lower surface of an overhanging polymer disk or structure positioned on the mold. Plated tubes and wall-like structures can be employed in microfluidic structures.
摘要翻译：各种结构或部件可以包括电镀表面或其它部件。例如，制品可以包括基部和具有极限伪影的电镀部分，其由邻近不可平板表面的电镀产生; 极限伪影可以远离基座放置。示例性极限瑕疵包括缺少突起，平滑的上表面和弯曲表面，其中弯曲表面可以在光滑的上表面和不规则的侧表面之间转变。示例性的镀覆结构可以是管状或杯形，在顶端具有开口，并且在开口周围具有极限伪影的唇部。壁状结构在其顶端可以类似地具有极限伪影。如果在模具的侧表面上进行电镀，则不平板表面可以是位于模具上的突出聚合物盘或结构的下表面。电镀管和壁状结构可用于微流体结构。

3. 发明授权

US06875553B2 Method of casting photoresist onto substrates 失效
标题翻译：将光致抗蚀剂浇铸到基材上的方法
公开(公告)号：US06875553B2
公开(公告)日：2005-04-05
申请号：US10323142
申请日：2002-12-18
申请人： Jurgen H. Daniel , Alexandra Rodkin
发明人： Jurgen H. Daniel , Alexandra Rodkin
IPC分类号： B05D3/00 , B05D3/12 , G03F7/004 , G03F7/16
CPC分类号： G03F7/004 , G03F7/16 , G03F7/162 , G03F7/168
摘要： A method for casting a thick layer of photoresist material onto a substrate. The method including the steps of pressing the photoresist against the substrate material using a presser plate and limiting the travel of the presser plate by using spaces which can be positioned on the substrate material. The process further including the step of holding the presser plate in a pressed position while the photoresist is at least partially cured or solidified.
摘要翻译：将光致抗蚀剂材料的厚层浇铸到基底上的方法。该方法包括以下步骤：使用压板将抗蚀剂压在衬底材料上，并通过使用可位于衬底材料上的空间来限制压板的移动。该方法还包括在压光板至少部分固化或固化的同时将压板保持在按压位置的步骤。

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