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1. 发明申请

US20120138599A1 SEMICONDUCTOR SUBSTRATE HEAT TREATMENT APPARATUS 审中-公开
标题翻译：半导体基板热处理设备
公开(公告)号：US20120138599A1
公开(公告)日：2012-06-07
申请号：US13383722
申请日：2010-09-30
申请人： Junya Miyata , Naoki Uchida
发明人： Junya Miyata , Naoki Uchida
IPC分类号： H05B6/10
CPC分类号： H01L21/67109
摘要： A semiconductor substrate heat treatment apparatus includes a boat formed by stacking, in a vertical direction, a plurality of susceptors to be treated placing wafers thereon individually, and auxiliary susceptors disposed in a manner to sandwich the plurality of susceptors to be treated therebetween in the vertical direction; an induction heating coil disposed on an outer circumferential side of the boat and configured to generate an alternating magnetic flux in a direction parallel to planes of the plurality of susceptors to be treated on which the wafers are individually placed; and a power supply configured to supply power to the induction heating coil.
摘要翻译：一种半导体基板热处理装置，其特征在于，在垂直方向上堆叠多个要被处理的基座单独地放置晶片而形成的舟状物，以及将以待处理的多个基座夹在其间的方式配置的辅助基座方向; 感应加热线圈，其设置在所述船的外周侧，并且被配置为在平行于待处理的所述多个待处理基座的平面的方向上产生交变磁通; 以及电源，被配置为向感应加热线圈供电。

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