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    • 8. 发明授权
    • Airtight sealing method and airtight sealing apparatus for semiconductor laser element
    • 半导体激光元件的密封密封方法和密封装置
    • US06396023B1
    • 2002-05-28
    • US09427116
    • 1999-10-26
    • Takeshi Aikiyo
    • Takeshi Aikiyo
    • B23K1100
    • B23K11/002H01S5/0222H01S5/02284
    • The present invention provides a method for hermetically sealing a semiconductor laser element, by which the cleanness of a package can be maintained extremely satisfactorily in a stabilized state, in order to prevent organic substances from being adhered to the end faces of high output semiconductor laser elements due to photochemical actions. The method comprises the first step of introducing oxygen into a chamber of a hermetical-sealing apparatus and irradiating ultraviolet rays onto an unsealed package having a semiconductor laser element mounted, in the chamber, and the second step of purging the chamber with an inert gas and hermetically sealing an unsealed package in the inert gas atmosphere without being exposed to the outer atmosphere.
    • 本发明提供了一种用于密封半导体激光元件的方法,通过该方法可以在稳定状态下非常令人满意地保持封装的清洁度,以防止有机物质粘附到高输出半导体激光元件的端面 由于光化学作用。 该方法包括将氧气引入密封装置的室中并将紫外线照射到在腔室中安装有半导体激光元件的未密封封装的第一步骤,以及用惰性气体吹扫室的第二步骤, 在惰性气体气氛中气密地密封未密封的包装,而不暴露于外部大气。