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    • 2. 发明授权
    • Methods of manufacturing phase shift masks having etched substrate shifters with sidewalls rounded at top and bottom corners
    • 制造具有蚀刻的衬底移位器的相移掩模的方法,其侧壁在顶角和底角处被圆化
    • US07056624B2
    • 2006-06-06
    • US10399203
    • 2002-02-15
    • Haruo Kokubo
    • Haruo Kokubo
    • G03F1/08G03F7/18C23F1/04C03C15/00
    • G03F1/30
    • Methods of manufacturing a single sided engraving phase shift mask that includes a shifter part and a non-shifter part mutually adjacent on a substrate, and a shading layer pattern formed with a shading film and wherein a side wall part of a dug-down part has round, crooked portions at top and bottom corners of the sidewall part. The method includes forming a resist pattern having a selective opening at the shifter part, forming a dug-down part corresponding to the shifter part by using the resist pattern, wet etching the whole surface at the dug-down part forming side of the substrate, forming a shading film on the substrate, forming a resist pattern on the shading film, and forming a shading pattern having prescribed openings at the shifter part and non-shifter part.
    • 制造单面雕刻相移掩模的方法,其包括在基板上相互相邻的移动部分和非移动部分,以及形成有遮光膜的遮光层图案,并且其中所述下陷部分的侧壁部分具有 在侧壁部分的顶部和底部角部处的圆形弯曲部分。 该方法包括在移位部分形成具有选择性开口的抗蚀剂图案,通过使用抗蚀剂图案形成与移位部分对应的下陷部分,湿法蚀刻在基板的下陷部形成侧的整个表面, 在基板上形成遮光膜,在遮光膜上形成抗蚀剂图案,并在移位部和非移动部分形成具有规定开口的遮光图案。
    • 3. 发明授权
    • Phase-shift photomask manufacturing method and phase-shift photomask
    • 相移光掩模制造方法和相移光掩模
    • US06627359B2
    • 2003-09-30
    • US09859552
    • 2001-05-17
    • Haruo Kokubo
    • Haruo Kokubo
    • G03F900
    • G03F1/30
    • In a method of manufacturing a phase-shift photomask comprising the steps of preparing a substrate transparent to an exposure light having a wavelength &lgr; and having a refraction factor n, forming, on the substrate, a pattern including a light-blocking portion blocking the light entering and a light transmission portion transmitting light, and etching the substrate on the transmission portion including a plurality of transmission sections so as to provide adjacent transmission sections, one having a recessed depth d1 and the other one having a recessed depth d2 so as to satisfy an equation of (d1−d2)=&lgr;/2(n−1), the etching step comprises a first etching process of a selective dry-etching to the light transmission section of the substrate having the depth d1 so as to provide a predetermined depth D1 after the formation of the light-blocking portion, a second etching process of a wet-etching process to the transmission section having the depth d1 so as to provide a depth of &lgr;/2(n−1), and a third etching process of a wet-etching to all the light transmission section having the depth d1 and the depth d2 so as to satisfy an equation of (d1−d2)=&lgr;/2(n−1).
    • 在制造相移光掩模的方法中,包括以下步骤:制备对具有波长lambd并且具有折射系数n的曝光光透明的基板,在基板上形成包括遮挡光的遮光部分的图案 进入和透光部分,并且在包括多个透射部分的透射部分上蚀刻基底,以便提供相邻的透射部分,一个具有凹陷深度d1,另一个具有凹陷深度d2以满足 (d1-d2)= lambd / 2(n-1)的等式,蚀刻步骤包括对具有深度d1的基板的透光部进行选择性干法蚀刻的第一蚀刻工艺,以提供预定的 在形成遮光部分之后的深度D1,对具有深度d1的透射部分进行湿法蚀刻处理的第二蚀刻工艺,以提供lambd / 2的深度 (n-1),以及对具有深度d1和深度d2的所有光透射部分进行湿蚀刻的第三蚀刻处理,以满足等式(d1-d2)= lambd / 2(n-1) )。